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Infineon Technologies S29WS256PABBAW000

Part No.:
S29WS256PABBAW000
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
84-VFBGA
Datasheet:
AetrixS29WS256PABBAW000.pdf
Description:
IC FLASH 256MBIT PAR 84FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,177

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Product details

Overview

S29WS256PABBAW000 from Cypress Semiconductor is a 256 Mb (16 M × 16-bit) 1.8 V simultaneous read/write burst-mode NOR Flash memory using 90 nm MirrorBit™ technology. It supports zero-latency concurrent read and write across two independent banks, features a 32-word write buffer, 16-bank architecture, and dual boot sector configuration with hardware write protection (WP#) for top/bottom sectors. It is deployed in wireless baseband processors requiring high-density, low-voltage code storage with real-time firmware updates.

For engineers reviewing the S29WS256PABBAW000 datasheet, S29WS256PABBAW000 pinout, S29WS256PABBAW000 application, or S29WS256PABBAW000 equivalent, key selection criteria include simultaneous bank operation capability, 104 MHz synchronous burst performance, 1.7–1.95 V single-supply operation, CFI compliance, and advanced sector protection with password and persistent lock bits.

Technical Context

This device implements a sixteen-bank architecture enabling true concurrent read and write operations on separate banks using independent address/data paths. Its command set adheres to JEDEC 42.4 standards and integrates Common Flash Interface (CFI) for host auto-configuration.

It supports multiple access modes: asynchronous (80 ns tACC), page mode (20 ns intra-page), and synchronous burst (7.6 ns tBACC at 104 MHz), with RDY# handshaking and ACC input for factory programming acceleration. Power management includes standby (20 µA), automatic sleep, and hardware RESET#.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 256 Mb (16 M × 16-bit), directly maps to 32 MB of linear address space for firmware/image storage
Supply Voltage 1.70–1.95 V single VCC/VCCQ supply - eliminates level-shifting requirements in 1.8 V SoC interfaces
Burst Frequency 104 MHz - enables 1664 MB/s peak data throughput in synchronous mode with continuous burst
Write Buffer Size 32 words (64 bytes) - reduces effective programming time per word to 6 µs (VACC) or 9.4 µs (VCC)
Endurance & Retention 100,000 program/erase cycles per sector; 20-year data retention - suitable for field-upgradable embedded systems
Access Time 7.6 ns synchronous burst access (tBACC) - meets timing closure for high-speed baseband processor boot sequences
Package 84-ball FBGA (11.6 mm × 8 mm, lead-free, MCP-compatible) - supports high-density PCB layouts with thermal and signal integrity optimization

Pinout & Package

84-ball Fine-Pitch Ball Grid Array (FBGA), 11.6 mm × 8 mm, lead-free compliant (VBH084 package). Balls arranged in 12×10 matrix (MD=12, ME=10), with depopulated corners (M2–M9, B1–L1) and RFU positions (e.g., G8).

Pin/Terminal Circuit Role Design Meaning
A23–A0 Address Inputs 24-bit address bus (A23–A0) supporting full 16 Mword addressing; A23 is MSB for 256 Mb density
DQ15–DQ0 Data I/O 16-bit bidirectional data bus; supports x16 interface without byte-lane splitting or glue logic
CE#, OE#, WE# Chip/Output/Write Enable Asynchronous control inputs - enable standard NOR Flash interface timing without clock dependency
CLK, AVD#, RDY# Timing & Status CLK drives synchronous burst counter; AVD# latches address on rising edge; RDY# signals valid data availability
WP#, RESET#, ACC Protection & Control WP# hardware-locks top/bottom 16 Kword sectors; RESET# forces read mode; ACC at VHH accelerates factory programming

Key Features

Feature Design Value
Simultaneous Read/Write Zero-latency concurrent access across two independent banks - enables real-time code execution while updating firmware in background bank
Advanced Sector Protection Password + persistent lock bit methods - prevents unauthorized firmware modification without physical access or reset cycle
Secured Silicon Sector 256-word region (128 factory + 128 customer) - stores immutable calibration data or cryptographic keys resistant to erase commands
Suspend/Resume Commands Interrupts active program/erase to service high-priority read requests - maintains deterministic latency in RTOS environments
Common Flash Interface (CFI) JEDEC-compliant query table at fixed offset - allows bootloader auto-detection of geometry, timing, and command set without hard-coded parameters

Applications

Wireless Baseband Processor Boot Industrial HMI Firmware Storage

Use Scenario: Stores boot ROM and initial firmware image for LTE/5G baseband SoCs requiring fast, reliable startup.

IC Role / Device Role / Timing Role: Primary nonvolatile code storage with synchronous burst read at 104 MHz to meet boot-time latency targets.

Use Value: 7.6 ns burst access and zero-latency simultaneous operation allow concurrent boot loading and runtime parameter fetch.

Use Scenario: Holds GUI application binaries and configuration data in panel-mounted HMIs operating in extended temperature ranges.

IC Role / Device Role / Timing Role: Field-upgradable firmware storage with hardware WP# protection against accidental overwrite during maintenance.

Use Value: 100,000-cycle endurance and 20-year retention ensure >10-year product lifecycle without refresh.

Automotive Telematics Module Medical Diagnostic Imaging System

Use Scenario: Stores secure OTA update partitions and diagnostic firmware in connected vehicle telematics units.

IC Role / Device Role / Timing Role: Dual-boot sector configuration enables A/B firmware partitioning for fail-safe over-the-air updates.

Use Value: Password-protected Advanced Sector Protection prevents malicious or erroneous reprogramming of critical safety modules.

Use Scenario: Retains calibration tables and FDA-certified imaging algorithms in portable ultrasound and X-ray devices.

IC Role / Device Role / Timing Role: Secured Silicon Sector stores immutable calibration constants inaccessible to user-level software.

Use Value: Factory- and customer-secured 128-word regions guarantee traceable, tamper-evident calibration integrity.

Equivalent & Alternatives

The following parts are listed as comparable options for similar burst-mode NOR Flash applications.

Alternative Part Technical Difference Application Difference Selection Advice
MX29GL256FHI-90G 256 Mb, 3.0 V supply, 90 ns async access, no simultaneous read/write, no CFI support Lacks zero-latency concurrent operation and synchronous burst - unsuitable for real-time firmware update scenarios Select only if system operates at 3.0 V and requires simpler command set without burst or dual-bank features
S29GL256S11TFI010 256 Mb, 3.0 V, 110 MHz burst, no simultaneous R/W, 100K endurance, same FBGA package Higher voltage requirement and missing simultaneous operation limit use in 1.8 V wireless platforms Consider only for legacy 3.0 V designs where CFI compatibility and dual-boot sectors remain critical

Compared with MX29GL256FHI-90G and S29GL256S11TFI010, the S29WS256PABBAW000 uniquely delivers 1.8 V simultaneous read/write with zero latency, making it the only option among the three for real-time firmware patching in power-constrained wireless infrastructure.

Availability

S29WS256PABBAW000 is available at Aetrix Electronics and suitable for wireless baseband processors, industrial HMIs, automotive telematics modules, and medical diagnostic imaging systems requiring stable component supply across long production lifecycles.

Supply support for S29WS256PABBAW000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance, low-power memory and programmable solutions for embedded and connectivity applications.

The S29WS-P series was engineered specifically for wireless infrastructure and mobile SoC platforms needing 1.8 V, high-speed, simultaneous-access NOR Flash with robust security and long-term data integrity.

FAQ

What is the function of the ACC pin on the S29WS256PABBAW000?

The ACC (Acceleration) pin accepts VHH (typically 3.0 V) to accelerate factory programming speed and automatically enter unlock bypass mode. When held at VIL, it disables all program and erase functions. During normal operation, ACC must be tied to VIH to avoid unintended lockout. This pin is not used in standard system operation but is critical during manufacturing test and initial firmware burn-in.

Does the S29WS256PABBAW000 support true simultaneous read and write across the entire memory array?

No - simultaneous read and write are restricted to two independent banks only. The device has sixteen banks, but concurrency is limited to one read operation in one bank and one write/erase operation in another bank. Bank boundaries are fixed and defined by the 16-bank architecture; crossing bank boundaries during concurrent access will result in undefined behavior or bus contention.

How does the Secured Silicon Sector differ from standard flash sectors?

The Secured Silicon Sector is a dedicated 256-word region (128 words factory-reserved, 128 words customer-configurable) that cannot be erased or programmed via standard command sequences. Access requires explicit entry/exit commands and is isolated from main array operations. It retains data even after full chip erase and is used for immutable calibration data or cryptographic keys - unlike regular sectors, it lacks WP# hardware protection and relies on command-lock security.

Can the S29WS256PABBAW000 operate in purely asynchronous mode without using CLK?

Yes - CLK may be left unconnected or held static (VIL or VIH) during asynchronous operation. All standard NOR Flash timing (tACC, tOE, tWH) applies, and AVD# functions as an address strobe. RDY# remains active for status monitoring. However, synchronous burst mode, CFI queries, and certain advanced features like auto-incremented burst reads require CLK to be driven at valid frequency and voltage levels.

S29WS256PABBAW000 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
WS-P
Package/Case:
84-VFBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
256Mbit
Memory Organization:
16M x 16
Memory Interface:
Parallel
Clock Frequency:
104 MHz
Write Cycle Time - Word, Page:
60ns
Access Time:
80 ns
Voltage - Supply:
1.7V ~ 1.95V
Operating Temperature:
-25°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
84-FBGA (11.6x8)

S29WS256PABBAW000 FAQ

1.How can I place an order for S29WS256PABBAW000 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29WS256PABBAW000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29WS256PABBAW000 reliable?

The price and inventory of S29WS256PABBAW000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29WS256PABBAW000 is usually 5 days.

3.What payment methods are accepted for S29WS256PABBAW000?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29WS256PABBAW000 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29WS256PABBAW000?

S29WS256PABBAW000 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29WS256PABBAW000 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29WS256PABBAW000?

For technical support, including S29WS256PABBAW000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29WS256PABBAW000 requirements.

6.How does Aetrix verify that S29WS256PABBAW000 is sourced from the original manufacturer or authorized distributors?

All S29WS256PABBAW000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29WS256PABBAW000 meets industry standards.

7.What is the process for return or replacement of S29WS256PABBAW000?

All S29WS256PABBAW000 units undergo pre-shipment inspection (PSI). If there is an issue with S29WS256PABBAW000, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29WS256PABBAW000 part is unused and in its original packaging.

Return procedure for S29WS256PABBAW000:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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