NXP Semiconductors S32G274ASBK1VUCR
- Part No.:
- S32G274ASBK1VUCR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 525-FBGA, FCBGA
- Datasheet:
-
S32G274ASBK1VUCR.pdf
- Description:
- S32G274A ARM CORTEX-M7 AND -A53,
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
S32G274ASBK1VUCR from NXP Semiconductors is a high-performance automotive vehicle network processor integrating dual Cortex-A53 application cores (1 GHz), triple lockstep Cortex-M7 real-time cores (400 MHz), 8 MB system SRAM with ECC, and hardware-accelerated networking including PFE-based Ethernet packet forwarding, LLCE for CAN/FlexRay/LIN offload, and dual PCIe Gen3 SerDes. It serves as a central gateway or domain controller in ASIL D–compliant vehicle architectures requiring protocol translation between Ethernet, CAN FD, FlexRay, and LIN.
For engineers reviewing the S32G274ASBK1VUCR datasheet, S32G274ASBK1VUCR pinout, S32G274ASBK1VUCR application, or S32G274ASBK1VUCR equivalent, key selection criteria include functional safety certification (ISO 26262 ASIL D), hardware security subsystem (HSE_H), deterministic real-time processing via lockstep M7 clusters, and integrated network acceleration for time-critical automotive gateways and FOTA masters.
Technical Context
The S32G274ASBK1VUCR implements a heterogeneous compute architecture with two independent Cortex-A53 clusters (dual-core each, cache-coherent via CoreLink GIC-500) and three lockstep Cortex-M7 cores-enabling concurrent high-level OS execution and safety-critical control. Its NoC-based fabric interconnects memory, accelerators, and I/O with XRDC-enforced resource isolation across eight secure domains.
Networking is accelerated through dedicated hardware blocks: the Packet Forwarding Engine (PFE) supports stateful firewall, classification, and IEEE 1588v2 timestamping at line rate; the Low-Latency Communication Engine (LLCE) handles up to 16 CAN FD channels, 1 FlexRay dual-channel interface, and 7 LINFlexD modules-all with transport-layer offload and zero-copy DMA.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Architecture | Dual Cortex-A53 clusters (2×2 cores, 1 GHz max) + triple lockstep Cortex-M7 cores (400 MHz max) for ASIL D–compliant real-time control and application processing. |
| Memory | 8 MB on-chip system SRAM with ECC, 32 KB standby SRAM with ECC, DDR3L/LPDDR4 interface, QuadSPI NOR + eMMC/SDXC NAND support. |
| Networking | 4 Ethernet MACs (3×PFE_MAC + 1×GMAC), MII/RMII/RGMII/SGMII PHY support, dual PCIe Gen3 ×2 SerDes, 16×CAN FD (LLCE), 1×FlexRay (dual-channel), 7×LINFlexD. |
| Security | HSE_H cryptographic subsystem (AES/CMAC offload, RNG, secure boot), Arm TrustZone®, XRDC memory isolation, OTFAD, eFuses, secure debug. |
| Safety | ISO 26262 ASIL D compliant, lockstep CPU clusters, FCCU fault collection, MBIST/LBIST, dual safe DMA, 7×SWT, 8×STM, 12×FTM timers. |
| Package | 525-ball FC-PBGA, 19 mm × 19 mm, 0.8 mm pitch, rated for -40 °C to 105 °C ambient operation. |
Pinout & Package
Package: 525-ball flip-chip plastic ball grid array (FC-PBGA), 19 mm × 19 mm, 0.8 mm pitch, RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDD_STBY, VDD_LV_PLL | Core power domains | 0.72–0.87 V supplies for logic, standby, and PLL digital circuits; require tight voltage regulation and shared filtering per datasheet guidance. |
| VDD_IO_A / VDD_IO_B | GPIO I/O supply banks | 3.08–3.52 V domains supporting 3.3 V-tolerant digital I/O; each bank powers distinct GPIO groups with independent current limits (≤120 mA RMS). |
| VDD_IO_GMAC0 / VDD_IO_GMAC1 | Ethernet PHY I/O supplies | Configurable 1.68–1.92 V (1.8 V) or 3.08–3.52 V (3.3 V) supplies for GMAC interfaces; must match connected PHY voltage requirements. |
| VDD_DDR0 / VDD_IO_DDR0 | DDR memory interface supplies | 1.68–1.92 V core and 1.06–1.45 V I/O supplies for LPDDR4 (1.1 V) or DDR3L (1.35 V); ripple tolerance ≤ ±2.5% for LPDDR4, ≤ ±5% for DDR3L. |
| PCIe_REFCLKn / PCIe_TXn / PCIe_RXn | PCIe Gen3 SerDes lanes | Differential reference clock and high-speed serial I/O for two independent PCIe controllers; require controlled impedance routing and AC coupling. |
Key Features
| Feature | Design Value |
|---|---|
| Hardware Network Acceleration | PFE enables full-line-rate Ethernet packet inspection, classification, and header manipulation without CPU intervention-reducing latency for ADAS gateway routing. |
| Functional Safety Infrastructure | Triple lockstep Cortex-M7 cores with dedicated NVICs, FCCU fault monitor, and dual safe DMA ensure deterministic response for ASIL D safety islands. |
| Secure Boot & Cryptographic Offload | HSE_H subsystem performs AES-128/256 encryption, CMAC authentication, and RSA/ECC key generation-enabling secure FOTA updates without exposing keys to software. |
| Resource Domain Isolation | XRDC enforces strict memory and peripheral access control across 8 configurable domains, preventing interference between safety-critical and non-safety partitions. |
| Time-Sensitive Networking Support | Integrated IEEE 1588v2 timestamping engine and AVB QoS support enable precise synchronization for camera/radar sensor fusion in autonomous driving systems. |
Applications
| Central Vehicle Gateway | Safety-Critical ADAS Processor |
|---|---|
Use Scenario: Aggregating and translating messages between 10+ ECUs using CAN FD, FlexRay, LIN, and 1000BASE-T1 Ethernet in next-gen E/E architectures. IC Role / Device Role / Timing Role: Central protocol translator and firewall enforcing domain separation between infotainment, chassis, and ADAS networks. Use Value: Reduces gateway BOM by eliminating discrete network accelerators and external safety microcontrollers while meeting ASIL D decomposition requirements. |
Use Scenario: Running ISO 26262–compliant sensor fusion algorithms for L2+/L3 autonomous driving, with real-time validation of radar/camera inputs. IC Role / Device Role / Timing Role: Dual-role processor: Cortex-A53 executes perception stack under Linux; lockstep Cortex-M7 cluster validates outputs and triggers fail-safe actions. Use Value: Achieves ASIL D compliance via hardware-enforced partitioning-no software-only safety mechanisms required for critical path monitoring. |
| FOTA Master Controller | Secure Key Management Node |
Use Scenario: Managing over-the-air software updates across 30+ vehicle ECUs, verifying signatures, decrypting payloads, and orchestrating secure installation. IC Role / Device Role / Timing Role: Root-of-trust anchor with HSE_H cryptographic engine and secure boot chain ensuring only authenticated images execute. Use Value: Eliminates need for external secure elements-key derivation, signature verification, and encrypted storage all occur inside tamper-resistant HSE_H. |
Use Scenario: Generating, storing, and provisioning cryptographic keys for vehicle-to-infrastructure (V2I) and vehicle-to-vehicle (V2V) communication in C-V2X deployments. IC Role / Device Role / Timing Role: Hardware-isolated key vault with eFuse-backed lifecycle management and side-channel resistant crypto operations. Use Value: Meets UNECE R155 cybersecurity management system (CSMS) requirements by providing auditable, hardware-rooted key governance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar vehicle network processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S32G254A | Single Cortex-A53 cluster (2 cores), 6 MB system SRAM, no PCIe Gen3 SerDes, reduced CAN FD count (12 vs. 16), same safety/security IP. | Targeted at cost-sensitive domain controllers with lower bandwidth needs; lacks dual PCIe for camera/radar expansion. | Select when PCIe Gen3 and full 16-CAN FD capacity are unnecessary-reduces thermal load and PCB layer count. |
| R-Car H3 | ARM Cortex-A57/A53 quad-core, no lockstep M7, no integrated LLCE/PFE, relies on software-based networking stacks, lower ASIL support (ASIL B). | Suitable for infotainment head units or telematics, not certified for ASIL D gateway or ADAS safety islands. | Choose only for non-safety-critical applications where Linux performance dominates over functional safety and hardware offload. |
Compared with S32G254A and R-Car H3, the S32G274ASBK1VUCR uniquely delivers ASIL D–certified dual-cluster A53 compute, lockstep M7 real-time control, and hardware-accelerated networking in a single die-enabling consolidated gateway + safety processor designs without compromise on certification or throughput.
Availability
S32G274ASBK1VUCR is available at Aetrix Electronics and suitable for central vehicle gateways, ASIL D ADAS domain controllers, and secure FOTA master nodes requiring stable component supply across automotive production lifecycles.
Supply support for S32G274ASBK1VUCR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in functional safety and automotive-grade SoCs.
The S32G2 family-including S32G274ASBK1VUCR-is designed specifically for high-performance, safety-certified vehicle network processors that unify Ethernet, legacy automotive buses, and hardware security in centralized E/E architectures.
FAQ
What is the maximum operating frequency of the Cortex-A53 and Cortex-M7 cores in the S32G274ASBK1VUCR?
The S32G274ASBK1VUCR supports a maximum Cortex-A53 core frequency of 1000 MHz and a maximum Cortex-M7 core frequency of 400 MHz. These frequencies are achievable under specified operating conditions including junction temperature ≤125 °C, core supply voltage (VDD) within 0.72–0.87 V, and proper PLL configuration. The S32G274ASBK1VUCR datasheet confirms these values in Table 4 (Operating Conditions) and specifies that frequency modulation must respect the nominal + half-modulation-depth limit.
Does the S32G274ASBK1VUCR support ASIL D compliance out of the box?
Yes, the S32G274ASBK1VUCR is designed and qualified to meet ISO 26262 ASIL D requirements. It includes lockstep Cortex-M7 cores with dedicated fault monitors (FCCU), dual safe DMA, memory built-in self-test (MBIST/LBIST), and hardware-enforced partitioning via XRDC. Full ASIL D compliance requires correct configuration per NXP's S32G2 Functional Safety Manual-but the S32G274ASBK1VUCR silicon itself provides all necessary hardware mechanisms.
What types of Ethernet interfaces does the S32G274ASBK1VUCR support?
The S32G274ASBK1VUCR supports four Ethernet MACs: three PFE_MAC ports and one GMAC_0 port. Physical layer interfaces include MII, RMII, RGMII, and SGMII. It also integrates two PCIe Gen3 SerDes lanes-each configurable for PCIe or SGMII-enabling flexible high-speed Ethernet expansion beyond on-die MACs. All Ethernet timing features include IEEE 1588v2 hardware timestamping and AVB QoS support.
How much on-chip SRAM does the S32G274ASBK1VUCR include, and what protection features apply?
The S32G274ASBK1VUCR includes 8 MB of system SRAM with end-to-end ECC protection and 32 KB of standby SRAM also protected by ECC. This SRAM is accessible by both Cortex-A53 and Cortex-M7 clusters via the NoC fabric. The ECC implementation detects and corrects single-bit errors and detects double-bit errors-critical for ASIL D data integrity in safety-critical applications running on the S32G274ASBK1VUCR.
What security features are integrated into the S32G274ASBK1VUCR?
The S32G274ASBK1VUCR integrates the HSE_H (Hardware Security Engine – High) subsystem, which provides AES-128/256 encryption/decryption, CMAC authentication, SHA-256 hashing, RSA/ECC key generation and signing, true random number generation (TRNG), and secure boot with immutable root-of-trust. It also supports OTFAD (On-The-Fly AES Decryption), Arm TrustZone®, XRDC-based memory isolation, and eFuse-based life-cycle management-all verified in the S32G274ASBK1VUCR security documentation.
S32G274ASBK1VUCR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 525-FBGA, FCBGA
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A53, ARM® Cortex®-M7
- Number of Cores/Bus Width:
- 3 Core, 64-Bit/4 Core, 32-Bit
- Speed:
- 400MHz, 1GHz
- Co-Processors/DSP:
- Multimedia; NEON
- RAM Controllers:
- DDR3L, LPDDR4
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- -
- Ethernet:
- 1/2.5Gbps (4)
- SATA:
- -
- USB:
- USB 2.0 OTG (1)
- Voltage - I/O:
- 1.2V, 1.8V, 2.5V, 3.3V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Security Features:
- ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 525-FCPBGA (19x19)
- Additional Interfaces:
- DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
S32G274ASBK1VUCR FAQ
1.How can I place an order for S32G274ASBK1VUCR through Aetrix?
Please submit a Request for Quotation (RFQ) for S32G274ASBK1VUCR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S32G274ASBK1VUCR reliable?
The price and inventory of S32G274ASBK1VUCR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S32G274ASBK1VUCR is usually 5 days.
3.What payment methods are accepted for S32G274ASBK1VUCR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S32G274ASBK1VUCR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S32G274ASBK1VUCR?
S32G274ASBK1VUCR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S32G274ASBK1VUCR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S32G274ASBK1VUCR?
For technical support, including S32G274ASBK1VUCR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S32G274ASBK1VUCR requirements.
6.How does Aetrix verify that S32G274ASBK1VUCR is sourced from the original manufacturer or authorized distributors?
All S32G274ASBK1VUCR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S32G274ASBK1VUCR meets industry standards.
7.What is the process for return or replacement of S32G274ASBK1VUCR?
All S32G274ASBK1VUCR units undergo pre-shipment inspection (PSI). If there is an issue with S32G274ASBK1VUCR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S32G274ASBK1VUCR part is unused and in its original packaging.
Return procedure for S32G274ASBK1VUCR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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