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Infineon Technologies S29WS064RABBHW000

Part No.:
S29WS064RABBHW000
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
84-VFBGA
Datasheet:
AetrixS29WS064RABBHW000.pdf
Description:
IC FLASH 64MBIT PARALLEL 84FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,553

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Product details

Overview

S29WS064RABBHW000 from Cypress Semiconductor (formerly Spansion) is a 64 Mbit (4M × 16-bit), 1.8 V-only MirrorBit® Flash memory with simultaneous read/write operation across four independent banks, 108 MHz synchronous burst capability, and VersatileIO™ support for 1.8 V I/O compatibility. It features 32-word write buffering, dynamic sector protection (DYB), and secured silicon sector (256 words) for firmware integrity in boot-critical embedded systems.

For engineers reviewing the S29WS064RABBHW000 datasheet, S29WS064RABBHW000 pinout, S29WS064RABBHW000 application, or S29WS064RABBHW000 equivalent, key selection criteria include zero-latency bank interleaving, JEDEC 42.4 command set compliance, -25°C to +85°C industrial temperature rating, FBGA-84 package footprint, and hardware reset (RESET#) integration for boot loader recovery.

Technical Context

This device implements a four-bank architecture enabling true concurrent read and erase/program operations - one bank active for read while another executes sector erase (8 kword or 32 kword) or buffered programming. Its VersatileIO™ interface decouples I/O voltage level (set by VIO pin) from core VCC (1.7–1.95 V), supporting mixed-voltage system interfacing without level shifters.

The embedded algorithms - including Embedded Erase (Fowler-Nordheim tunneling) and Embedded Program (hot electron injection) - manage pulse timing, margin verification, and suspend/resume for both program and erase cycles. Handshaking via RDY output enables latency-optimized host control, while CFI support ensures standardized memory interrogation and configuration.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density64 Mbit (4,194,304 × 16-bit words) - supports full firmware images for mid-tier microcontrollers.
Supply Voltage1.70–1.95 V VCC - single-supply operation eliminates dual-rail design complexity.
Burst Read Speed108 MHz with 7.6 ns tBACC - delivers sustained 1728 MB/s effective throughput in linear burst mode.
Asynchronous Page Access20 ns tPACC for 8-word page - enables fast random access during initialization or exception handling.
Write Buffer Size32-word buffer - reduces multi-word programming time by >70% vs. single-word writes.
Cycling Endurance100,000 program/erase cycles per sector - validated for field-updatable firmware with frequent OTA updates.
Data Retention10 years at +85°C - meets automotive and industrial storage longevity requirements.

Pinout & Package

Supplied in an 84-ball Fine-Pitch Ball Grid Array (FBGA) package measuring 8 mm × 11.6 mm with 0.8 mm ball pitch, optimized for high-density PCB layouts and thermal performance in compact embedded modules.

Pin/TerminalCircuit RoleDesign Meaning
A21–A0Address Inputs22-bit address bus supporting full 4M-word addressing; A0–A1 select byte within 16-bit word.
DQ15–DQ0Bi-directional Data Bus16-bit parallel I/O with VersatileIO™ voltage tracking - tolerates and drives logic levels matching VIO pin voltage.
CE#, OE#, WE#Control InputsStandard asynchronous control signals; CE# enables chip, OE# gates output, WE# controls write direction - all active-low and asynchronous to CLK.
RDYReady OutputOpen-drain status signal indicating valid data availability during burst reads or operation completion - enables handshaking without polling overhead.
CLK, AVD#Burst Timing InputsCLK synchronizes burst address increment; AVD# latches starting address on falling edge - required only in synchronous burst mode.
VIOI/O Reference SupplyInput pin setting I/O voltage level (1.7–1.95 V); decouples interface signaling from core VCC domain.
RESET#Hardware Reset InputActive-low signal forcing device into read array state - critical for safe boot recovery after power-on or fault conditions.

Key Features

FeatureDesign Value
Simultaneous Read/WriteZero-latency bank interleaving allows real-time firmware execution while updating non-active sectors - eliminates system stalls during field upgrades.
Dynamic Protection Bits (DYB)In-system lock/unlock of individual sectors using VCC-level commands - enables secure partitioning of bootloader, config, and application code without hardware fuses.
Secured Silicon Sector256-word factory- and customer-programmable region (128+128 words) accessible only via command sequence - prevents unauthorized readout of cryptographic keys or calibration data.
Erase/Program Suspend & ResumeOne-level depth suspend allows reading from protected regions (e.g., CFI or DYB tables) during long erase cycles - maintains system responsiveness under background maintenance.
Common Flash Interface (CFI)Standardized query table at fixed address enables automatic driver detection and configuration - simplifies BSP porting across Flash vendors.

Applications

Automotive Instrument ClusterIndustrial PLC Firmware Storage

Use Scenario: Storing and executing calibrated gauge graphics, CAN message handlers, and over-the-air update payloads in a space-constrained dashboard ECU.

IC Role / Device Role / Timing Role: Primary boot flash with top-boot sector configuration - holds immutable bootloader and signed firmware images.

Use Value: Simultaneous read/write enables seamless UI rendering during silent firmware patching; 10-year retention ensures reliability over vehicle lifetime.

Use Scenario: Holding ladder logic programs, I/O mapping tables, and safety-critical configuration in modular programmable logic controllers.

IC Role / Device Role / Timing Role: Non-volatile program memory with hardware RESET# tie-in to controller watchdog - guarantees deterministic boot after brownout recovery.

Use Value: Dynamic sector protection isolates runtime code from update partitions; -25°C to +85°C rating supports uncooled cabinet deployment.

Medical Imaging Control ModuleNetwork Edge Router Boot Memory

Use Scenario: Storing FPGA configuration bitstreams, sensor calibration profiles, and diagnostic firmware in portable ultrasound or X-ray subsystems.

IC Role / Device Role / Timing Role: Dual-role memory: burst-mode read for real-time image pipeline initialization; buffered write for field calibration updates.

Use Value: 32-word write buffer cuts calibration save time by 65%; secured silicon sector stores DICOM-compliant encryption keys.

Use Scenario: Hosting boot ROM, U-Boot, and Linux kernel images in carrier-grade edge routers requiring rapid failover and secure firmware rollback.

IC Role / Device Role / Timing Role: High-reliability boot flash with bottom-boot configuration - separates trusted boot code from upgradable application partitions.

Use Value: JEDEC 42.4 command compatibility ensures drop-in replacement in legacy designs; 100K-cycle endurance supports frequent security patch cycles.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 64 Mbit, 1.8 V Flash memory applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S29GL064S90TFI01064 Mbit, 3.0 V core supply; no VersatileIO™; lacks simultaneous read/write; uses older 90 nm process.Requires separate 3.0 V rail; unsuitable for zero-latency background updates; lower endurance (100K vs. same).Select only if legacy 3.0 V system compatibility is mandatory and burst performance is secondary.
MX29GL640EHTI-90G64 Mbit, 1.8 V; supports CFI and DYB; no RDY handshaking; no write buffer; 90 ns tACC (vs. 80 ns).Lacks zero-latency bank interleaving; slower random access limits boot speed; no suspend/resume for erase.Consider for cost-sensitive designs where background operation concurrency is not required.

Compared with S29WS064RABBHW000, the S29GL064S90TFI010 requires higher voltage and lacks concurrent operation, while the MX29GL640EHTI-90G omits RDY handshaking and write buffering - both compromise real-time update capability and system responsiveness in modern embedded platforms.

Availability

S29WS064RABBHW000 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLCs, medical imaging control modules, and network edge router boot memory requiring stable component supply, long-term lifecycle support, and guaranteed industrial temperature operation.

Supply support for S29WS064RABBHW000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a global leader in embedded solutions, delivering high-performance, high-reliability semiconductor products for automotive, industrial, and communications markets.

The S29WS064R belongs to Cypress's MirrorBit Flash product line, engineered specifically for demanding embedded applications requiring concurrent execution and update, secure firmware storage, and extended temperature resilience.

FAQ

What is the purpose of the VIO pin on the S29WS064RABBHW000?

The VIO pin sets the I/O voltage reference level for DQ15–DQ0, allowing the device to generate and tolerate logic signals matching the host processor's I/O voltage (1.7–1.95 V), independent of the core VCC supply. This eliminates external level shifters in mixed-voltage systems and ensures signal integrity during burst transfers.

Does the S29WS064RABBHW000 support true background erase?

Yes - the Erase Suspend/Erase Resume feature enables reading from or programming to any non-erasing sector while an erase operation is paused. This provides true background erase capability with one-level suspend depth, maintaining system responsiveness during long-duration sector erases (up to 800 ms for 32-kword sectors).

How is sector protection implemented on this device?

Sector protection uses two complementary methods: hardware protection (entire array locked when ACC = VIL) and Dynamic Protection Bits (DYB), which allow in-system locking/unlocking of any sector combination via command sequences at VCC level. DYB bits are stored in nonvolatile latch registers and survive power cycles.

Can the S29WS064RABBHW000 be used in synchronous and asynchronous modes simultaneously?

No - the device operates in either synchronous (burst) or asynchronous mode, selected via configuration register settings. However, it supports *simultaneous read and write operations* across banks in either mode, with zero latency between initiating a read in one bank and starting a program/erase in another - a distinct architectural capability unrelated to clocked vs. unclocked interface timing.

S29WS064RABBHW000 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
WS-R
Package/Case:
84-VFBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
64Mbit
Memory Organization:
4M x 16
Memory Interface:
Parallel
Clock Frequency:
108 MHz
Write Cycle Time - Word, Page:
60ns
Access Time:
80 ns
Voltage - Supply:
1.7V ~ 1.95V
Operating Temperature:
-25°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
84-FBGA (11.6x8)

S29WS064RABBHW000 FAQ

1.How can I place an order for S29WS064RABBHW000 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29WS064RABBHW000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29WS064RABBHW000 reliable?

The price and inventory of S29WS064RABBHW000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29WS064RABBHW000 is usually 5 days.

3.What payment methods are accepted for S29WS064RABBHW000?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29WS064RABBHW000 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29WS064RABBHW000?

S29WS064RABBHW000 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29WS064RABBHW000 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29WS064RABBHW000?

For technical support, including S29WS064RABBHW000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29WS064RABBHW000 requirements.

6.How does Aetrix verify that S29WS064RABBHW000 is sourced from the original manufacturer or authorized distributors?

All S29WS064RABBHW000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29WS064RABBHW000 meets industry standards.

7.What is the process for return or replacement of S29WS064RABBHW000?

All S29WS064RABBHW000 units undergo pre-shipment inspection (PSI). If there is an issue with S29WS064RABBHW000, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29WS064RABBHW000 part is unused and in its original packaging.

Return procedure for S29WS064RABBHW000:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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