Infineon Technologies S29WS256P0SBFW000
- Part No.:
- S29WS256P0SBFW000
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 84-VFBGA
- Datasheet:
-
S29WS256P0SBFW000.pdf
- Description:
- IC FLASH 256MBIT PAR 84FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,735
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Product details
Overview
S29WS256P0SBFW000 from Cypress Semiconductor is a 256 Mb (16 M × 16-bit) 1.8 V simultaneous read/write burst-mode NOR Flash memory using 90 nm MirrorBit™ technology, supporting zero-latency concurrent operations across two independent banks, with 104 MHz synchronous burst access and hardware write protection for top/bottom sectors - deployed in wireless baseband processors and LTE/5G modem firmware storage.
For engineers reviewing the S29WS256P0SBFW000 datasheet, S29WS256P0SBFW000 pinout, S29WS256P0SBFW000 application, or S29WS256P0SBFW000 equivalent, key selection criteria include simultaneous bank operation capability, 84-ball FBGA (11.6 mm × 8 mm) package compatibility, CFI compliance, persistent/password sector protection, and 100,000-cycle endurance per sector.
Technical Context
This device implements a sixteen-bank architecture with dual boot sector configuration (four 16 Kword sectors at top and bottom), enabling independent program/erase in one bank while reading from another. It supports both asynchronous and synchronous (burst) read modes, with programmable linear burst lengths (8/16/32 words) and handshaking via RDY output.
Internal command execution follows JEDEC 42.4 standard sequences, with dedicated ACC pin for factory programming acceleration and WP# for hardware-level sector lock. The device integrates Secured Silicon Sector (128-word factory + 128-word customer region) and supports suspend/resume for program/erase operations.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 256 Mb (16 M × 16-bit), mapped as 23-bit address space (A22–A0) |
| Supply Voltage | 1.70–1.95 V single VCC; VCCQ ramped simultaneously - enables low-power mobile SoC integration |
| Burst Frequency | 104 MHz max; 7.6 ns tBACC - delivers sustained 1.66 Gb/s sequential read bandwidth |
| Write Buffer | 32-word (64-byte) buffer - reduces effective programming time to 6 µs/word with VACC |
| Endurance & Retention | 100,000 program/erase cycles per sector; 20-year data retention (typical) - suitable for field-upgradable firmware |
| Protection | Hardware WP# + persistent/password Advanced Sector Protection - prevents accidental or unauthorized firmware overwrite |
| Timing Modes | Supports synchronous burst, asynchronous, and page read (20 ns intra-page access) - flexible interface timing for legacy and high-speed controllers |
Pinout & Package
Package: 84-ball Fine-Pitch BGA (VBH084), 11.6 mm × 8 mm, lead-free (Pb-free), MCP-compatible footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A22–A0 | Address Inputs | 23-bit address bus; A22 = MSB for 16 Mword addressing |
| DQ15–DQ0 | Data I/O | 16-bit bidirectional data bus; supports byte-wide access via upper/lower byte enables (implied by x16 mode) |
| CE#, OE#, WE# | Chip/Output/Write Enable | Asynchronous control signals; CE# enables device, OE# gates output, WE# controls write direction |
| RDY | Ready Output | Active-high open-drain signal indicating valid burst data availability - used for handshaking instead of fixed wait states |
| WP#, ACC, RESET#, AVD# | Function Control | WP# locks top/bottom sectors; ACC enables VHH-accelerated programming; RESET# forces hardware reset; AVD# latches address on CLK edge in burst mode |
| VCC / VCCQ / VSS | Power & Ground | VCC powers core logic; VCCQ powers I/O drivers; both must ramp simultaneously - avoids I/O contention during power-up |
Key Features
| Feature | Design Value |
|---|---|
| Simultaneous Read/Write | Zero-latency concurrent access across two independent banks - eliminates firmware update stalls during active execution |
| Write Buffer Efficiency | 64-byte buffer cuts effective programming time to 6 µs/word with VACC - accelerates field firmware patching |
| Dual Boot Sector Architecture | Four 16 Kword sectors at top and bottom - enables A/B firmware partitioning for fail-safe OTA updates |
| Secured Silicon Sector | 256-word protected region (128 factory + 128 customer) - stores immutable boot code and cryptographic keys |
| CFI Compliance | Fully implements Common Flash Interface v1.3 - enables OS-agnostic flash abstraction layer (e.g., U-Boot, Linux MTD) |
Applications
| Wireless Baseband Firmware Storage | LTE/5G Modem Code Execution |
|---|---|
Use Scenario: Storing and executing boot loader, protocol stack, and calibration data in cellular baseband SoCs. IC Role / Device Role / Timing Role: Primary non-volatile code storage with simultaneous read-while-write capability to support background firmware updates. Use Value: Enables seamless carrier-specific firmware switching without halting radio operation - critical for multi-band/multi-mode modems. | Use Scenario: Hosting real-time LTE MAC/PHY layer firmware in compact RF modules requiring deterministic latency. IC Role / Device Role / Timing Role: Burst-mode NOR Flash delivering 104 MHz synchronous reads to feed instruction cache under tight timing constraints. Use Value: Achieves sub-10 ns burst access time to sustain >1.6 Gb/s instruction fetch rate - meets 3GPP Release 15+ throughput requirements. |
| Industrial Edge Gateway Boot Memory | Automotive Telematics OTA Update Storage |
Use Scenario: Secure boot image storage in ruggedized gateways operating across –40°C to +85°C ambient range. IC Role / Device Role / Timing Role: Temperature-rated (W-grade) Flash with hardware WP# and persistent sector protection for tamper-resistant boot integrity. Use Value: Prevents unauthorized modification of secure boot chain via physical pin-level write disable - satisfies IEC 62443-3-3 SL2 requirements. | Use Scenario: Dual-bank firmware storage enabling atomic over-the-air updates in automotive telematics control units (TCUs). IC Role / Device Role / Timing Role: Simultaneous read-from-active-bank + write-to-standby-bank architecture supporting A/B partitioning and rollback recovery. Use Value: Guarantees uninterrupted vehicle connectivity during firmware upgrade - eliminates risk of bricking during 4G/5G network handover. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar burst-mode NOR Flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL256S11TFI010 | 65 nm process; 110 MHz max burst; no ACC pin; 3 V core supply | Requires level-shifting for 1.8 V systems; lacks simultaneous R/W; higher power in active mode | Select only if legacy 3 V infrastructure exists and zero-latency concurrency is not required. |
| MX29GL256FHT2I-90G | 1.8 V supply; 90 nm; 90 MHz burst; JEDEC-compliant but no CFI support | No standardized CFI query table - increases BSP porting effort; no Secured Silicon Sector | Choose when cost sensitivity outweighs firmware security and OS abstraction needs. |
Compared with S29WS256P0SBFW000, the S29GL256S11TFI010 trades simultaneous operation and 1.8 V simplicity for higher speed at 3 V, while MX29GL256FHT2I-90G sacrifices CFI and secure silicon for lower unit cost - making the S29WS256P0SBFW000 optimal for secure, concurrent, low-voltage wireless firmware storage.
Availability
S29WS256P0SBFW000 is available at Aetrix Electronics and suitable for wireless baseband firmware storage, LTE/5G modem code execution, and industrial edge gateway boot memory requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for S29WS256P0SBFW000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability non-volatile memory and microcontroller solutions for automotive, industrial, and communications markets.
The S29WS-P series targets wireless infrastructure and mobile SoC applications demanding low-voltage, high-concurrency flash with robust firmware protection - directly addressing LTE/5G modem and baseband processor requirements.
FAQ
What is the function of the ACC pin on S29WS256P0SBFW000?
The ACC (Acceleration) pin accepts VHH (~3.0 V) to enable accelerated factory programming mode, automatically placing the device in unlock bypass and reducing single-word programming time to 40 µs. At VIL, it disables all program/erase functions; at VIH, it operates normally. This pin is not used during standard system operation but is essential for high-throughput pre-programming in manufacturing.
Does S29WS256P0SBFW000 support true simultaneous read and write across different memory banks?
Yes - the device implements a sixteen-bank architecture with two independently accessible banks. While one bank executes program or erase, the other can perform synchronous or asynchronous reads with zero latency, verified by the "Simultaneous Read/Program or Erase" section (page 48) of the datasheet and confirmed by RDY-driven handshaking behavior.
How does hardware write protection (WP#) interact with Advanced Sector Protection?
WP# provides coarse-grained protection by disabling program/erase in the four outermost sectors (top and bottom 16 Kword regions) when pulled low. Advanced Sector Protection (persistent/password) operates independently and can protect any sector, including those outside WP# scope. Both mechanisms coexist: WP# is pin-level and always active; ASP requires software commands and offers fine-grained, reprogrammable control.
Is the 84-ball FBGA package of S29WS256P0SBFW000 compatible with standard PCB assembly processes?
Yes - the VBH084 package complies with JEDEC MO-276 standards and supports standard reflow profiles. However, Cypress specifies that ultrasonic cleaning must be avoided, and peak temperatures must not exceed 150°C for prolonged periods to prevent data corruption or solder joint damage. Reflow profile adherence and moisture sensitivity level (MSL) 3 handling are mandatory per the FBGA special handling instructions (page 6).
S29WS256P0SBFW000 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- WS-P
- Package/Case:
- 84-VFBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- 80 MHz
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 80 ns
- Voltage - Supply:
- 1.7V ~ 1.95V
- Operating Temperature:
- -25°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 84-FBGA (11.6x8)
S29WS256P0SBFW000 FAQ
1.How can I place an order for S29WS256P0SBFW000 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29WS256P0SBFW000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29WS256P0SBFW000 reliable?
The price and inventory of S29WS256P0SBFW000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29WS256P0SBFW000 is usually 5 days.
3.What payment methods are accepted for S29WS256P0SBFW000?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29WS256P0SBFW000 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29WS256P0SBFW000?
S29WS256P0SBFW000 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29WS256P0SBFW000 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29WS256P0SBFW000?
For technical support, including S29WS256P0SBFW000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29WS256P0SBFW000 requirements.
6.How does Aetrix verify that S29WS256P0SBFW000 is sourced from the original manufacturer or authorized distributors?
All S29WS256P0SBFW000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29WS256P0SBFW000 meets industry standards.
7.What is the process for return or replacement of S29WS256P0SBFW000?
All S29WS256P0SBFW000 units undergo pre-shipment inspection (PSI). If there is an issue with S29WS256P0SBFW000, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29WS256P0SBFW000 part is unused and in its original packaging.
Return procedure for S29WS256P0SBFW000:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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