Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

NXP Semiconductors S32G254AABK1VUCR

Part No.:
S32G254AABK1VUCR
Manufacturer:
NXP Semiconductors
Category:
Microprocessors
Package:
525-FBGA, FCBGA
Datasheet:
AetrixS32G254AABK1VUCR.pdf
Description:
S32G254A ARM CORTEX-M7 AND -A53,
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,509

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

S32G254AABK1VUCR from NXP Semiconductors is a high-performance vehicle network processor integrating dual Cortex-A53 application cores (1 GHz), three lockstep Cortex-M7 real-time cores (400 MHz), 8 MB system SRAM with ECC, and hardware-accelerated networking including PFE Ethernet packet processing, LLCE legacy bus offload, and dual PCIe Gen3 SerDes. It serves as a central gateway or domain controller in automotive ADAS and autonomous driving architectures requiring ASIL D functional safety and HSE_H security subsystem.

For engineers reviewing the S32G254AABK1VUCR datasheet, S32G254AABK1VUCR pinout, S32G254AABK1VUCR application, or S32G254AABK1VUCR equivalent, this page delivers verified specifications, package mapping, safety-certified architecture context, and validated alternative options for automotive central compute node design.

Technical Context

The S32G254AABK1VUCR implements a heterogeneous multi-core architecture with two independent Cortex-A53 clusters (dual-core per cluster) and three lockstep Cortex-M7 cores, all interconnected via a NoC-safe interconnect fabric supporting cache coherency and XRDC-based resource isolation across eight domains. Its safety infrastructure includes FCCU, MBIST/LBIST, and dual-lockstep M7 execution.

Networking is accelerated through dedicated hardware blocks: PFE enables stateful firewall, classification, and header manipulation at line rate; LLCE handles CAN FD, FlexRay v2.1, and LINFlexD protocol offload; and dual PCIe Gen3 SerDes support X1/X2 configurations for high-bandwidth peripheral expansion or inter-SoC communication.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Architecture Dual Cortex-A53 clusters (2×2 cores), 3× Cortex-M7 in lockstep - enables concurrent high-level OS execution and deterministic real-time control.
Max Core Frequencies Cortex-A53: 1000 MHz; Cortex-M7: 400 MHz - supports demanding gateway routing, FOTA orchestration, and safety-critical monitoring tasks.
System RAM 8 MB SRAM with ECC - provides fast, error-resilient memory for time-critical packet buffering, secure boot, and runtime firmware staging.
Networking Acceleration PFE + LLCE + dual PCIe Gen3 SerDes - offloads Ethernet switching, legacy bus protocol translation, and high-speed peripheral I/O from CPU cores.
Safety & Security ASIL D compliance, HSE_H cryptographic engine, XRDC domain isolation, OTFAD - meets ISO 26262 and UNECE R155 requirements for secure central compute nodes.
Package 525 FC-PBGA, 19 mm × 19 mm, 0.8 mm pitch - automotive-grade flip-chip BGA with thermal and mechanical robustness for under-hood deployment.
Operating Temperature -40 °C to 105 °C (TA) - qualified for engine bay and central ECU mounting locations per AEC-Q100 Grade 2.

Pinout & Package

525-pin flip-chip plastic ball grid array (FC-PBGA), 19 mm × 19 mm, 0.8 mm pitch, RoHS-compliant, moisture sensitivity level 3. Package supports full thermal dissipation required for sustained 1 GHz A53 operation in automotive ambient conditions.

Pin/Terminal Circuit Role Design Meaning
VDD_CORE Core power supply 0.72–0.87 V LV supply powering Cortex-A53/M7 clusters and NoC - requires tight regulation and low-noise filtering per SVS guidelines.
VDD_IO_A / VDD_IO_B 3.3 V GPIO I/O supply 3.08–3.52 V domain for general-purpose digital I/Os - supports automotive sensor/actuator interfacing and legacy MCU communication.
VDD_IO_GMAC0/1 Ethernet PHY I/O supply 1.68–1.92 V (1.8 V) or 3.08–3.52 V (3.3 V) configurable supply - enables RGMII/SGMII interface flexibility with GMAC peripherals.
VDD_DDR0 DDR3L/LPDDR4 I/O supply 1.283–1.45 V (DDR3L) or 1.06–1.17 V (LPDDR4) - powers external DRAM interface with ripple tolerance ≤ ±5% for stable memory access.
RESET_B Active-low reset input Asynchronous reset signal synchronized internally - must be held low during power ramp-up until all supplies meet SVS thresholds.
CLKIN External clock input 20–40 MHz FXOSC crystal or oscillator input - feeds PLLs for deterministic clock tree generation across CPU, memory, and I/O domains.

Key Features

Feature Design Value
Arm TrustZone® support Enables secure world/normal world partitioning for confidential firmware execution and isolated key storage within HSE_H.
OTFAD encryption On-the-fly AES-128 decryption of external flash contents - prevents unauthorized firmware extraction during boot or FOTA updates.
XRDC resource isolation Hardware-enforced access control across 8 memory/peripheral domains - ensures fault containment between safety-critical and application software partitions.
PFE stateful inspection Hardware-accelerated firewall with deep packet inspection and classification - eliminates CPU overhead for secure vehicle network segmentation.
LLCE protocol offload 16× CAN FD, 1× FlexRay v2.1, 4× LINFlexD channels handled in hardware - frees A53 cores for higher-layer routing logic and diagnostics.

Applications

Central Gateway Safety Processor for ADAS

Use Scenario: Aggregating CAN FD, FlexRay, LIN, and Ethernet traffic between zonal ECUs and cloud-connected telematics units.

IC Role / Device Role / Timing Role: Central routing and protocol translation node with deterministic latency guarantees via lockstep M7 cores and PFE acceleration.

Use Value: Reduces gateway ECU BOM by eliminating discrete protocol bridge ICs while meeting ASIL D requirements for fail-operational behavior.

Use Scenario: Monitoring radar, camera, and ultrasonic sensor data streams for collision avoidance and lane-keeping functions.

IC Role / Device Role / Timing Role: Safety monitor executing ISO 26262 Part 10-compliant diagnostic routines on sensor inputs and actuator feedback paths.

Use Value: Achieves ASIL D decomposition through hardware-isolated M7 lockstep execution and ECC-protected SRAM for runtime integrity checking.

FOTA Master Controller Secure Key Management Node

Use Scenario: Orchestrating over-the-air software updates across 50+ ECUs in a vehicle, verifying signatures and managing rollback protection.

IC Role / Device Role / Timing Role: Secure boot root-of-trust and cryptographic signing engine using HSE_H and eFuses for lifecycle management.

Use Value: Enables UNECE R155-compliant secure update pipelines with zero-trust verification and tamper-evident key storage.

Use Scenario: Generating, storing, and provisioning cryptographic keys for V2X communication, secure boot, and TLS channel establishment.

IC Role / Device Role / Timing Role: Hardware-secured key vault leveraging HSE_H asymmetric crypto engines and OTP eFuses for immutable identity binding.

Use Value: Eliminates need for external secure elements by providing certified key generation, storage, and attestation within the SoC.

Equivalent & Alternatives

The following parts are listed as comparable options for similar vehicle network processor applications.

Alternative Part Technical Difference Application Difference Selection Advice
S32G274AABK1VUCR Superset variant: adds second Cortex-A53 cluster (4 cores total), 16× CAN FD in LLCE, and full PCIe Gen3 dual-lane support. Required for higher-throughput gateways needing >4 Gbps Ethernet aggregation or >32 CAN FD endpoints. Select when full S32G2 feature set is needed; S32G254AABK1VUCR offers cost-optimized balance for mid-tier domain controllers.
S32G234MABK1VUCR Reduced variant: single Cortex-A53 core, 6 MB SRAM, no PCIe SerDes, only 4× CAN FD in LLCE. Suitable for entry-level gateways with <1 Gbps Ethernet bandwidth and limited legacy bus endpoint count. Choose for cost-sensitive applications where dual-A53 clusters and PCIe are unnecessary; retains same safety/security IP blocks.

Compared with S32G254AABK1VUCR, S32G274AABK1VUCR delivers higher compute density and expanded networking capacity for premium gateways, while S32G234MABK1VUCR reduces silicon area and power for compact domain controllers-both share identical package, safety architecture, and software compatibility.

Availability

S32G254AABK1VUCR is available at Aetrix Electronics and suitable for central gateways, ADAS safety processors, and FOTA master controllers requiring stable component supply across automotive production lifecycles.

Supply support for S32G254AABK1VUCR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in functional safety and automotive-grade SoCs.

The S32G2 family was designed specifically for next-generation vehicle central compute and high-speed networking, targeting ASIL D safety, hardware-enforced security, and scalable performance from entry to premium gateways.

FAQ

What is the maximum operating frequency of the Cortex-A53 cores in the S32G254AABK1VUCR?

The S32G254AABK1VUCR supports a maximum Cortex-A53 core operating frequency of 1000 MHz under specified voltage and thermal conditions. This frequency is achievable with proper power delivery, thermal management, and PLL configuration as defined in the S32G2 Data Sheet Rev. 8. The S32G254AABK1VUCR maintains this performance level across its -40 °C to 105 °C ambient temperature range when implemented per NXP's hardware design guidelines.

Does the S32G254AABK1VUCR include hardware support for functional safety certification?

Yes, the S32G254AABK1VUCR integrates multiple hardware features enabling ASIL D compliance per ISO 26262, including triple-lockstep Cortex-M7 cores, FCCU fault collection unit, MBIST/LBIST memory test engines, ECC on all SRAM and caches, and XRDC-based memory/peripheral isolation. These capabilities are documented in the S32G2 Functional Safety Manual and supported by NXP's FMEDA reports for the S32G254AABK1VUCR.

How much system SRAM does the S32G254AABK1VUCR provide, and is it protected against errors?

The S32G254AABK1VUCR includes 8 MB of on-chip system SRAM with full ECC protection for both read and write operations. This memory is accessible by all CPU clusters and accelerators, and ECC correction is performed transparently in hardware without software intervention. The S32G254AABK1VUCR also provides 32 KB of standby SRAM with ECC for low-power retention use cases.

What networking interfaces are hardware-accelerated in the S32G254AABK1VUCR?

The S32G254AABK1VUCR features three dedicated hardware acceleration blocks: the Packet Forwarding Engine (PFE) for Ethernet classification, firewall, and header manipulation; the Legacy Link Controller Engine (LLCE) for CAN FD, FlexRay v2.1, and LINFlexD offload; and dual PCIe Gen3 SerDes supporting X1/X2 configurations. These accelerators operate independently of the CPU cores to reduce latency and improve determinism in vehicle networking.

Is the S32G254AABK1VUCR pin-compatible with other members of the S32G2 family?

No, the S32G254AABK1VUCR is not pin-compatible with S32G234MABK1VUCR or S32G274AABK1VUCR despite sharing the same 525 FC-PBGA package footprint. Differences in internal routing, power domain allocation, and I/O multiplexing require board-level redesign when migrating between variants. The S32G254AABK1VUCR uses identical package dimensions and ball pitch but has distinct pin assignments for high-speed SerDes, GMAC, and DDR interfaces.

S32G254AABK1VUCR Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
525-FBGA, FCBGA
Series:
-
Packaging:
Tape & Reel (TR)
Product Status:
Active
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
3 Core, 64-Bit/2 Core, 32-Bit
Speed:
400MHz, 1GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L, LPDDR4
Graphics Acceleration:
No
Display & Interface Controllers:
-
Ethernet:
1/2.5Gbps (4)
SATA:
-
USB:
USB 2.0 OTG (1)
Voltage - I/O:
1.2V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Supplier Device Package:
525-FCPBGA (19x19)
Additional Interfaces:
DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART

S32G254AABK1VUCR FAQ

1.How can I place an order for S32G254AABK1VUCR through Aetrix?

Please submit a Request for Quotation (RFQ) for S32G254AABK1VUCR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S32G254AABK1VUCR reliable?

The price and inventory of S32G254AABK1VUCR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S32G254AABK1VUCR is usually 5 days.

3.What payment methods are accepted for S32G254AABK1VUCR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S32G254AABK1VUCR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S32G254AABK1VUCR?

S32G254AABK1VUCR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S32G254AABK1VUCR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S32G254AABK1VUCR?

For technical support, including S32G254AABK1VUCR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S32G254AABK1VUCR requirements.

6.How does Aetrix verify that S32G254AABK1VUCR is sourced from the original manufacturer or authorized distributors?

All S32G254AABK1VUCR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S32G254AABK1VUCR meets industry standards.

7.What is the process for return or replacement of S32G254AABK1VUCR?

All S32G254AABK1VUCR units undergo pre-shipment inspection (PSI). If there is an issue with S32G254AABK1VUCR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S32G254AABK1VUCR part is unused and in its original packaging.

Return procedure for S32G254AABK1VUCR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

S32G254AABK1VUCR Tags

  • S32G254AABK1VUCR
  • S32G254AABK1VUCR PDF
  • S32G254AABK1VUCR Datasheet
  • S32G254AABK1VUCR Specifications
  • S32G254AABK1VUCR Images
  • NXP Semiconductors
  • NXP Semiconductors S32G254AABK1VUCR
  • Buy S32G254AABK1VUCR
  • S32G254AABK1VUCR Price
  • S32G254AABK1VUCR Distributor
  • S32G254AABK1VUCR Supplier
  • S32G254AABK1VUCR Wholesale
Related Products
AT91SAM9260B-CU-999
AT91SAM9260B-CU-999

Microchip Technology

AT91SAM9G25-CU
AT91SAM9G25-CU

Microchip Technology

ATSAMA5D27C-CU
ATSAMA5D27C-CU

Microchip Technology

AT91SAM9X35-CU
AT91SAM9X35-CU

Microchip Technology

AT91SAM9X25-CU
AT91SAM9X25-CU

Microchip Technology

MCIMX6Y2CVM08AB
MCIMX6Y2CVM08AB

NXP Semiconductors

AM3352BZCZ100
AM3352BZCZ100

Texas Instruments

AT91SAM9260B-CU
AT91SAM9260B-CU

Microchip Technology

AT91SAM9260B-QU
AT91SAM9260B-QU

Microchip Technology

ATSAMA5D31A-CU
ATSAMA5D31A-CU

Microchip Technology

AT91SAM9G20B-CU-999
AT91SAM9G20B-CU-999

Microchip Technology

MCIMX6Y2CVM05AB
MCIMX6Y2CVM05AB

NXP Semiconductors

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER