Infineon Technologies S29JL064J70TFA003
- Part No.:
- S29JL064J70TFA003
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29JL064J70TFA003.pdf
- Description:
- IC FLASH 64MBIT CFI 48TSOP
- Quantity:
- Payment:

- Shipping:

Inventory:1,752
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S29JL064J70TFA003 from Infineon Technologies (formerly Cypress) is a 64-Mb simultaneous read/write flash memory organized as 4M × 16-bit or 8M × 8-bit, operating at 3.0 V only, with 70 ns access time, 4-bank architecture enabling zero-latency concurrent operations, and integrated Secured Silicon Region for factory- or customer-lockable 256-byte sector - used in boot code storage and firmware update systems requiring in-system reprogrammability.
For engineers reviewing the S29JL064J70TFA003 datasheet, S29JL064J70TFA003 pinout, S29JL064J70TFA003 application, or S29JL064J70TFA003 equivalent, key selection criteria include simultaneous bank operation capability, JEDEC CFI compliance, hardware write protection via WP#/ACC, RY/BY# status signaling, and boot-sector flexibility for embedded bootloader implementations.
Technical Context
The device implements a four-bank flash architecture (two 8 Mb + two 24 Mb banks), allowing read from any non-erasing/programming bank while executing erase or program in another - enabling true background operations without latency penalty. Sector sizes vary per bank: Bank 1 and Bank 4 each contain eight 8 KB and fifteen 64 KB sectors; Banks 2 and 3 contain forty-eight 64 KB sectors each.
It supports Common Flash Interface (CFI) for standardized identification and command execution, and features Erase Suspend/Resume to pause erase cycles for reads or writes to unselected sectors. The Secured Silicon Region provides 256 bytes with factory-lockable ESN or customer-lockable one-time programmable space, verified via DQ6 autoselect bit.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 64 Mb (4,194,304 × 16-bit or 8,388,608 × 8-bit) |
| Access Time | 70 ns max - determines minimum clock cycle for reliable read timing in high-speed microcontroller interfaces |
| Supply Voltage | 2.7–3.6 V single VCC - eliminates need for dual-voltage rails in 3.3 V system designs |
| Programming Time | 7 µs/word typical with acceleration - enables fast field firmware patching without external voltage boost |
| Endurance | 1 million program/erase cycles per sector - supports long-life industrial logging and configuration storage |
| Data Retention | 20 years typical - ensures firmware integrity across product lifecycle without refresh |
| Power Consumption | 200 nA standby - allows battery-backed retention in always-on edge nodes |
Pinout & Package
Package: 48-ball Fine-pitch BGA (VBK048 footprint) - compact, thermally efficient, suitable for space-constrained embedded PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A21–A0 | Address Inputs | 22-bit address bus supporting full 4M-word addressing in x16 mode |
| DQ15–DQ0 | Data I/O (x16) | 16-bit bidirectional data path; DQ15/A-1 serves as LSB address in byte mode |
| CE#, OE#, WE# | Chip/Output/Write Enable | Standard asynchronous control signals - prevent bus contention and enable multi-device sharing |
| RY/BY# | Ready/Busy Output | Active-low hardware status indicator - eliminates polling overhead during erase/program |
| WP#/ACC | Write Protect / Acceleration | Dual-function pin: hardware lock for boot sectors 0/1/140/141; enables faster programming when asserted |
| RESET# | Hardware Reset | Forces device into read mode - critical for recovery after power-up or error conditions |
| BYTE# | Bus Width Select | Active-low input configuring interface as 8-bit (DQ7–DQ0) or 16-bit (DQ15–DQ0) |
Key Features
| Feature | Design Value |
|---|---|
| Simultaneous Read/Write | Zero-latency concurrent access across four independent banks - eliminates CPU stall during firmware updates |
| Flexible Bank Grouping | Software-defined bank partitions allow custom memory mapping for RTOS partitioning or dual-application storage |
| Boot Sector Architecture | Top and bottom boot sectors with independent protection - enables secure bootloader + application separation |
| Secured Silicon Region | 256-byte OTP sector with factory ESN or customer lock - supports device authentication and anti-cloning |
| Erase Suspend/Resume | Pause erase to service real-time read/write requests - essential for deterministic response in safety-critical firmware |
Applications
| Industrial PLC Firmware Storage | Automotive Instrument Cluster Boot Memory |
|---|---|
Use Scenario: Storing and updating ladder logic firmware in programmable logic controllers with runtime diagnostics. IC Role / Device Role / Timing Role: Nonvolatile boot and application code storage with in-system reprogrammability and hardware sector protection. Use Value: Enables field firmware upgrades without removing hardware; zero-latency read during background erase prevents scan cycle interruption. | Use Scenario: Hosting boot code and display firmware in digital instrument clusters requiring ASIL-B compliance. IC Role / Device Role / Timing Role: Secure boot memory with top/bottom boot sectors and Secured Silicon Region for ESN binding. Use Value: Prevents unauthorized firmware replacement via hardware WP# protection and factory-locked serial number traceability. |
| Medical Device Configuration Storage | Networking Equipment BIOS/UEFI Storage |
Use Scenario: Retaining calibration data, user preferences, and regulatory audit logs in Class II medical devices. IC Role / Device Role / Timing Role: High-reliability parameter storage with 20-year data retention and 1M-cycle endurance. Use Value: Meets IEC 62304 data persistence requirements; automatic sleep mode reduces standby current to 200 nA for battery backup. | Use Scenario: Storing UEFI firmware and platform keys in enterprise switches and routers with frequent security patches. IC Role / Device Role / Timing Role: Dual-bank flash supporting atomic firmware updates via A/B partitioning. Use Value: Concurrent read from active bank while writing new image to inactive bank ensures zero-downtime updates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29JL064J60TFI000 | 60 ns access time; same 48-ball FBGA package and feature set | Higher performance read path required for tighter timing budgets in real-time control loops | Select when system clock timing margins demand sub-70 ns access without changing layout or firmware |
| S29JL064J70TFI000 | Same 70 ns speed grade but TSOP-48 package instead of FBGA | Legacy board redesign where BGA rework is cost-prohibitive and thermal profile favors TSOP | Choose for through-hole or wave-solder compatibility and simplified prototyping |
Compared with S29JL064J60TFI000 and S29JL064J70TFI000, the S29JL064J70TFA003 offers identical electrical and functional behavior but is specifically qualified for automotive-grade temperature range (–40°C to +105°C) and shipped in tape-and-reel packaging for automated SMT lines - making it optimal for production-scale automotive and industrial deployments.
Availability
S29JL064J70TFA003 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive instrument cluster boot memory, and medical device configuration storage requiring stable component supply, long-term lifecycle support, and automotive-grade qualification.
Supply support for S29JL064J70TFA003 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, sensor, and memory solutions for automotive, industrial, and IoT applications.
The S29JL064J series belongs to Infineon's legacy NOR flash portfolio originally developed by Cypress, designed for high-reliability embedded systems requiring simultaneous read/write, secure boot, and long data retention - especially where firmware integrity and in-field upgradability are critical.
FAQ
What is the difference between S29JL064J70TFA003 and S29JL064J70TFI000?
The S29JL064J70TFA003 and S29JL064J70TFI000 share identical speed (70 ns), voltage (3.0 V), and functional specifications, but differ in qualification grade and packaging: 'A' suffix denotes automotive-grade temperature range (–40°C to +105°C) and tape-and-reel delivery, while 'I' suffix indicates industrial grade (–40°C to +85°C) and tray packaging - both use the same 48-ball FBGA (VBK048) footprint.
Does S29JL064J70TFA003 support byte-mode operation?
Yes - the BYTE# pin configures the device for 8-bit (DQ7–DQ0) or 16-bit (DQ15–DQ0) operation. In byte mode, DQ15/A-1 functions as address bit A-1, and only DQ7–DQ0 are active. This enables compatibility with 8-bit microcontrollers without external data bus multiplexing or glue logic.
How is hardware write protection implemented on this device?
Hardware write protection is controlled by the WP#/ACC pin: when asserted low, it permanently protects sectors 0, 1, 140, and 141 regardless of software sector lock status. This is independent of CFI-based software protection and remains active even during power cycling - ensuring bootloader sectors cannot be overwritten by errant firmware.
Can the Secured Silicon Region be used for customer data storage before locking?
Yes - prior to customer lock, the 256-byte Secured Silicon Region operates as a standard flash sector: readable and writable like any other sector. Once locked via the one-time programmable command, all bits become read-only and the DQ6 indicator bit is permanently set to 1, preventing further modification or substitution with factory-locked parts.
S29JL064J70TFA003 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- JL-J
- Package/Case:
- 48-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR (SLC)
- Memory Size:
- 64Mbit
- Memory Organization:
- 8M x 8, 4M x 16
- Memory Interface:
- CFI
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 70ns, 80µs
- Access Time:
- 70 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TSOP I
S29JL064J70TFA003 FAQ
1.How can I place an order for S29JL064J70TFA003 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29JL064J70TFA003 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29JL064J70TFA003 reliable?
The price and inventory of S29JL064J70TFA003 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29JL064J70TFA003 is usually 5 days.
3.What payment methods are accepted for S29JL064J70TFA003?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29JL064J70TFA003 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29JL064J70TFA003?
S29JL064J70TFA003 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29JL064J70TFA003 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29JL064J70TFA003?
For technical support, including S29JL064J70TFA003 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29JL064J70TFA003 requirements.
6.How does Aetrix verify that S29JL064J70TFA003 is sourced from the original manufacturer or authorized distributors?
All S29JL064J70TFA003 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29JL064J70TFA003 meets industry standards.
7.What is the process for return or replacement of S29JL064J70TFA003?
All S29JL064J70TFA003 units undergo pre-shipment inspection (PSI). If there is an issue with S29JL064J70TFA003, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29JL064J70TFA003 part is unused and in its original packaging.
Return procedure for S29JL064J70TFA003:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29JL064J70TFA003 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…
Electronic devices and circuits guide covering passive components, semiconductors, analog and digital circuits, circuit theory, practical calculations, troubleshooting, datasheet selection, and learnin…

