Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29PL032J70BFI072

Name: S29PL032J70BFI072
Brand: Infineon Technologies
SKU: S29PL032J70BFI072
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: S29PL032J70BFI072

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 48-VFBGA

Datasheet:: S29PL032J70BFI072.pdf

Description:: IC FLASH 32MBIT PARALLEL 48FBGA

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:3,839

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

S29PL032J70BFI072 from Infineon Technologies (formerly Cypress) is a 32-Mbit (2 M × 16-bit), 3.0 V-only Page Mode Flash memory with Simultaneous Read/Write capability across four independent banks, Enhanced VersatileI/O™ supporting 3 V I/O, and persistent/password sector protection. It delivers 55 ns random access time, 20 ns page access time, and operates across 2.7–3.6 V for embedded boot code storage in industrial controllers and automotive ECUs.

For engineers reviewing the S29PL032J70BFI072 datasheet, S29PL032J70BFI072 pinout, S29PL032J70BFI072 application, or S29PL032J70BFI072 equivalent, key selection criteria include bank-level concurrent read/write operation, 48-ball FBGA (VBK048) package compatibility, 1 million erase/program cycles per sector, 20-year data retention, and CFI-compliant host reconfiguration support.

Technical Context

This device implements FlexBank Architecture with four physically isolated banks (A–D), enabling zero-latency switching between read and write operations-e.g., reading from Bank A while erasing Bank C. Each bank supports independent command execution, and all banks share a unified 16-bit data bus (DQ15–DQ0) and common control interface.

Enhanced VersatileI/O™ fixes I/O voltage tolerance and output drive strength to the VIO pin level (3 V for PL032J), decoupling I/O signaling from core VCC. Sector protection combines persistent locking (PPB), password-secured locking (64-bit user-defined), and hardware WP#/ACC-based write acceleration and top/bottom boot block protection.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Density	32 Mbit (2 Mwords × 16-bit wide), organized as 4 banks with asymmetric sector layout
Access Time	55 ns random access; 20 ns page access - enables fast boot code fetch from internal cache lines
Voltage Range	2.7–3.6 V single supply - supports battery-backed and wide-input industrial power rails
Endurance	1 million program/erase cycles per sector - suitable for firmware update partitions in field-deployed devices
Data Retention	20 years typical at 125 °C - validated for automotive under-hood and industrial high-temp environments
Package	8.15 mm × 6.15 mm, 48-ball Fine-pitch BGA (VBK048) - compatible with standard SMT assembly and thermal pad reflow profiles
I/O Voltage	3 V VersatileI/O - ensures signal integrity with 3.3 V microcontrollers without level shifters

Pinout & Package

Package: 48-ball Fine-pitch BGA (VBK048), 8.15 mm × 6.15 mm, 0.5 mm pitch, bottom thermal pad.

Pin/Terminal	Circuit Role	Design Meaning
A0–A19	Address Inputs	20-bit address bus for 2 Mword addressing; A0 selects LSB of 16-bit word
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports byte/word writes and CFI query reads
CE#, OE#, WE#	Chip/Output/Write Enable	Standard asynchronous control signals; CE# enables device, OE# gates output drivers, WE# latches write data
RY/BY#	Ready/Busy Output	Open-drain status indicator - low during active program/erase, high when ready for next command
RESET#	Hardware Reset Input	Asynchronous active-low reset that forces device into reading array mode and clears internal state machine
WP#/ACC	Write Protect/Acceleration	Three-state input: VIL = lock boot sectors, VIH = unlock, VHH = enable accelerated programming (12 V not required)
VIO	I/O Voltage Reference	Defines I/O logic levels and drive strength; fixed at 3 V for PL032J - eliminates external level translation

Key Features

Feature	Design Value
Simultaneous Read/Write	Two concurrent operations across separate banks - e.g., execute sector erase in Bank B while fetching code from Bank A with zero latency
FlexBank Architecture	Four independent banks (A–D) with asymmetric sector sizes - enables partitioning of boot, config, and application firmware in one device
Password Sector Protection	64-bit user-defined password locks/unlocks sector groups - prevents unauthorized firmware modification in certified safety-critical systems
CFI Compliance	JEDEC JESD68-compliant interface - allows runtime detection of density, timing, and protection features by host bootloader software
Erase/Program Suspend	Pause ongoing erase or program to service urgent read requests - maintains real-time responsiveness in interrupt-driven firmware

Applications

Industrial PLC Firmware Storage

Automotive ECU Boot Memory

Use Scenario: Storing and updating ladder logic firmware in programmable logic controllers operating in harsh factory environments with wide temperature swings and EMI.

IC Role / Device Role / Timing Role: Non-volatile boot and application code storage with in-system reprogrammability and hardware write protection against spurious writes during brown-out events.

Use Value: Persistent sector protection prevents corruption of critical startup routines; 20-year retention ensures 15+ year product lifecycle without refresh.

Use Scenario: Holding boot code and calibration data in engine control units requiring AEC-Q100 compliance and secure over-the-air (OTA) firmware updates.

IC Role / Device Role / Timing Role: Secure, bank-isolated flash memory enabling concurrent OTA download (Bank C) and real-time engine control execution (Bank A).

Use Value: Password sector protection blocks unauthorized access to calibration maps; simultaneous read/write cuts update time by >40% vs. legacy single-bank flash.

Medical Diagnostic Imaging Boot Loader

Network Equipment Configuration Storage

Use Scenario: Hosting verified boot loader and FPGA configuration bitstreams in portable ultrasound and MRI subsystems requiring FDA-grade data integrity.

IC Role / Device Role / Timing Role: Trusted boot source with Secured Silicon Sector (128-word region) storing cryptographic keys and signature verification code.

Use Value: Factory-locked 64-word silicon sector prevents tampering with root-of-trust assets; CFI support simplifies qualification across multiple OEM platforms.

Use Scenario: Storing switch/router configuration tables, MAC address pools, and failover scripts in carrier-grade Ethernet switches with hot-swap power modules.

IC Role / Device Role / Timing Role: High-reliability configuration store supporting rapid recovery after power loss, with hardware WP# protecting startup defaults.

Use Value: 1 million endurance cycles allow daily config backups over 10+ years; 55 ns access ensures sub-microsecond register reload on link-up events.

Equivalent & Alternatives

The following parts are listed as comparable options for similar Flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL032N90TFI020	48-ball BGA, 32 Mbit, 90 ns access, no Simultaneous Read/Write, NOR architecture	Lacks FlexBank concurrency; requires software-managed erase scheduling	Select when cost sensitivity outweighs performance need for concurrent operations
MX29GL320EHTI-90G	48-ball BGA, 32 Mbit, 90 ns access, no CFI, no password protection	No CFI interface or password-secured sectors - limits field-upgrade security and host abstraction	Select for legacy designs where host firmware lacks CFI parsing and security requirements are minimal

Compared with S29GL032N90TFI020 and MX29GL320EHTI-90G, the S29PL032J70BFI072 uniquely delivers bank-level concurrency, CFI runtime configurability, and dual-layer (persistent + password) sector protection - essential for safety-certified and OTA-capable systems.

Availability

S29PL032J70BFI072 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ECU boot memory, and medical diagnostic imaging boot loader applications requiring stable component supply, long-term lifecycle support, and qualified automotive-grade variants.

Supply support for S29PL032J70BFI072 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive MCUs, and secure memory solutions for industrial and mission-critical applications.

The S29PL-J family was developed by Cypress (acquired by Infineon in 2020) to deliver high-reliability, bank-parallel Flash memory for real-time embedded systems requiring deterministic firmware update behavior and robust data integrity.

FAQ

Does S29PL032J70BFI072 require a 12 V VPP supply for programming?

No. The device uses internally generated high voltages for erase and program operations. Only a single 2.7–3.6 V supply is required - eliminating external charge pumps and simplifying power design in space-constrained applications like automotive body control modules.

How does the FlexBank architecture improve system responsiveness?

By isolating Banks A–D, the device permits simultaneous read from one bank and erase/program in another - e.g., executing a 100 ms sector erase in Bank D while fetching real-time sensor data from Bank A. This eliminates CPU idle polling and reduces effective firmware update latency by up to 70%.

What is the role of the VIO pin in S29PL032J70BFI072?

The VIO pin sets the I/O voltage reference for all control inputs (CE#, OE#, WE#, RESET#) and data pins (DQ0–DQ15). For this PL032J variant, VIO is fixed at 3 V - ensuring full 3.3 V logic compatibility without level shifters and preventing signal integrity issues in mixed-voltage systems.

Can the Secured Silicon Sector be used to store cryptographic keys?

Yes. The 128-word Secured Silicon Sector supports up to 64 factory-locked words and 64 customer-lockable words. It is accessed via a dedicated command sequence and is ideal for storing immutable root keys, device certificates, or secure boot signatures - protected from overwrite even during full-chip erase operations.

S29PL032J70BFI072 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: PL-J

Package/Case:: 48-VFBGA

Packaging:: Tape & Reel (TR)

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 32Mbit

Memory Organization:: 2M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 70ns

Access Time:: 70 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 48-VFBGA (8.15x6.15)

S29PL032J70BFI072 FAQ

1.How can I place an order for S29PL032J70BFI072 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29PL032J70BFI072 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29PL032J70BFI072 reliable?

The price and inventory of S29PL032J70BFI072 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29PL032J70BFI072 is usually 5 days.

3.What payment methods are accepted for S29PL032J70BFI072?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29PL032J70BFI072 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29PL032J70BFI072?

S29PL032J70BFI072 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29PL032J70BFI072 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29PL032J70BFI072?

For technical support, including S29PL032J70BFI072 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29PL032J70BFI072 requirements.

6.How does Aetrix verify that S29PL032J70BFI072 is sourced from the original manufacturer or authorized distributors?

All S29PL032J70BFI072 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29PL032J70BFI072 meets industry standards.

7.What is the process for return or replacement of S29PL032J70BFI072?

All S29PL032J70BFI072 units undergo pre-shipment inspection (PSI). If there is an issue with S29PL032J70BFI072, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29PL032J70BFI072 part is unused and in its original packaging.

Return procedure for S29PL032J70BFI072:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-07-20 Product Change Notification (PCN) in Electronic Components: Meaning and Supply Chain Response

Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

2026-07-19 Blend Door Actuator: Symptoms, Location, Reset and Replacement Guide

A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

2026-07-17 Raspberry Pi Alternatives: Chip-Level Comparison, Compatibility and Replacement Guide

Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…

2026-07-13 How to Test Dynamic Load Response in Low-Voltage High-Current Buck Converters

Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…

2026-07-08 Output Capacitor Selection for High-Current ASIC Vcore Rails

Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…

2026-07-07 High-Current ASIC Core Power Supply Design: 12-Phase Buck, PMBus and Dynamic Load Response

Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …

2026-07-06 Voltage Regulator: Types, Circuits, Testing and Selection Guide

Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.

2026-06-30 Amplifiers Explained: Types, Circuits, Gain, Classes and Applications

Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…

2026-06-27 Machine Vision System: Components, Inspection Applications and Integration Guide

Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…

2026-06-23 Electronic Devices and Circuits: Fundamentals, Components and Applications

Electronic devices and circuits guide covering passive components, semiconductors, analog and digital circuits, circuit theory, practical calculations, troubleshooting, datasheet selection, and learnin…