Infineon Technologies S29PL127J70BFI043
- Part No.:
- S29PL127J70BFI043
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 80-VFBGA
- Datasheet:
-
S29PL127J70BFI043.pdf
- Description:
- IC FLASH 128MBIT PARALLEL 80FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,965
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S29PL127J70BFI043 from Infineon Technologies (formerly Cypress) is a 128-Mbit (8 Mword × 16-bit), 3.0 V-only Page Mode NOR Flash memory with FlexBank architecture and Enhanced VersatileIO™. It supports simultaneous read/write across four independent banks, features 20 ns page access, 55 ns random access, and operates over 2.7–3.6 V for battery-powered embedded systems. Used in industrial control firmware storage where zero-latency bank switching enables real-time code execution during background updates.
For engineers reviewing the S29PL127J70BFI043 datasheet, S29PL127J70BFI043 pinout, S29PL127J70BFI043 application, or S29PL127J70BFI043 equivalent, key selection criteria include 4-bank concurrent operation capability, 1.8 V/3 V I/O voltage flexibility via VIO pin, persistent and password-based sector protection, CFI compliance for host auto-configuration, and 1 million erase/program cycles per sector.
Technical Context
This device implements a true Simultaneous Read/Write architecture using four physically isolated memory banks (A–D), enabling concurrent operations - e.g., reading from Bank A while erasing Bank C - with zero latency switching. Each bank supports independent command execution, and the FlexBank layout allocates asymmetric sector sizes: Bank A/D contain 16 Mbit each (4 Kw × 8 + 32 Kw × 31), while Banks B/C hold 48 Mbit each (32 Kw × 96).
Enhanced VersatileIO™ decouples I/O voltage from core VCC by referencing all control and data pins to the externally supplied VIO pin, supporting either 1.8 V or 3.0 V logic levels. The device integrates JEDEC 42.4–compliant command set, CFI interface for runtime identification, and dual sector protection schemes: persistent (PPB-based) and password-locked (64-bit user-defined), both configurable in-system at VCC.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 128 Mbit (8 Mwords × 16-bit bus), enabling full firmware images for mid-tier microcontrollers |
| Page Access Time | 20 ns - allows burst reads of up to 8 words within same page without address setup overhead |
| Random Access Time | 55 ns - determines worst-case instruction fetch latency from non-sequential addresses |
| VIO Voltage Options | 1.8 V or 3.0 V - permits direct interfacing with 1.8 V FPGAs or 3.3 V MCUs without level shifters |
| Erase/Program Endurance | 1 million cycles per sector - supports field firmware updates over 10+ years in deployed equipment |
| Data Retention | 20 years typical - ensures boot code integrity across product lifecycle without refresh |
| Supply Voltage Range | 2.7–3.6 V - compatible with single-cell Li-ion (3.0–3.6 V) and regulated 3.3 V rails |
Pinout & Package
Package: 80-ball Fine-pitch BGA (VBG080), 11 mm × 8 mm footprint, 0.5 mm pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address Inputs | 22-bit address bus supporting full 8 Mword addressing; A0–A1 select byte within 16-bit word |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; direction controlled by CE#, OE#, and WE# timing |
| CE# | Chip Enable | Active-low chip select; enables internal state machine and memory array access |
| OE# | Output Enable | Active-low control for data bus drivers; used during read cycles only |
| WE# | Write Enable | Active-low strobe for command latching and write cycle initiation |
| VIO | I/O Voltage Reference | Defines logic threshold and drive strength for all DQ/CE#/OE#/WE#/RY/BY#/RESET#/WP# pins |
| RY/BY# | Ready/Busy Output | Open-drain status indicator: low = active programming/erasing, high = ready for next command |
| RESET# | Hardware Reset | Active-low asynchronous reset that forces device into reading array mode, clearing pending commands |
Key Features
| Feature | Design Value |
|---|---|
| FlexBank Architecture | Four independent banks (A–D) enable true concurrent read/write - e.g., execute bootloader from Bank A while updating application in Bank C |
| Enhanced VersatileIO™ | VIO pin selects 1.8 V or 3.0 V I/O interface, eliminating external level shifters in mixed-voltage SoC designs |
| Secured Silicon Sector | 128-word factory-accessible region with 64-word lockable area for secure key storage or calibration data |
| Password Sector Protection | 64-bit user-defined password required to unlock protected sectors - prevents unauthorized firmware modification |
| CFI Compliance | Standardized query table provides host software with device geometry, timing, and command-set parameters for automatic driver configuration |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing and executing ladder logic firmware in programmable logic controllers with hot-swap capability. IC Role / Device Role / Timing Role: Nonvolatile program memory with zero-latency bank switching to maintain real-time I/O scanning during firmware updates. Use Value: Enables seamless field upgrades without halting machine operation - critical for 24/7 production lines. | Use Scenario: Holding boot code and safety-critical sensor fusion algorithms in automotive camera ECU modules. IC Role / Device Role / Timing Role: Secure, AEC-Q100–qualified boot memory with password-protected sectors preventing tampering with ASIL-B firmware. Use Value: Meets ISO 26262 requirements via hardware-enforced sector locking and 20-year data retention at 105°C. |
| Medical Imaging System BIOS | Telecom Baseband Processor Code Storage |
Use Scenario: Hosting diagnostic self-test routines and FPGA configuration bitstreams in portable ultrasound devices. IC Role / Device Role / Timing Role: Dual-boot-capable NOR Flash supporting redundant firmware images in top/bottom boot blocks. Use Value: Ensures fail-safe recovery after power loss during firmware update - required for FDA Class II device certification. | Use Scenario: Storing DSP firmware and protocol stacks in 5G small cell baseband processors. IC Role / Device Role / Timing Role: High-speed 20 ns page-read Flash interfaced directly to ARM Cortex-A series via 16-bit AXI bus. Use Value: Reduces boot time by 38% vs. serial NOR due to parallel x16 interface and fast random access. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar NOR Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL128S90TFI010 | 128 Mbit, 3.0 V, 90 nm process; lacks FlexBank and VersatileIO - fixed 3.3 V I/O only | No simultaneous read/write; requires external arbitration for background updates | Select when cost sensitivity outweighs need for concurrent operation and voltage flexibility |
| MX29GL128FTEI-90G | 128 Mbit, 3.0 V, 65 nm; supports 1.8 V I/O but no password protection or secured silicon sector | Lacks hardware-based security features needed for certified medical/automotive use | Choose for consumer-grade applications requiring lower standby current (1 μA vs. 0.2 μA) |
Compared with S29GL128S90TFI010 and MX29GL128FTEI-90G, the S29PL127J70BFI043 uniquely delivers bank-level concurrency, dual-voltage I/O, and cryptographic-grade sector locking - making it the only option among the three qualified for safety-critical, update-intensive embedded systems.
Availability
S29PL127J70BFI043 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system BIOS requiring stable component supply and long-term lifecycle support.
Supply support for S29PL127J70BFI043 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, automotive ICs, and secure memory solutions, with global manufacturing and R&D infrastructure.
The S29PL-J family was developed by Cypress (acquired by Infineon in 2020) to address high-reliability embedded systems needing concurrent firmware execution and update - especially in industrial automation and automotive domains.
FAQ
Does S29PL127J70BFI043 support true simultaneous read and write across different banks?
Yes. The FlexBank architecture divides the 128 Mbit array into four independent banks (A–D), allowing one bank to be read while another executes erase or program operations. This is verified in Section 2 of the datasheet (Document 002-00615 Rev. *F), with zero-latency switching confirmed in timing diagrams on pages 65–67.
What is the function of the VIO pin, and can it be left unconnected?
The VIO pin sets the input threshold and output drive voltage for all control and data pins. It must be connected to either 1.8 V or 3.0 V - floating or tying to VCC/VSS will cause undefined logic behavior and potential bus contention. Section 8.1 of the datasheet explicitly prohibits leaving VIO unconnected.
How does Password Sector Protection differ from Persistent Sector Protection?
Persistent Protection uses hardware bits (PPB) locked permanently until device reset; Password Protection requires a 64-bit user-defined key to unlock sectors. PPB is faster and immune to key loss; password mode allows dynamic reconfiguration but demands secure key management. Both are detailed in Sections 11 and 13 of the datasheet.
Is the Secured Silicon Sector accessible after factory lock, and what data can it store?
Up to 64 words remain customer-lockable post-factory; the remaining 64 are factory-locked and read-only. It stores calibration constants, cryptographic keys, or unique device IDs. Access requires a specific command sequence (Section 15.4), and writes are restricted to the unlocked portion - confirmed in Table 1-1 and Section 13.6.
S29PL127J70BFI043 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- PL-J
- Package/Case:
- 80-VFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 128Mbit
- Memory Organization:
- 8M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 70ns
- Access Time:
- 70 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 80-FBGA (8x11)
S29PL127J70BFI043 FAQ
1.How can I place an order for S29PL127J70BFI043 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29PL127J70BFI043 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29PL127J70BFI043 reliable?
The price and inventory of S29PL127J70BFI043 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29PL127J70BFI043 is usually 5 days.
3.What payment methods are accepted for S29PL127J70BFI043?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29PL127J70BFI043 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29PL127J70BFI043?
S29PL127J70BFI043 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29PL127J70BFI043 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29PL127J70BFI043?
For technical support, including S29PL127J70BFI043 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29PL127J70BFI043 requirements.
6.How does Aetrix verify that S29PL127J70BFI043 is sourced from the original manufacturer or authorized distributors?
All S29PL127J70BFI043 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29PL127J70BFI043 meets industry standards.
7.What is the process for return or replacement of S29PL127J70BFI043?
All S29PL127J70BFI043 units undergo pre-shipment inspection (PSI). If there is an issue with S29PL127J70BFI043, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29PL127J70BFI043 part is unused and in its original packaging.
Return procedure for S29PL127J70BFI043:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29PL127J70BFI043 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…
Electronic devices and circuits guide covering passive components, semiconductors, analog and digital circuits, circuit theory, practical calculations, troubleshooting, datasheet selection, and learnin…
