My Inquiry
My Account
NXP Semiconductors S32K311NHT0MPAST
- Part No.:
- S32K311NHT0MPAST
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 100-QFP
- Datasheet:
-
S32K311NHT0MPAST.pdf
- Description:
- S32K311, CES, 100 MAXQFP
- Quantity:
- Payment:
- Shipping:
Inventory:2,025
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S32K311NHT0MPAST from NXP Semiconductors is an ASIL-B automotive-qualified Arm® Cortex-M7 microcontroller operating at up to 120 MHz, featuring 1 MB program flash with ECC, 128 KB SRAM with ECC (including 96 KB TCM), and support for CAN FD, LPUART, LPSPI, and LPI2C interfaces. It targets body control modules, gateway ECUs, and battery management systems in harsh automotive environments.
For engineers reviewing the S32K311NHT0MPAST datasheet, S32K311NHT0MPAST pinout, S32K311NHT0MPAST application, or S32K311NHT0MPAST equivalent, key selection considerations include its 120 MHz Cortex-M7 core with FPU/DSP, -40 °C to 125 °C ambient operation, 2.97–5.5 V supply range, integrated safety features (ASIL-B compliance, ECC on all memories), and flexible package options including HDQFP100 and MAPBGA257.
Technical Context
The S32K311NHT0MPAST implements a single-core Arm Cortex-M7 CPU with Thumb®-2 ISA, Single Precision FPU, and configurable NVIC. Its memory subsystem includes instruction/data caches and TCM RAM optimized for low-latency real-time control loops.
Timing architecture integrates FXOSC (8–40 MHz), FIRC (48 MHz), SIRC/SXOSC (32 kHz), and SPLL for precise clock domain management. Peripheral interconnect uses a 64-bit crossbar fabric supporting concurrent high-bandwidth access to flash, SRAM, and peripherals including eMIOS timers, ADCs, and FlexCAN modules.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M7, 120 MHz max - delivers deterministic real-time performance for automotive control tasks. |
| Flash Memory | 1 MB program flash with ECC - ensures code integrity and supports A/B swap for robust OTA updates. |
| SRAM | 128 KB SRAM with ECC, including 96 KB TCM - enables zero-wait-state execution of time-critical firmware. |
| Operating Voltage | 2.97 V to 5.5 V - compatible with 3.3 V and 5 V automotive power domains without level-shifting. |
| Temperature Range | -40 °C to 125 °C - qualified for under-hood and chassis-mounted ECU deployment. |
| Functional Safety | ISO 26262 ASIL-B compliant - includes hardware redundancy, centralized error detection, and memory ECC/EDC. |
| Communication | Up to 3 FlexCAN (CAN FD), 4 LPUART, 4 LPSPI, 2 LPI2C - meets multi-bus vehicle networking requirements. |
Pinout & Package
Available in HDQFP100 (100-pin heat sink exposed pad) and MAPBGA257 (257-ball fine-pitch array) packages. Pin assignment varies by package; refer to NXP S32K311NHT0MPAST datasheet Figure 2 for HDQFP100 pin mapping.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Core Power Supply | Supplies 1.2 V core voltage via internal regulator; requires external 2.97–5.5 V input. |
| VDDA | Analog Power Supply | Independent 3.3 V analog rail for ADC/CMP reference stability and noise isolation. |
| RESET_B | Active-Low Reset Input | Asynchronous reset signal; asserted low for ≥100 ns initiates full system reset sequence. |
| JTAG_TCK / SWD_CLK | Debug Clock | Single-pin shared clock for both JTAG and Serial Wire Debug protocols. |
| PTA0 / CAN0_TX | FlexCAN Channel 0 Transmit | Dedicated GPIO multiplexed as CAN FD transmitter output with slew-rate control. |
| PTA1 / CAN0_RX | FlexCAN Channel 0 Receive | Dedicated GPIO multiplexed as CAN FD receiver input with filtering and glitch suppression. |
Key Features
| Feature | Design Value |
|---|---|
| Hardware Security Engine (HSE-B) | Integrated cryptographic accelerator supporting AES-128/256, SHA-256, and RSA-2048 - enables secure boot and key provisioning without software overhead. |
| Enhanced Modular I/O System (eMIOS) | Two 24-channel 16-bit timer modules - provides IC/OC/PWM generation with cross-triggering to ADC for synchronized sensor sampling. |
| Body Control Trigger Unit (BCTU) | Hardware event router linking ADC conversions, timer captures, and PWM edges - eliminates CPU polling and reduces interrupt latency. |
| QuadSPI Interface | Supports up to 480 Mbps with 4-bit data width - enables direct XIP execution from external flash, reducing internal memory footprint. |
| Power Management Controller (PMC) | Run and Standby modes with peripheral-specific clock gating - achieves sub-10 µA standby current while retaining RTC and wakeup pin state. |
Applications
| Body Control Module (BCM) | Vehicle Gateway ECU |
|---|---|
|
Use Scenario: Centralized control of lighting, door locks, window lifts, and seat position in modern vehicles. IC Role / Device Role / Timing Role: Primary MCU executing real-time control logic, managing LIN/UART communication with slave nodes, and monitoring switch inputs via GPIO with wakeup capability. Use Value: 60 pins with wakeup support and ASIL-B safety compliance ensure reliable operation during sleep/wake transitions and fault containment in distributed architectures. |
Use Scenario: Aggregation and routing of messages between CAN FD, LIN, and Ethernet domains in zonal vehicle architectures. IC Role / Device Role / Timing Role: Network bridge processor handling protocol translation, message filtering, and firewall enforcement across three independent FlexCAN channels and dual LPI2C buses. Use Value: Dual-core-capable fabric and 120 MHz M7 core enable concurrent packet processing at >500 kbps aggregate throughput without software bottlenecks. |
| Battery Management System (BMS) Sensor Hub | Electric Power Steering (EPS) Auxiliary Controller |
|
Use Scenario: Acquisition and preprocessing of cell voltage, temperature, and current measurements from multi-cell battery packs. IC Role / Device Role / Timing Role: Analog front-end controller interfacing with up to 24-channel 12-bit ADCs, driving internal DACs in comparators for overvoltage/undervoltage threshold detection. Use Value: ECC-protected 128 KB SRAM and TCM RAM guarantee deterministic execution of safety-critical state-of-charge algorithms within <10 µs latency bounds. |
Use Scenario: Secondary control unit supporting torque assist calculation, motor phase current sensing, and fault logging in EPS systems. IC Role / Device Role / Timing Role: Real-time co-processor offloading main EPS MCU by managing eMIOS PWM generation, BCTU-triggered ADC sampling, and CRC-verified CAN FD status reporting. Use Value: Integrated 32-bit RTC with autonomous periodic interrupt and hardware watchdog timers meet ISO 26262 diagnostic coverage requirements for ASIL-B functional safety goals. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S32K312NHT0MPAST | 2 MB flash, 192 KB SRAM, adds SXOSC support and second LPCMP module | Required for larger firmware images or dual-comparator analog monitoring in HVAC actuators | Select when additional non-volatile storage or enhanced analog comparison capability is needed beyond S32K311NHT0MPAST baseline. |
| S32K341NHT0MPAST | ASIL-D lockstep dual-core configuration, 1 MB flash, 256 KB SRAM, HSE-B with extended crypto suite | Mandatory for steering angle sensor fusion or brake-by-wire subfunctions requiring higher safety integrity | Choose only when ISO 26262 ASIL-D decomposition mandates hardware redundancy and lockstep execution not provided by S32K311NHT0MPAST. |
Compared with S32K311NHT0MPAST, S32K312NHT0MPAST extends memory capacity for complex diagnostics and OTA update staging, while S32K341NHT0MPAST replaces single-core deterministic execution with lockstep fault-masking-making it suitable for higher-integrity subsystems but increasing BOM cost and power consumption.
Availability
S32K311NHT0MPAST is available at Aetrix Electronics and suitable for automotive body control modules, vehicle gateway ECUs, and battery management sensor hubs requiring stable component supply across long production lifecycles.
Supply support for S32K311NHT0MPAST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in ARM-based automotive MCUs and edge AI processors.
The S32K3xx product line was designed specifically for next-generation automotive electronic control units requiring ASIL-B/D compliance, real-time determinism, and scalable memory/peripheral integration across body, gateway, and powertrain domains.
FAQ
What is the maximum operating frequency of the S32K311NHT0MPAST?
The S32K311NHT0MPAST operates at a maximum CPU frequency of 120 MHz using its Arm Cortex-M7 core. This frequency is achieved with the System PLL (SPLL) configured from the Fast External Oscillator (FXOSC) or Fast Internal RC oscillator (FIRC). The device maintains full functionality-including ECC memory protection, debug interface, and all peripherals-at this speed across its full -40 °C to 125 °C temperature range. S32K311NHT0MPAST does not support the 160 MHz or 240 MHz variants found in higher-tier S32K3xx family members.
Does the S32K311NHT0MPAST support CAN FD?
Yes, the S32K311NHT0MPAST integrates up to three FlexCAN modules, each supporting CAN FD protocol with bit rates up to 5 Mbps in FD mode and full ISO 11898-1 compliance. All CAN FD channels implement transceiver-independent timing, automatic bitrate switching, and flexible data-length payloads up to 64 bytes. S32K311NHT0MPAST requires external CAN transceivers (e.g., TJA1044, TJA1057) for physical layer interface, and its CAN0_TX/CAN0_RX pins are routed to dedicated GPIOs in HDQFP100 and MAPBGA257 packages.
What package options are available for the S32K311NHT0MPAST?
The S32K311NHT0MPAST is offered in two production-ready packages: HDQFP100 (100-pin heat-sink exposed pad, 0.5 mm pitch) and MAPBGA257 (257-ball fine-pitch array, 0.8 mm ball pitch). Both packages support the full peripheral set and thermal performance required for ASIL-B automotive operation. Pin compatibility is maintained across these variants per the S32K3xx family pin-multiplexing scheme, though exact pin assignments differ-refer to NXP document S32K311NHT0MPAST datasheet Section 5 for HDQFP100 and Section 6 for MAPBGA257 layout details.
How does the S32K311NHT0MPAST handle functional safety certification?
The S32K311NHT0MPAST is certified to ISO 26262 ASIL-B at the device level, with hardware features including ECC on all memories (flash, SRAM, TCM), Error Detection Code (EDC) on data paths, dual SWT watchdog timers, and centralized error management via FCCU. It supports safe startup sequences, runtime self-tests (MBIST/LBIST), and lockstep-capable debug infrastructure. S32K311NHT0MPAST does not include ASIL-D lockstep cores or HSE-B extensions for RSA-4096/ECC-521 found in S32K34x derivatives, limiting its use to ASIL-B decomposed subsystems.
Is QuadSPI supported on the S32K311NHT0MPAST?
Yes, the S32K311NHT0MPAST includes a QuadSPI interface capable of up to 480 Mbps with 4-bit data width, enabling direct XIP (execute-in-place) from external flash devices. This interface supports standard SPI, dual/quad I/O modes, and DDR transfers. It is used for expanding program memory or storing calibration data outside internal flash. S32K311NHT0MPAST does not support the higher-speed 2 Gbps OctalSPI mode or uSDHC interface present in S32K328/S32K338 derivatives.
S32K311NHT0MPAST Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 100-QFP
- Series:
- S32K3
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M7
- Core Size:
- 32-Bit
- Speed:
- 120MHz
- Connectivity:
- CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART
- Peripherals:
- DMA, I2S, WDT
- Number of I/O:
- -
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 112K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.97V ~ 5.5V
- Data Converters:
- A/D 24x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S32K311NHT0MPAST FAQ
1.How can I place an order for S32K311NHT0MPAST through Aetrix?
Please submit a Request for Quotation (RFQ) for S32K311NHT0MPAST on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S32K311NHT0MPAST reliable?
The price and inventory of S32K311NHT0MPAST are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S32K311NHT0MPAST is usually 5 days.
3.What payment methods are accepted for S32K311NHT0MPAST?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S32K311NHT0MPAST transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S32K311NHT0MPAST?
S32K311NHT0MPAST orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S32K311NHT0MPAST order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S32K311NHT0MPAST?
For technical support, including S32K311NHT0MPAST datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S32K311NHT0MPAST requirements.
6.How does Aetrix verify that S32K311NHT0MPAST is sourced from the original manufacturer or authorized distributors?
All S32K311NHT0MPAST products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S32K311NHT0MPAST meets industry standards.
7.What is the process for return or replacement of S32K311NHT0MPAST?
All S32K311NHT0MPAST units undergo pre-shipment inspection (PSI). If there is an issue with S32K311NHT0MPAST, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S32K311NHT0MPAST part is unused and in its original packaging.
Return procedure for S32K311NHT0MPAST:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S32K311NHT0MPAST Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
