Infineon Technologies S29JL032J70TFI423
- Part No.:
- S29JL032J70TFI423
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29JL032J70TFI423.pdf
- Description:
- IC FLASH 32MBIT PARALLEL 48TSOP
- Quantity:
- Payment:

- Shipping:

Inventory:1,905
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S29JL032J70TFI423 from Infineon Technologies (formerly Cypress) is a 32-Mb, 3.0 V-only simultaneous read/write flash memory organized as 4M × 8-bit or 2M × 16-bit. It features zero-latency bank interleaving, 70 ns access time, 4-bank architecture, secured silicon region (256 B), and JEDEC CFI compliance. Used in industrial control firmware storage where concurrent code execution and background update are required.
For engineers reviewing the S29JL032J70TFI423 datasheet, S29JL032J70TFI423 pinout, S29JL032J70TFI423 application, or S29JL032J70TFI423 equivalent, key selection criteria include simultaneous read/write latency, boot sector configuration flexibility, hardware write protection (WP#/ACC), RY/BY# status signaling, and FBGA/TSOP package compatibility with legacy PCB footprints.
Technical Context
The S29JL032J70TFI423 implements a 4-bank flash architecture enabling true concurrent operations: one bank executes erase or program while another serves active read requests without pipeline stall. Each bank supports independent sector erase and byte/word programming via standard JEDEC command set.
It integrates hardware-level data integrity features including automatic sleep mode (200 nA), low-VCC write inhibition, erase suspend/resume, and toggle-bit (DQ6/DQ2) + polling (DQ7) status reporting. The Secured Silicon Region provides factory-locked 16-byte ESN and customer-one-time-programmable 256-byte space.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 32 Mb (4,194,304 × 8-bit or 2,097,152 × 16-bit); enables full firmware image storage for mid-tier microcontrollers. |
| Access Time | 70 ns max (tACC); meets real-time interrupt response timing in industrial PLCs and motor drives. |
| Banks | 4 independent banks; allows background firmware update while executing application code from alternate bank. |
| Power Modes | 200 nA standby/automatic sleep; reduces system quiescent current in battery-backed or energy-constrained edge nodes. |
| Erase Endurance | 100,000 cycles per sector; supports field firmware updates over 10+ years in deployed equipment. |
| Data Retention | 20 years typical at 125°C; qualified for automotive under-hood and industrial high-temp environments. |
| Interface Standard | JEDEC 42.4 CFI-compliant; ensures bootloader compatibility across toolchains and flash programmers. |
Pinout & Package
Package: 48-ball Fine-pitch BGA (VBK048 footprint). Ball pitch: 0.8 mm. Body size: 8.0 mm × 10.0 mm × 1.2 mm. RoHS-compliant, lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A20 | Address Inputs | 21-bit address bus supporting full 4M×8 or 2M×16 addressing; A-1 used only in word mode for DQ15/A-1 multiplexing. |
| DQ0–DQ15 | Data I/O (16-bit) | Bidirectional data bus; operates in byte (DQ0–DQ7) or word (DQ0–DQ15) mode controlled by BYTE#. |
| CE#, OE#, WE# | Chip/Output/Write Enable | Standard asynchronous control signals; enable bus contention avoidance and multi-device memory mapping. |
| RY/BY# | Ready/Busy Output | Active-low open-drain status signal indicating completion of program/erase; eliminates need for software polling loops. |
| RESET# | Hardware Reset Input | Asynchronous reset to read mode; critical for recovery after power brownout or watchdog timeout events. |
| WP#/ACC | Write Protect / Acceleration | Dual-function pin: WP# protects boot sectors unconditionally; ACC enables 6 µs/word accelerated programming. |
| BYTE# | Byte/Word Mode Select | Configures data bus width; determines whether DQ0–DQ7 (byte) or DQ0–DQ15 (word) are active during transfers. |
Key Features
| Feature | Design Value |
|---|---|
| Simultaneous Read/Write | Zero-latency bank interleaving enables real-time firmware update without halting application execution. |
| Secured Silicon Region | 256-byte OTP sector with factory-locked 16-byte ESN; provides tamper-resistant device identity and secure boot key storage. |
| Erase Suspend/Resume | Pause ongoing sector erase to service urgent read/write requests elsewhere; enables deterministic latency in safety-critical systems. |
| Hardware Write Protection | WP# pin permanently disables programming/erasing of top/bottom boot sectors regardless of software lock state. |
| Automatic Sleep Mode | Enters ultra-low-power state (200 nA) after address stability timeout; eliminates external power management IC in portable designs. |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
|
Use Scenario: Storing and updating ladder logic firmware in programmable logic controllers with no downtime. IC Role / Device Role / Timing Role: Non-volatile program storage with simultaneous read during background reflash; 70 ns access sustains scan cycle timing. Use Value: Enables over-the-air firmware patches without stopping machine operation-critical for 24/7 production lines. |
Use Scenario: Holding boot code and sensor calibration data for radar/EPS ECUs requiring ASIL-B compliance. IC Role / Device Role / Timing Role: Secure boot memory with Secured Silicon Region storing cryptographic keys; WP# prevents accidental corruption of boot sectors. Use Value: Meets ISO 26262 requirements for fault-tolerant startup and authenticated firmware loading. |
| Medical Imaging System BIOS | Smart Grid RTU Configuration |
|
Use Scenario: Storing diagnostic firmware and calibration tables in MRI/CT scanner subsystems with strict thermal limits. IC Role / Device Role / Timing Role: High-reliability flash with 20-year data retention at 85°C; automatic sleep mode minimizes self-heating during idle periods. Use Value: Eliminates periodic recalibration due to data drift-reducing service visits and improving uptime. |
Use Scenario: Storing communication protocol stacks and grid event logs in remote terminal units deployed in substations. IC Role / Device Role / Timing Role: 4-bank architecture allows logging new grid events into one bank while reading historical data from another. Use Value: Guarantees continuous data capture during firmware upgrades-essential for IEEE 1646 compliance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL032N70TFI010 | 45 nm process, 70 ns access, same 4-bank architecture but lacks Secured Silicon Region and erase suspend. | Lower cost for non-secure, non-concurrent-update use cases; not suitable for OTA-capable devices. | Select when security and background erase are unnecessary and bill-of-materials cost is primary. |
| MX29GL320EBTI-70G | 32 Mb, 70 ns, 3 V, but uses 2-bank architecture and lacks WP#/ACC dual-function pin. | Requires external logic for boot sector protection; no hardware-accelerated programming. | Choose only if existing design uses MXIC's command set and does not require simultaneous bank operations. |
Compared with S29GL032N70TFI010 and MX29GL320EBTI-70G, the S29JL032J70TFI423 uniquely delivers zero-latency concurrent access, factory-locked ESN, and integrated WP#/ACC functionality-making it the only option for secure, real-time firmware update in industrial and automotive edge nodes.
Availability
S29JL032J70TFI423 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system BIOS requiring stable component supply across extended product lifecycles.
Supply support for S29JL032J70TFI423 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive MCUs, and secure memory solutions.
The S29JL032J belongs to Infineon's Legacy Flash Memory portfolio, designed specifically for industrial and automotive applications demanding high reliability, long data retention, and in-system programmability without external voltage pumps.
FAQ
What is the difference between S29JL032J70TFI423 and S29JL032J60TFI423?
The S29JL032J70TFI423 has a maximum access time of 70 ns, while the S29JL032J60TFI423 guarantees 60 ns. Both share identical pinout, command set, and feature set. The 70 ns variant targets cost-sensitive applications where slightly relaxed timing margins are acceptable, such as non-real-time industrial HMIs or legacy controller upgrades.
Does S29JL032J70TFI423 support both 8-bit and 16-bit data bus configurations?
Yes. The device supports byte mode (DQ0–DQ7) and word mode (DQ0–DQ15) via the BYTE# pin. In word mode, A-1 appears on DQ15 during address latching. This dual-width capability allows seamless integration with 8-bit microcontrollers (e.g., legacy 8051-based systems) and 16-bit processors (e.g., TI C2000 DSPs) without redesigning the memory interface.
How is the Secured Silicon Region programmed and locked?
The Secured Silicon Region is accessed using the Enter Secured Silicon Region command sequence (0x555=0xAA, 0x2AA=0x55, 0x555=0xB0). Data is written like any flash sector. Locking is performed with the Secured Silicon Region Lock command (0x555=0xAA, 0x2AA=0x55, 0x555=0xB8), which permanently sets the DQ6 indicator bit and disables further writes. Once locked, the region is read-only and factory-verifiable.
Can S29JL032J70TFI423 operate reliably at 2.7 V?
Yes. The device is specified for VCC = 2.7–3.6 V in the 70 ns speed grade. At 2.7 V, all AC and DC parameters-including 70 ns access time, 100K erase cycles, and 200 nA standby current-remain fully guaranteed per datasheet Section 13 (Operating Ranges) and Section 14 (DC Characteristics). This enables direct replacement in brownout-prone battery-powered systems.
S29JL032J70TFI423 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- JL-J
- Package/Case:
- 48-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 32Mbit
- Memory Organization:
- 4M x 8, 2M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 70ns
- Access Time:
- 70 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TSOP
S29JL032J70TFI423 FAQ
1.How can I place an order for S29JL032J70TFI423 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29JL032J70TFI423 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29JL032J70TFI423 reliable?
The price and inventory of S29JL032J70TFI423 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29JL032J70TFI423 is usually 5 days.
3.What payment methods are accepted for S29JL032J70TFI423?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29JL032J70TFI423 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29JL032J70TFI423?
S29JL032J70TFI423 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29JL032J70TFI423 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29JL032J70TFI423?
For technical support, including S29JL032J70TFI423 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29JL032J70TFI423 requirements.
6.How does Aetrix verify that S29JL032J70TFI423 is sourced from the original manufacturer or authorized distributors?
All S29JL032J70TFI423 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29JL032J70TFI423 meets industry standards.
7.What is the process for return or replacement of S29JL032J70TFI423?
All S29JL032J70TFI423 units undergo pre-shipment inspection (PSI). If there is an issue with S29JL032J70TFI423, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29JL032J70TFI423 part is unused and in its original packaging.
Return procedure for S29JL032J70TFI423:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29JL032J70TFI423 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

