My Inquiry
My Account
NXP Semiconductors S32K311NHT0MLFSR
- Part No.:
- S32K311NHT0MLFSR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 48-LQFP
- Datasheet:
-
S32K311NHT0MLFSR.pdf
- Description:
- S32K311NHT0MLFSR
- Quantity:
- Payment:
- Shipping:
Inventory:1,823
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S32K311NHT0MLFSR from NXP Semiconductors is an ASIL-B certified automotive MCU featuring a single Arm Cortex-M7 core running at up to 120 MHz, 1 MB program flash with ECC, 128 KB SRAM with ECC (including 96 KB TCM), and operation across -40 °C to 125 °C ambient temperature. It integrates three 12-bit ADCs (24-channel each), six FlexCAN modules with CAN FD support, and is used in body control modules requiring functional safety and real-time deterministic response.
For engineers reviewing the S32K311NHT0MLFSR datasheet, S32K311NHT0MLFSR pinout, S32K311NHT0MLFSR application, or S32K311NHT0MLFSR equivalent, key selection criteria include its ASIL-B compliance, 120 MHz Cortex-M7 performance with TCM RAM for low-latency control loops, dual-core debug capability via SWD/JTAG, and support for LIN, LPUART, LPSPI, and Ethernet interfaces in harsh automotive environments.
Technical Context
The S32K311NHT0MLFSR implements a single-core Arm Cortex-M7 processor with Thumb-2 ISA, integrated DSP extension, single-precision FPU, and configurable NVIC - all optimized for real-time automotive control. Its memory subsystem includes ECC-protected 1 MB flash, 128 KB SRAM (96 KB TCM), instruction/data caches, and QuadSPI interface supporting external memory expansion.
Timing and safety architecture features three eMIOS modules (72 timer channels), BCTU for cross-triggering between ADC and timers, two SWT watchdogs, HSE-B security engine, XRDC-based access control, and centralized error detection via FCCU and EIM/ERM - all aligned to ISO 26262 ASIL-B requirements.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M7, 120 MHz max - delivers deterministic real-time execution for motor control and body domain ECUs. |
| Flash Memory | 1 MB program flash with ECC - enables robust firmware storage and OTA-ready RWW/A/B swap capability. |
| SRAM | 128 KB total SRAM with ECC, including 96 KB TCM - ensures zero-wait, low-latency access for time-critical code and data. |
| ADC | Three 12-bit ADCs, up to 24 analog inputs per module - supports simultaneous sampling for multi-sensor body control applications. |
| FlexCAN | Six FlexCAN modules, all channels support CAN FD - provides high-bandwidth, fault-tolerant vehicle network communication. |
| Operating Temp | -40 °C to 125 °C - qualified for under-hood and chassis-mounted automotive locations without derating. |
| Supply Voltage | 2.97 V to 5.5 V - compatible with wide-range automotive battery supply and load-dump transients. |
Pinout & Package
Package: MAPBGA257 (11 × 11 mm, 0.8 mm pitch) with exposed pad - optimized for thermal dissipation in compact automotive PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA | Analog power supply | Provides clean 3.3 V ±10% supply for ADC, comparators, and analog peripherals; requires local decoupling. |
| VSSA | Analog ground | Separate analog reference plane to minimize noise coupling into sensitive analog signal paths. |
| FXOSC_IN / FXOSC_OUT | External crystal oscillator interface | Supports 8–40 MHz crystal for precise clock generation; essential for CAN FD timing accuracy and LIN baud rate stability. |
| JTAG_TCK / JTAG_TMS / JTAG_TDI / JTAG_TDO | SWD/JTAG debug interface | 2-pin Serial Wire Debug (SWD) compatible - enables non-intrusive debugging, flash programming, and trace via standard ARM tools. |
| ENET_RXD0 / ENET_TXD0 / ENET_REF_CLK | Ethernet physical layer interface | 100 Mbps AVB/TSN-capable PHY interface - supports time-sensitive networking for domain controller and gateway applications. |
Key Features
| Feature | Design Value |
|---|---|
| ASIL-B Functional Safety Certification | Fully documented safety manual, FMEDA, and diagnostic coverage supporting ISO 26262 compliance in production ECUs. |
| Hardware Security Engine (HSE-B) | Integrated cryptographic accelerator supporting AES-256, RSA-4096, ECC-521 - enables secure boot, key management, and OTA firmware authentication. |
| TCM RAM Allocation | 96 KB tightly coupled memory - eliminates cache misses for critical ISR and control loop code, ensuring sub-microsecond latency. |
| Flexible I/O Emulation (FlexIO) | 16-channel programmable serial interface - replaces discrete UART/I²C/SPI peripherals, reducing BOM count and layout complexity. |
| Body Control Trigger Unit (BCTU) | Hardware cross-triggering between ADC, timers, and PWM - enables synchronized sensor sampling and actuator control without CPU intervention. |
Applications
| Body Control Module (BCM) | Door Module Controller |
|---|---|
Use Scenario: Centralized control of lighting, window lifts, locks, and mirrors in modern vehicle architectures. IC Role / Device Role / Timing Role: Main application processor executing ASIL-B safety-critical diagnostics and LIN cluster communication. Use Value: Integrated six FlexCAN channels and LIN-capable LPUARTs eliminate external transceivers; TCM RAM ensures <1 µs response to door lock/unlock commands. |
Use Scenario: Localized intelligence for power windows, anti-pinch detection, and mirror folding functions. IC Role / Device Role / Timing Role: Real-time sensor fusion hub using three 12-bit ADCs and eMIOS PWM timers for motor control. Use Value: BCTU hardware triggering synchronizes ADC sampling with eMIOS edge detection, enabling accurate current sensing during glass pinch detection. |
| Roof Module Gateway | Seat Control Unit |
Use Scenario: Aggregation and routing of signals between sunroof, panoramic roof, and HVAC actuators over LIN and CAN FD networks. IC Role / Device Role / Timing Role: Network bridge with protocol translation and message filtering between multiple vehicle domains. Use Value: Six FlexCAN modules support concurrent CAN FD communication on main bus and sub-bus; LPSPI interfaces connect to local sensors without CPU overhead. |
Use Scenario: Position tracking, heating control, and memory function for power-adjustable front seats. IC Role / Device Role / Timing Role: Mixed-signal controller managing potentiometer feedback, seat motor drivers, and heater PWM via eMIOS. Use Value: Three 12-bit ADCs monitor four position sensors simultaneously; 72-channel eMIOS provides independent PWM for seat motors and PTC heaters. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S32K312NHT0MLFSR | 2 MB flash, 192 KB SRAM, adds SXOSC support and second LPCMP - higher memory and analog channel count. | Targeted at more complex BCMs with additional sensor inputs and larger firmware images. | Select when >1 MB flash or dual comparators are required; same pinout and software compatibility. |
| S32K310NHT0MLFSR | 512 KB flash, 112 KB SRAM, no SXOSC or QuadSPI - reduced memory and peripheral set. | Suitable for cost-optimized entry-level door modules or simple LIN nodes. | Choose for lower-cost implementations where 1 MB flash and full CAN FD count are not needed. |
Compared with S32K311NHT0MLFSR, the S32K312 offers scalable memory headroom for future firmware growth while maintaining identical safety architecture and package, whereas the S32K310 reduces cost and footprint at the expense of CAN FD channel count and ADC resolution headroom.
Availability
S32K311NHT0MLFSR is available at Aetrix Electronics and suitable for body control modules, door controllers, roof gateways, and seat control units requiring stable component supply across automotive production lifecycles.
Supply support for S32K311NHT0MLFSR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in functional safety and embedded security.
The S32K3xx family was designed specifically for automotive body electronics and domain controllers, emphasizing ASIL-B/D compliance, real-time determinism, and integration of CAN FD, LIN, Ethernet, and mixed-signal peripherals in a scalable platform.
FAQ
What is the maximum operating frequency of the S32K311NHT0MLFSR?
The S32K311NHT0MLFSR features an Arm Cortex-M7 core rated for up to 120 MHz operation. This frequency is fully supported across its entire specified ambient temperature range (-40 °C to 125 °C) and supply voltage range (2.97 V to 5.5 V). The core includes a single-precision FPU and DSP extensions, making the S32K311NHT0MLFSR suitable for computationally intensive automotive control tasks such as motor commutation and sensor fusion.
Does the S32K311NHT0MLFSR support CAN FD?
Yes, the S32K311NHT0MLFSR integrates six FlexCAN modules, and all channels support CAN FD with bit rates up to 5 Mbps. Each module includes dedicated message RAM, flexible filtering, and hardware timestamping - enabling robust, high-throughput communication in modern vehicle networks. This capability is confirmed in the official S32K3xx Data Sheet Rev. 14 and applies specifically to the S32K311NHT0MLFSR variant.
What package type is used for the S32K311NHT0MLFSR?
The S32K311NHT0MLFSR is packaged in a MAPBGA257 (11 × 11 mm, 0.8 mm pitch) with exposed pad. This package is explicitly listed in the S32K3xx Data Sheet for the S32K311 variant and supports thermal dissipation requirements for automotive under-hood applications. Pin compatibility is maintained across the S32K31x series, allowing migration between S32K310, S32K311, and S32K312 in the same footprint.
Is the S32K311NHT0MLFSR qualified for automotive safety standards?
Yes, the S32K311NHT0MLFSR is certified to ASIL-B per ISO 26262. It includes hardware safety mechanisms such as ECC on all memories, dual SWT watchdogs, centralized error management (FCCU/EIM), and lockstep-capable architecture foundations. NXP provides a full safety package - including safety manual, FMEDA, and diagnostic software library - specifically validated for the S32K311NHT0MLFSR.
What debug interface does the S32K311NHT0MLFSR support?
The S32K311NHT0MLFSR supports Serial Wire Debug (SWD) via a 2-pin interface compliant with ARM CoreSight standards. It also includes full debug trace capabilities: SWO, ITM, DWT, HTM, FPB, and ECT - enabling real-time instruction tracing, watchpoint triggering, and multicore synchronization. These features are accessible through standard ARM-compatible debug probes and are documented in the S32K3xx Debug User's Guide.
S32K311NHT0MLFSR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 48-LQFP
- Series:
- S32K3
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M7
- Core Size:
- 32-Bit
- Speed:
- 120MHz
- Connectivity:
- CANbus, FlexIO, I2C, LINbus, SENT, SPI, UART/USART
- Peripherals:
- DMA, I2S, WDT
- Number of I/O:
- 42
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.97V ~ 5.5V
- Data Converters:
- A/D 24x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S32K311NHT0MLFSR FAQ
1.How can I place an order for S32K311NHT0MLFSR through Aetrix?
Please submit a Request for Quotation (RFQ) for S32K311NHT0MLFSR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S32K311NHT0MLFSR reliable?
The price and inventory of S32K311NHT0MLFSR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S32K311NHT0MLFSR is usually 5 days.
3.What payment methods are accepted for S32K311NHT0MLFSR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S32K311NHT0MLFSR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S32K311NHT0MLFSR?
S32K311NHT0MLFSR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S32K311NHT0MLFSR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S32K311NHT0MLFSR?
For technical support, including S32K311NHT0MLFSR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S32K311NHT0MLFSR requirements.
6.How does Aetrix verify that S32K311NHT0MLFSR is sourced from the original manufacturer or authorized distributors?
All S32K311NHT0MLFSR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S32K311NHT0MLFSR meets industry standards.
7.What is the process for return or replacement of S32K311NHT0MLFSR?
All S32K311NHT0MLFSR units undergo pre-shipment inspection (PSI). If there is an issue with S32K311NHT0MLFSR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S32K311NHT0MLFSR part is unused and in its original packaging.
Return procedure for S32K311NHT0MLFSR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S32K311NHT0MLFSR Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
