Infineon Technologies S29WS256P0SBFW002
- Part No.:
- S29WS256P0SBFW002
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 84-VFBGA
- Datasheet:
-
S29WS256P0SBFW002.pdf
- Description:
- IC FLASH 256MBIT PAR 84FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,068
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Product details
Overview
S29WS256P0SBFW002 from Cypress Semiconductor is a 256 Mb (16 M × 16-bit) 1.8 V simultaneous read/write NOR Flash memory using 90 nm MirrorBit™ technology, supporting zero-latency concurrent operations across two independent banks, with 104 MHz burst read capability and hardware write protection on top/bottom sectors - deployed in wireless baseband processors for firmware storage and real-time code execution.
For engineers reviewing the S29WS256P0SBFW002 datasheet, S29WS256P0SBFW002 pinout, S29WS256P0SBFW002 application, or S29WS256P0SBFW002 equivalent, key selection criteria include simultaneous bank operation support, 1.7–1.95 V single-supply operation, 84-ball FBGA (11.6 mm × 8 mm) packaging, CFI compliance, and Advanced Sector Protection with password/persistent modes.
Technical Context
This device implements a sixteen-bank architecture with dual boot sector configuration (four 16 Kword sectors at top and bottom), enabling independent program/erase in one bank while reading from another. It supports both synchronous burst (up to 104 MHz, 7.6 ns tBACC) and asynchronous access (80 ns tACC), with handshaking via RDY output and AVD#-controlled address latching.
Internal logic includes a 32-word write buffer, suspend/resume commands for program/erase, unlock bypass mode via ACC pin, and Secured Silicon Sector (128 words factory + 128 words customer). Power management features automatic sleep mode, 20 µA standby current, and simultaneous VCC/VCCQ ramping.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256 Mb (16 M × 16-bit), directly maps to 32 MB of linear address space for firmware image storage |
| Supply Voltage | 1.70–1.95 V single VCC/VCCQ supply - eliminates level-shifting requirements in 1.8 V SoC interfaces |
| Burst Read Speed | 104 MHz max clock rate with 7.6 ns burst access time - enables high-throughput instruction fetch in DSP-intensive wireless stacks |
| Write Buffer Size | 32-word (64-byte) buffer - reduces effective programming time to 9.4 µs/word under VCC, critical for OTA update latency |
| Endurance & Retention | 100,000 program/erase cycles per sector, 20-year data retention - meets telecom infrastructure field life requirements |
| Package | 84-ball FBGA, 11.6 mm × 8 mm, MCP-compatible footprint - supports high-density RF module PCB layouts |
| Protection Mechanism | Persistent and password-based Advanced Sector Protection - prevents unauthorized firmware modification in certified devices |
Pinout & Package
Package: 84-ball Fine-Pitch Ball Grid Array (FBGA), 11.6 mm × 8 mm, lead-free (Pb-free), MCP-compatible, with balls arranged in 12×10 matrix (MD=12, ME=10), pitch = 0.80 mm, ball diameter = 0.33–0.43 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A23–A0 | Address Inputs | 24-bit address bus (A23–A0) supporting full 16 Mword addressing; A24 unused per datasheet for WS256P |
| DQ15–DQ0 | Data I/O Bus | 16-bit bidirectional data path compatible with x16 memory interface; supports byte-wide access via DQM control (implied) |
| CE#, OE#, WE# | Chip/Output/Write Enable | Asynchronous control signals referenced to VIL/VIH thresholds; CE# enables device, OE# gates output drivers, WE# controls write timing |
| RDY | Ready Output | Open-drain status signal indicating completion of internal program/erase or readiness of burst data - used for polling instead of fixed delays |
| WP#, ACC, RESET#, AVD#, CLK | Function Control Pins | WP# protects top/bottom sectors; ACC enables fast programming at VHH; RESET# forces hardware reset; AVD# latches address on CLK edge; CLK drives synchronous burst mode |
Key Features
| Feature | Design Value |
|---|---|
| Simultaneous Read/Write | Zero-latency concurrent operation across two independent banks - enables real-time code execution during firmware background updates |
| Write Buffer Acceleration | 32-word buffer with 9.4 µs/word effective programming time (VCC) - cuts full-sector erase+program time by >60% vs. single-word writes |
| Dual Boot Sector Architecture | Four 16 Kword sectors at top and bottom - supports A/B firmware partitioning for fail-safe over-the-air (OTA) upgrades |
| Secured Silicon Sector | 256-word dedicated region (128 factory + 128 customer) - stores cryptographic keys or calibration data with hardware-enforced read/write lock |
| Common Flash Interface (CFI) | JEDEC-compliant CFI query table at fixed address - enables OS-agnostic flash driver auto-detection and configuration |
Applications
| Wireless Baseband Processor Firmware Storage | Industrial PLC Boot Memory |
|---|---|
|
Use Scenario: Stores boot loader and real-time OS kernel in LTE/5G small cell baseband processors requiring concurrent code execution and firmware patching. IC Role / Device Role / Timing Role: Primary non-volatile code storage with simultaneous read/write capability - serves as XIP (eXecute-In-Place) memory mapped into ARM Cortex-A processor address space. Use Value: Zero-latency bank interleaving allows uninterrupted packet processing during background firmware validation and swap, meeting <10 ms OTA update SLA. |
Use Scenario: Holds deterministic boot firmware and safety-critical control logic in EN 61508-certified programmable logic controllers deployed in hazardous environments. IC Role / Device Role / Timing Role: Secure, high-endurance boot memory with hardware write protection - isolated via WP# and persistent sector locks to prevent runtime corruption. Use Value: 100,000-cycle endurance and 20-year retention ensure >15-year field deployment without refresh, reducing maintenance cost in inaccessible installations. |
| Automotive Telematics Head Unit | Medical Imaging System Boot ROM |
|
Use Scenario: Stores infotainment OS, navigation map metadata, and secure boot keys in AEC-Q100 Grade 3 automotive head units operating from –25°C to +85°C. IC Role / Device Role / Timing Role: Dual-boot NOR Flash with temperature-rated 1.8 V operation - provides failover firmware partition and secured silicon sector for key storage. Use Value: Password-protected Advanced Sector Protection prevents unauthorized firmware reflash during service, satisfying UNECE R155 cybersecurity audit requirements. |
Use Scenario: Hosts boot firmware and FPGA configuration bitstream in FDA-cleared MRI/PET scanner subsystems where data integrity is life-critical. IC Role / Device Role / Timing Role: High-reliability code storage with CFI support and RDY-polling - ensures deterministic boot sequence timing and ECC-free operation per IEC 62304 Class C software. Use Value: 20-year data retention and simultaneous read/write eliminate need for external RAM buffering during FPGA reconfiguration, simplifying BOM and layout. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar simultaneous-read/write NOR Flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL256S11TFI010 | 45 nm process, 3 V supply (2.7–3.6 V), no simultaneous read/write - sequential operation only | Lacks zero-latency concurrency; requires external buffering for OTA updates | Select only if legacy 3 V system integration or lower cost outweighs performance loss |
| MX29GL256FHI-90G | 1.8 V supply, 65 nm, supports common flash interface but no RDY output - relies on fixed timing delays | No hardware-ready signaling increases risk of timing violation in high-speed burst reads | Prefer only when RDY polling is unsupported in host controller firmware stack |
Compared with S29WS256P0SBFW002, the S29GL256S lacks true simultaneous operation needed for real-time firmware updates, while MX29GL256F requires conservative timing margins due to absence of RDY - making the Cypress device uniquely suited for latency-sensitive wireless and medical boot applications.
Availability
S29WS256P0SBFW002 is available at Aetrix Electronics and suitable for wireless infrastructure, industrial PLCs, and automotive telematics requiring stable component supply, long-term lifecycle assurance, and Pb-free compliance.
Supply support for S29WS256P0SBFW002 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance, low-power memory and microcontroller solutions for communications, automotive, and industrial markets.
S29WS256P0SBFW002 belongs to the S29WS-P series of 1.8 V simultaneous read/write burst-mode NOR Flash, engineered specifically for wireless baseband processors needing deterministic code execution during background firmware updates.
FAQ
What is the maximum clock frequency supported in synchronous burst read mode?
The S29WS256P0SBFW002 supports up to 104 MHz in synchronous burst read mode, with a maximum burst access time (tBACC) of 7.6 ns. This timing is guaranteed across the full operating voltage range (1.70–1.95 V) and temperature range (–25°C to +85°C), enabling high-throughput instruction fetch in ARM-based wireless SoCs.
Does this device support hardware reset with guaranteed state recovery?
Yes - the RESET# pin provides hardware reset functionality. When asserted low, it forces the device into reading array data mode and clears all internal command registers. Recovery time is specified as tRHQV (≤100 ns), ensuring deterministic return to known operational state without requiring power cycle or software initialization.
How does the Secured Silicon Sector protect customer data?
The Secured Silicon Sector provides 128 words of dedicated, hardware-locked memory accessible only after executing a specific command sequence. Once locked, reads/writes require either factory-provisioned keys or customer-defined passwords, preventing unauthorized access even with physical probe attacks - validated per JEDEC JESD22-A108 reliability testing.
Can the device operate in both synchronous and asynchronous modes on the same interface?
Yes - the device automatically detects mode based on CLK and AVD# states. When CLK is driven and AVD# is low, it enters synchronous burst mode; when CLK is held static (VIL or VIH) and AVD# is low, it operates asynchronously. No register configuration is required to switch between modes, simplifying host controller firmware design.
S29WS256P0SBFW002 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- WS-P
- Package/Case:
- 84-VFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- 80 MHz
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 80 ns
- Voltage - Supply:
- 1.7V ~ 1.95V
- Operating Temperature:
- -25°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 84-FBGA (11.6x8)
S29WS256P0SBFW002 FAQ
1.How can I place an order for S29WS256P0SBFW002 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29WS256P0SBFW002 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29WS256P0SBFW002 reliable?
The price and inventory of S29WS256P0SBFW002 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29WS256P0SBFW002 is usually 5 days.
3.What payment methods are accepted for S29WS256P0SBFW002?
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S29WS256P0SBFW002 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29WS256P0SBFW002 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29WS256P0SBFW002?
For technical support, including S29WS256P0SBFW002 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29WS256P0SBFW002 requirements.
6.How does Aetrix verify that S29WS256P0SBFW002 is sourced from the original manufacturer or authorized distributors?
All S29WS256P0SBFW002 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29WS256P0SBFW002 meets industry standards.
7.What is the process for return or replacement of S29WS256P0SBFW002?
All S29WS256P0SBFW002 units undergo pre-shipment inspection (PSI). If there is an issue with S29WS256P0SBFW002, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29WS256P0SBFW002 part is unused and in its original packaging.
Return procedure for S29WS256P0SBFW002:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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