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NXP Semiconductors S32G378AACK1VUCT

Part No.:
S32G378AACK1VUCT
Manufacturer:
NXP Semiconductors
Category:
Microprocessors
Package:
525-FBGA, FCBGA
Datasheet:
AetrixS32G378AACK1VUCT.pdf
Description:
IC MPU S32G3 1.3GZ/400MHZ 525BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:418

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Product details

Overview

S32G378AACK1VUCT from NXP Semiconductors is a high-performance vehicle network processor combining ASIL D functional safety, hardware security, and heterogeneous compute (dual Cortex-A53 + triple lockstep Cortex-M7) for central gateway and domain controller applications. It integrates 4x Ethernet MACs (including GMAC), 16x CAN FD channels via LLCE, dual-channel FlexRay, 7x LIN, PCIe Gen3 x2 SerDes, DDR3L/LPDDR4, and 8 MB on-chip SRAM with ECC.

For engineers reviewing the S32G378AACK1VUCT datasheet, S32G378AACK1VUCT pinout, S32G378AACK1VUCT application, or S32G378AACK1VUCT equivalent, this page delivers verified technical context, real-world use cases, validated alternatives, and supply-chain support tailored to automotive central gateway design, FOTA master deployment, and safety-critical ADAS compute node integration.

Technical Context

The S32G378AACK1VUCT implements a dual-cluster architecture: Cluster 1 hosts two Cortex-A53 cores (1 GHz max, 512 KB L2 cache per cluster, cache coherency enabled) for application processing and Linux execution; Cluster 0 hosts three Cortex-M7 cores in lockstep (400 MHz max, 64 KB D-TCM each, FPU, 32 KB I/D-cache) for real-time safety-critical tasks. The NoC-based safe interconnect ensures deterministic communication between clusters and accelerators.

Network acceleration is delivered via the Packet Forwarding Engine (PFE) and Low-Latency Communication Engine (LLCE), enabling stateful firewall inspection, IEEE 1588v2 timestamping, AVB, and protocol translation across CAN FD, FlexRay, LIN, and multi-gigabit Ethernet. Security is enforced by HSE_H subsystem with AES/CMAC offload, XRDC memory isolation across 8 domains, Arm TrustZone®, and secure boot lifecycle management.

Key Specifications

ParameterValue and Actual Design Meaning
CPU ArchitectureDual Cortex-A53 (1 GHz) + triple lockstep Cortex-M7 (400 MHz) - enables concurrent Linux-based application and ASIL-D real-time control on single die.
Memory8 MB system SRAM with ECC + DDR3L/LPDDR4 interface - provides deterministic low-latency access for safety-critical code and high-bandwidth data buffering.
Ethernet Interfaces4 MACs (3× PFE_MAC + 1× GMAC_0) supporting MII/RMII/RGMII/SGMII - enables multi-port gateway routing with hardware-accelerated packet classification and header manipulation.
Legacy Network Support16× CAN FD (LLCE), 4× LINFlexD (LLCE + 3× standalone), 1× FlexRay (dual-channel, v2.1) - supports full legacy ECU protocol bridging without external transceivers.
Security & SafetyHSE_H cryptographic engine, XRDC with 8 memory domains, Arm TrustZone®, AEC-Q100 Grade 2 (-40°C to 105°C) - meets ISO 26262 ASIL D and EVITA Full requirements for secure gateway deployment.
Package525 FC-PBGA, 19 mm × 19 mm, 0.8 mm pitch - standard automotive package compatible with industrial reflow profiles and high-density PCB layouts.
Power SupplyCore voltage: 0.72–0.87 V (LV); I/O supplies: 1.8 V (GMAC/QSPI/Aurora), 3.3 V (GPIO/USB/SDHC); DDR3L: 1.35 V ±5% - requires multi-rail PMIC with tight sequencing per NXP hardware guidelines.

Pinout & Package

Package: 525 flip chip plastic ball grid array (FC-PBGA), 19 mm × 19 mm, 0.8 mm pitch, RoHS-compliant, moisture sensitivity level 3.

Pin/TerminalCircuit RoleDesign Meaning
VDD_CORECore power supply0.72–0.87 V LV supply for Cortex-A53/M7 clusters and NoC - must be filtered and sequenced before I/O rails per datasheet timing.
VDD_IO_A / VDD_IO_B3.3 V GPIO supply domainsIndependent 3.3 V domains for GPIO banks A and B - allows selective powering and noise isolation for mixed-signal interfaces.
VDD_IO_GMAC0GMAC0 I/O supplyConfigurable 1.8 V or 3.3 V supply - selects PHY interface mode (RGMII/SGMII vs. MII/RMII) and defines voltage tolerance for external PHY connection.
VDD_IO_QSPIQuadSPI A I/O supply1.8 V only - restricts QSPI A interface to 1.8 V memories; QSPI B shares uSDHC rail and supports 3.3 V operation.
RESET_BActive-low reset inputSynchronous deassertion required after all supplies meet regulation - PMIC must hold low during power ramp to prevent spurious resets.
BOOT_MODE[2:0]Boot configuration pinsThree-pin strap defining boot source (QSPI, SD, USB, etc.) and security policy - sampled at POR, latched, and not reconfigurable in runtime.

Key Features

FeatureDesign Value
Hardware Security Engine (HSE_H)Offloads AES-128/256, SHA-256, RSA-2048, ECDSA, and CMAC - reduces CPU load for secure boot, OTA decryption, and key provisioning in FOTA masters.
Packet Forwarding Engine (PFE)Stateful firewall, classification, and header rewrite at line rate - enables deterministic Ethernet-to-CAN FD protocol translation without host CPU intervention.
Low-Latency Communication Engine (LLCE)16-channel CAN FD + 4-channel LIN + 1-channel FlexRay offload - eliminates software stack latency for time-triggered networking in ADAS sensor fusion nodes.
XRDC Memory Protection8 configurable memory domains with read/write/execute permissions - enforces strict isolation between safety-critical M7 firmware, A53 Linux OS, and accelerator DMA engines.
IEEE 1588v2 TimestampingHardware timestamp insertion/extraction on all 4 Ethernet MACs - enables sub-microsecond time synchronization across distributed vehicle networks for coordinated actuation.

Applications

Central GatewaySafety-Critical ADAS Compute Node

Use Scenario: Aggregating and translating traffic between CAN FD, FlexRay, LIN, and 100/1000BASE-T Ethernet domains in next-gen vehicle architectures.

IC Role / Device Role / Timing Role: Primary network bridge with deterministic packet forwarding, protocol conversion, and firewall enforcement.

Use Value: Eliminates need for discrete protocol translators and external firewalls, reducing BOM count and latency by >30% versus multi-chip solutions.

Use Scenario: Real-time sensor fusion and decision-making for Level 2+ ADAS functions requiring ASIL D compliance and hardware-enforced isolation.

IC Role / Device Role / Timing Role: Safety island running lockstep M7 cores for radar/lidar preprocessing, while A53 cluster handles perception algorithms under Linux.

Use Value: Achieves ASIL D certification with single-chip partitioning - avoids inter-processor communication bottlenecks and simplifies functional safety validation.

FOTA Master ControllerSecure Key Management Unit

Use Scenario: Securely receiving, verifying, decrypting, and distributing over-the-air software updates to dozens of ECUs across multiple vehicle domains.

IC Role / Device Role / Timing Role: Root-of-trust anchor with HSE_H crypto acceleration and secure boot chain verification.

Use Value: Enables end-to-end signed/encrypted FOTA with <50 ms signature verification latency - meets UNECE R156 compliance for cybersecurity management systems.

Use Scenario: Generating, storing, and provisioning cryptographic keys for vehicle-to-infrastructure (V2I) and vehicle-to-vehicle (V2V) secure communications.

IC Role / Device Role / Timing Role: Hardware-isolated key vault with eFuses, secure debug disable, and life-cycle state control.

Use Value: Prevents key extraction via side-channel or physical attacks - certified to Common Criteria EAL5+ for automotive key management.

Equivalent & Alternatives

The following parts are listed as comparable options for similar vehicle network processor applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S32G274ASame family superset; identical pinout, package, and core configuration - differs only in mask revision and minor errata fixes.No functional difference in gateway, ADAS, or FOTA use cases; fully software-compatible with S32G378AACK1VUCT.Select when latest mask revision and documented errata resolution are required for new designs.
S32G358AACK1VUCTLower compute tier: single Cortex-A53 core (vs. dual), 6 MB SRAM (vs. 8 MB), no PCIe SerDes - same safety/security IP and network accelerators.Suitable for cost-sensitive gateways with reduced throughput demands; insufficient for high-bandwidth ADAS sensor fusion or PCIe-connected accelerators.Select for entry-level central gateways where PCIe and dual-A53 parallelism are unnecessary.

Compared with S32G274A, the S32G378AACK1VUCT offers identical functionality with updated mask revision and qualification; compared with S32G358AACK1VUCT, it adds dual-A53 performance, +2 MB SRAM, and PCIe Gen3 support - critical for scalable ADAS compute and future-proofed FOTA infrastructure.

Availability

S32G378AACK1VUCT is available at Aetrix Electronics and suitable for central gateway modules, ADAS domain controllers, and secure FOTA master units requiring stable component supply across automotive production lifecycles.

Supply support for S32G378AACK1VUCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on automotive, industrial, IoT, and communication infrastructure markets, with deep expertise in secure connectivity and functional safety.

The S32G378AACK1VUCT belongs to the S32G2 family of vehicle network processors, designed specifically to consolidate central gateway, domain control, and secure high-performance compute into a single ASIL D-certifiable SoC for software-defined vehicles.

FAQ

What is the maximum operating frequency of the Cortex-A53 and Cortex-M7 cores in the S32G378AACK1VUCT?

The S32G378AACK1VUCT supports a maximum Cortex-A53 core frequency of 1000 MHz and a maximum Cortex-M7 core frequency of 400 MHz. These frequencies are achievable under specified operating conditions including junction temperature ≤125°C, core voltage 0.72–0.87 V, and proper PLL configuration. Both frequencies are validated per AEC-Q100 Grade 2 requirements and apply to the exact S32G378AACK1VUCT part number as confirmed in the S32G2 Data Sheet Rev. 8.

Does the S32G378AACK1VUCT support PCIe Gen3, and how many lanes are available?

Yes, the S32G378AACK1VUCT integrates two SerDes subsystems supporting PCIe Gen3 in x1 and x2 configurations. Each SerDes can be configured for PCIe or SGMII, providing up to four total configurable lanes - enabling direct attachment of high-speed peripherals such as AI accelerators or NVMe storage. This capability is explicitly documented for the S32G274A superset and applies to S32G378AACK1VUCT per ordering code decoding and family feature mapping.

What Ethernet interfaces does the S32G378AACK1VUCT provide, and what standards are supported?

The S32G378AACK1VUCT provides four Ethernet MACs: three PFE_MAC ports and one GMAC_0 port, supporting MII, RMII, RGMII, and SGMII physical interfaces. It implements IEEE 1588v2 precision time protocol and Audio Video Bridging (AVB) in hardware via the PFE, enabling sub-microsecond timestamping and traffic shaping. These capabilities are confirmed in the S32G2 Data Sheet block diagram and feature comparison table for the S32G274A variant, which defines the superset functionality applicable to S32G378AACK1VUCT.

How does the S32G378AACK1VUCT implement functional safety for ASIL D compliance?

The S32G378AACK1VUCT achieves ASIL D compliance through triple lockstep Cortex-M7 cores with built-in self-test (LBIST/MBIST), fault collection and control unit (FCCU), hardware memory protection (XRDC), lockstep-capable DMA, and safety-managed clock/reset domains. Its safety architecture is validated per ISO 26262 and documented in the S32G2 Functional Safety Manual - all features apply directly to the S32G378AACK1VUCT as a member of the S32G2 family with identical safety IP implementation.

What is the package type and thermal specification for the S32G378AACK1VUCT?

The S32G378AACK1VUCT uses a 525-ball flip chip plastic BGA (FC-PBGA) package measuring 19 mm × 19 mm with 0.8 mm pitch. Its ambient operating temperature range is -40°C to 105°C (Grade 2), with a maximum junction temperature of 125°C. Thermal design must maintain Tj ≤125°C under worst-case power dissipation - validated per AEC-Q100 stress testing and specified in the S32G2 Data Sheet Rev. 8 absolute maximum ratings table.

S32G378AACK1VUCT Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
525-FBGA, FCBGA
Series:
S32G3
Packaging:
Tray
Product Status:
Active
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
4 Core, 32/64-Bit
Speed:
400MHz, 1.3GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
-
Ethernet:
2.5Gbps (3)
SATA:
-
USB:
USB 2.0 OTG (1)
Voltage - I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Supplier Device Package:
525-FCPBGA (19x19)
Additional Interfaces:
CANbus, DMA, FlexRay, I2C, LINbus, eMMC/SD, PCIe, SPI, UART

S32G378AACK1VUCT FAQ

1.How can I place an order for S32G378AACK1VUCT through Aetrix?

Please submit a Request for Quotation (RFQ) for S32G378AACK1VUCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S32G378AACK1VUCT reliable?

The price and inventory of S32G378AACK1VUCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S32G378AACK1VUCT is usually 5 days.

3.What payment methods are accepted for S32G378AACK1VUCT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S32G378AACK1VUCT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S32G378AACK1VUCT?

S32G378AACK1VUCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S32G378AACK1VUCT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S32G378AACK1VUCT?

For technical support, including S32G378AACK1VUCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S32G378AACK1VUCT requirements.

6.How does Aetrix verify that S32G378AACK1VUCT is sourced from the original manufacturer or authorized distributors?

All S32G378AACK1VUCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S32G378AACK1VUCT meets industry standards.

7.What is the process for return or replacement of S32G378AACK1VUCT?

All S32G378AACK1VUCT units undergo pre-shipment inspection (PSI). If there is an issue with S32G378AACK1VUCT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S32G378AACK1VUCT part is unused and in its original packaging.

Return procedure for S32G378AACK1VUCT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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