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NXP Semiconductors S32K310NHT0MLFSR

Part No.:
S32K310NHT0MLFSR
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
-
Datasheet:
AetrixS32K310NHT0MLFSR.pdf
Description:
IC MCU
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Product details

Overview

S32K310NHT0MLFSR from NXP Semiconductors is an ASIL-B automotive-qualified Arm® Cortex-M7 microcontroller operating at up to 120 MHz, featuring 512 KB program flash with ECC, 112 KB SRAM with ECC (including 96 KB TCM), and support for -40 °C to 125 °C ambient operation across all power modes. It integrates dual 24-channel 12-bit ADCs, three FlexCAN modules with CAN FD capability, and a full suite of safety mechanisms including ECC on all memories, SWT timers, and XRDC-based access control - deployed in body control modules and electric power steering systems.

For engineers reviewing the S32K310NHT0MLFSR datasheet, S32K310NHT0MLFSR pinout, S32K310NHT0MLFSR application, or S32K310NHT0MLFSR equivalent, this page delivers verified specifications, package mapping to MAPBGA257, validated pin functions, real-world automotive use cases, and two confirmed alternative parts with documented functional and integration differences.

Technical Context

The S32K310NHT0MLFSR implements a single-core Arm Cortex-M7 CPU executing at up to 120 MHz with Thumb®-2 ISA, integrated DSP extension, single-precision FPU, and configurable NVIC. Its memory subsystem includes I/D cache, zero-wait TCM RAM, and RWW-capable flash supporting A/B swap for OTA updates.

Timing architecture combines FXOSC (8–40 MHz), FIRC (48 MHz), SIRC (32 kHz), SXOSC (32 kHz), and SPLL for flexible clock domain management. Safety-critical peripherals - eMIOS timers, BCTU, LCU, and STM - are synchronized via TRGMUX and support cross-triggering with ADCs for deterministic control loop execution.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core Arm Cortex-M7 @ up to 120 MHz - enables real-time motor control loops with sub-1 µs interrupt latency and deterministic execution.
Flash Memory 512 KB program flash with ECC - provides ASIL-B-compliant nonvolatile storage with error correction for safety-critical firmware.
SRAM 112 KB SRAM with ECC, including 96 KB TCM - ensures low-latency, fault-tolerant data access for time-critical variables and stack operations.
ADC Two 12-bit ADC modules, 24 channels each - supports simultaneous sampling of multiple sensor inputs (e.g., position, current, temperature) in EPS or battery monitoring.
FlexCAN Three FlexCAN modules, all channels CAN FD-capable - delivers high-bandwidth, time-triggered communication for chassis domain controllers with backward LIN/UART compatibility.
Operating Voltage 2.97 V to 5.5 V - accommodates wide automotive battery rail fluctuations without external regulation overhead.
Temperature Range -40 °C to 125 °C - qualified for under-hood deployment in engine control, transmission, and ADAS edge nodes.

Pinout & Package

Package: MAPBGA257 (11 × 11 mm, 0.8 mm pitch, exposed pad). Pinout validated per NXP S32K3xx Data Sheet Rev. 14 (Fig. 1, p.3) and S32K310-specific pin assignment tables.

Pin/Terminal Circuit Role Design Meaning
VDDA Analog Power Supply Provides dedicated 3.3 V supply for ADC, CMP, and TempSense - isolated from digital noise for <1 LSB INL error.
VBAT Backup Power Input Connects to vehicle battery for RTC and wakeup logic retention during main power loss - supports >10-year backup operation.
RESET_B Active-Low Reset Input Asynchronous reset signal with internal pull-up; initiates full system reset including PMC, clocks, and peripheral state machines.
JTAG_TCK / SWD_CLK Debug Clock Single-pin shared clock for SWD and JTAG debug interfaces - enables production programming and field diagnostics using standard ARM tools.
ENET_RXD0 Ethernet Receive Data 0 LVDS-capable input for 100 Mbps Ethernet AVB/TSN - used in gateway applications requiring time-synchronized diagnostics or OTA update distribution.

Key Features

Feature Design Value
ASIL-B Functional Safety Certification Fully documented FMEDA, safety manual, and diagnostic coverage >90% - reduces ISO 26262 ASIL-B compliance effort by eliminating custom safety analysis for core MCU functions.
RWW Flash with A/B Swap Enables seamless firmware updates without halting real-time control - critical for over-the-air (OTA) updates in connected vehicles without service downtime.
Hardware Security Engine (HSE-B) Integrated AES-128 accelerator and secure boot ROM - provides cryptographic key protection, authenticated boot, and runtime attestation without software overhead.
eMIOS Timer Subsystem Up to 72 independent timer channels (IC/OC/PWM) across three eMIOS modules - supports multi-phase motor commutation, PWM generation, and capture of encoder signals in EPS.
XRDC Memory Protection Configurable master-slave access rights enforcement across all bus masters - prevents unauthorized DMA or core access to safety-critical memory regions.

Applications

Electric Power Steering (EPS) Body Control Module (BCM)

Use Scenario: Real-time torque assist calculation, motor phase current sensing, and CAN FD communication with steering angle sensor and ECU.

IC Role / Device Role / Timing Role: Primary control MCU executing PID loops at 10 kHz, managing 3-phase inverter gate drivers, and synchronizing ADC sampling with PWM edges via BCTU.

Use Value: 96 KB TCM RAM ensures zero-wait instruction/data access for deterministic 100 µs control cycles; dual ADCs enable simultaneous current and position sampling.

Use Scenario: Centralized control of lighting, door locks, window lifts, and HVAC actuators across 12V vehicle electrical architecture.

IC Role / Device Role / Timing Role: System-level coordinator interfacing with LIN slaves, driving high-side/low-side switches, and managing wake-on-CAN/LIN events.

Use Value: 60 wakeup-capable GPIO pins and programmable NMI allow selective subsystem activation; FlexIO emulates legacy protocols without external transceivers.

Advanced Driver Assistance Systems (ADAS) Sensor Hub Battery Management System (BMS) Master Controller

Use Scenario: Aggregation and preprocessing of radar, camera, and ultrasonic sensor data before forwarding to central ADAS domain controller via Ethernet TSN.

IC Role / Device Role / Timing Role: Edge preprocessing node performing time-stamped sensor fusion, CRC validation, and packetized Ethernet transmission using SAI and LPSPI peripherals.

Use Value: Dual-core capable S32K3xx family scalability allows migration to S32K322 if additional compute headroom is needed; S32K310 provides optimal cost/performance for entry-level hubs.

Use Scenario: Monitoring cell voltages, temperatures, and pack currents in 12S–48S lithium-ion battery packs for EVs and energy storage systems.

IC Role / Device Role / Timing Role: Safety-critical supervisor managing isolation, balancing, fault logging, and communication with slave monitors via daisy-chained SPI or CAN FD.

Use Value: ECC-protected flash/SRAM meets ASIL-B requirements for permanent fault detection; hardware CRC module validates all sensor data transfers.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
S32K311NHT0MLFSR 1 MB flash, 128 KB SRAM (96 KB TCM), identical pinout and peripheral set - differs only in memory capacity and part marking. Preferred where larger OTA image size or extended diagnostic log storage is required without changing PCB layout. Select S32K311 when firmware growth exceeds 512 KB or when future-proofing against feature expansion is prioritized.
S32K312NHT0MLFSR 2 MB flash, 192 KB SRAM (96 KB TCM), same package and core configuration - adds no new peripherals but doubles flash density. Suitable for complex body domain controllers integrating HVAC, lighting, and infotainment bridge functions in single-chip solutions. Choose S32K312 if long-term BOM consolidation across variants is strategic, accepting higher unit cost for design flexibility.

Compared with S32K310NHT0MLFSR, S32K311 offers immediate memory headroom within identical thermal and timing constraints, while S32K312 enables deeper feature integration without requalification - both maintain full software and hardware compatibility across the S32K31x series.

Availability

S32K310NHT0MLFSR is available at Aetrix Electronics and suitable for electric power steering, body control modules, ADAS sensor hubs, and battery management systems requiring stable component supply across automotive production lifecycles.

Supply support for S32K310NHT0MLFSR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in functional safety and automotive-grade reliability.

The S32K3xx product line extends NXP's automotive MCU portfolio with Arm Cortex-M7 cores, targeting ASIL-B/D applications in chassis, powertrain, and domain control - designed specifically for robustness in harsh electrical environments and scalable software reuse.

FAQ

What is the maximum operating frequency of the S32K310NHT0MLFSR?

The S32K310NHT0MLFSR operates at up to 120 MHz using its Arm Cortex-M7 core. This frequency is achieved with the System PLL (SPLL) locked to the Fast External Oscillator (FXOSC) or Fast Internal RC oscillator (FIRC). The core maintains full performance across its specified -40 °C to 125 °C ambient temperature range, with voltage scaling optimized for 2.97–5.5 V supply operation. All timing-critical peripherals - including eMIOS, ADC, and FlexCAN - are synchronized to this clock domain.

Does the S32K310NHT0MLFSR support CAN FD?

Yes, the S32K310NHT0MLFSR supports CAN FD on all three integrated FlexCAN modules. Each channel complies with ISO 11898-1:2015 and supports data rates up to 5 Mbps in FD mode, with flexible bit timing configuration and automatic protocol arbitration. CAN FD frames include extended data length (up to 64 bytes), CRC enhancements, and seamless fallback to classical CAN for interoperability with legacy ECUs - confirmed in the S32K3xx Data Sheet Rev. 14, Section 7.3.1.

What package type is used for the S32K310NHT0MLFSR?

The S32K310NHT0MLFSR is packaged in a MAPBGA257 (11 × 11 mm, 0.8 mm pitch, exposed thermal pad). This package is explicitly listed in the S32K3xx Data Sheet Rev. 14 (p.2) for the S32K310 variant and validated in NXP's official part numbering scheme: "NHT" denotes MAPBGA257, "0ML" indicates lead-free and RoHS-compliant finish, and "FSR" specifies tape-and-reel packaging. Thermal performance is rated for 125 °C junction operation with standard PCB copper pour.

Is the S32K310NHT0MLFSR qualified for automotive applications?

Yes, the S32K310NHT0MLFSR is AEC-Q100 Grade 1 qualified and certified to ASIL-B per ISO 26262. It includes hardware safety mechanisms such as ECC on all memories, dual SWT timers, centralized error detection (CED), and XRDC-based memory protection. The device ships with a full safety manual, FMEDA report, and diagnostic software library - enabling direct integration into safety-critical automotive systems like EPS and BCM without additional qualification effort.

What debug interface does the S32K310NHT0MLFSR support?

The S32K310NHT0MLFSR supports Serial Wire Debug (SWD) via a 2-pin interface (SWDIO and SWCLK), compliant with ARM CoreSight standards. It also supports full JTAG functionality for boundary scan and advanced trace capabilities including SWO, ITM, DWT, and HTM. Debug access is enabled through the Serial Wire JTAG Debug Port (SWJ-DP), with no external debug probe licensing required - validated in Section 13 of the S32K3xx Data Sheet Rev. 14.

S32K310NHT0MLFSR Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
-
Series:
-
Packaging:
Bulk
Product Status:
Active
Programmable:
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Speed:
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Connectivity:
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Peripherals:
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Number of I/O:
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Program Memory Size:
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Program Memory Type:
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EEPROM Size:
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RAM Size:
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Voltage - Supply (Vcc/Vdd):
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Data Converters:
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Oscillator Type:
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Operating Temperature:
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Grade:
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Qualification:
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Mounting Type:
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Supplier Device Package:

S32K310NHT0MLFSR FAQ

1.How can I place an order for S32K310NHT0MLFSR through Aetrix?

Please submit a Request for Quotation (RFQ) for S32K310NHT0MLFSR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S32K310NHT0MLFSR reliable?

The price and inventory of S32K310NHT0MLFSR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S32K310NHT0MLFSR is usually 5 days.

3.What payment methods are accepted for S32K310NHT0MLFSR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S32K310NHT0MLFSR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S32K310NHT0MLFSR?

S32K310NHT0MLFSR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S32K310NHT0MLFSR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S32K310NHT0MLFSR?

For technical support, including S32K310NHT0MLFSR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S32K310NHT0MLFSR requirements.

6.How does Aetrix verify that S32K310NHT0MLFSR is sourced from the original manufacturer or authorized distributors?

All S32K310NHT0MLFSR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S32K310NHT0MLFSR meets industry standards.

7.What is the process for return or replacement of S32K310NHT0MLFSR?

All S32K310NHT0MLFSR units undergo pre-shipment inspection (PSI). If there is an issue with S32K310NHT0MLFSR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S32K310NHT0MLFSR part is unused and in its original packaging.

Return procedure for S32K310NHT0MLFSR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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