NXP Semiconductors S32K311NHT0VLFST
- Part No.:
- S32K311NHT0VLFST
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- -
- Datasheet:
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S32K311NHT0VLFST.pdf
- Description:
- IC MCU 48LQFP
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Product details
Overview
S32K311NHT0VLFST from NXP Semiconductors is an ASIL-B automotive-qualified Arm® Cortex-M7 microcontroller operating at up to 120 MHz, featuring 1 MB program flash with ECC, 128 KB SRAM with ECC (including 96 KB TCM), and support for CAN FD, LPUART, LPSPI, and LPI2C interfaces. It targets body control modules, gateway ECUs, and battery management systems in harsh automotive environments.
For engineers reviewing the S32K311NHT0VLFST datasheet, S32K311NHT0VLFST pinout, S32K311NHT0VLFST application, or S32K311NHT0VLFST equivalent, key selection criteria include its 120 MHz Cortex-M7 core with FPU/DSP, -40 °C to 125 °C ambient operation, 2.97–5.5 V supply range, integrated safety features (ECC, SWT, XRDC), and FlexCAN modules with CAN FD capability.
Technical Context
The S32K311NHT0VLFST implements a single-core Arm Cortex-M7 CPU executing the Armv7 and Thumb®-2 ISA, with a Single Precision Floating Point Unit and configurable NVIC. Its memory subsystem includes instruction/data caches and TCM RAM optimized for low-latency real-time control loops.
Timing architecture integrates FXOSC (8–40 MHz), FIRC (48 MHz), SIRC (32 kHz), SXOSC (32 kHz), and SPLL for flexible clock domain management. Peripheral clock gating via PMC enables selective power-down of non-critical modules during STANDBY mode while retaining wakeup-capable GPIO and RTC functionality.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M7 @ up to 120 MHz with FPU, DSP, and 16 KB I-cache / 16 KB D-cache |
| Flash Memory | 1 MB program flash with ECC and RWW/A-B swap for OTA updates |
| SRAM | 128 KB total SRAM with ECC, including 96 KB tightly coupled memory (TCM) for deterministic interrupt latency |
| Operating Voltage | 2.97 V to 5.5 V - supports direct connection to automotive 3.3 V and 5 V rails without external regulators |
| Temperature Range | -40 °C to +125 °C - qualified for under-hood and chassis-mounted automotive applications |
| FlexCAN Channels | 3 CAN FD-capable controllers - enable high-bandwidth vehicle network communication with backward LIN/UART compatibility |
| DMA Channels | 12-channel DMA with DMAMUX - offloads CPU from peripheral data movement, reducing interrupt overhead |
| ADC | Two 12-bit ADCs, each with up to 24 analog inputs - supports simultaneous sampling for motor current sensing and voltage monitoring |
Pinout & Package
Package: HDQFP100 (100-pin heat sink exposed pad, 0.5 mm pitch). Pinout validated per NXP S32K311 Reference Manual Rev. 14 and S32K3xx Hardware Design Guide.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA / VSSA | Analog Power / Ground | Isolated analog supply domain for ADC/CMP reference stability; requires separate filtering from digital VDD |
| PTA0–PTA31 | GPIO Port A | 32-bit general-purpose port with interrupt/wakeup capability; configurable as LPUART/LPSPI/LPI2C peripherals |
| PTB0–PTB31 | GPIO Port B | 32-bit port supporting eMIOS timer channels, FlexCAN TX/RX, and FlexIO emulation functions |
| PTC0–PTC15 | GPIO Port C | 16-bit port with dedicated ADC input pins and CMP analog comparator outputs |
| FXOSC_IN / FXOSC_OUT | External Crystal Interface | Supports 8–40 MHz crystal oscillator for precise system timing; required for CAN FD bit rate accuracy |
| JTAG_TMS / JTAG_TCK / SWD_DIO / SWD_CLK | Debug Interface | 2-pin Serial Wire Debug (SWD) compliant with ARM CoreSight; enables full debug, trace, and flash programming |
Key Features
| Feature | Design Value |
|---|---|
| ASIL-B Functional Safety Compliance | Integrated FCCU, SWT, ECC on all memories, and centralized error detection - eliminates need for external safety monitors in basic safety architectures |
| Hardware Security Engine (HSE-B) | Provides AES acceleration and secure boot root-of-trust - enables firmware authentication and encrypted OTA updates without software overhead |
| Flexible IO Emulation (FlexIO) | 32-channel module emulating UART, SPI, I2C, I2S, SENT, and PWM - replaces discrete interface ICs and reduces BOM count |
| Body Control Trigger Unit (BCTU) | Hardware cross-triggering between ADC, timers, and comparators - enables synchronized sampling and event-driven control without CPU intervention |
| Real-Time Performance Optimization | Zero-wait-state I/D-TCM, cache, and DMA reduce CPU stalls - achieves deterministic <1 µs interrupt response for motor control loops |
| OTA-Ready Flash Architecture | RWW (Read-While-Write) with A/B swap partitioning - allows background firmware update while application runs from active bank |
Applications
| Body Control Module (BCM) | Electric Power Steering (EPS) Gateway |
|---|---|
Use Scenario: Centralized control of lighting, door locks, window lifts, and HVAC actuators in modern vehicle platforms. IC Role / Device Role / Timing Role: Main application MCU managing LIN clusters, PWM-driven LED drivers, and CAN FD communication with domain controllers. Use Value: Integrated eMIOS timers and FlexIO eliminate external PWM generators; ASIL-B compliance satisfies ISO 26262 requirements for Class C functions. |
Use Scenario: Aggregation and translation of torque sensor, motor position, and EPS ECU status across multiple CAN FD networks. IC Role / Device Role / Timing Role: Gateway processor routing messages between high-speed steering CAN FD bus and lower-speed chassis LIN networks. Use Value: Three independent FlexCAN modules with hardware message filtering reduce CPU load by >40% versus software-based routing. |
| Battery Management System (BMS) Monitor | Automotive Gateway ECU |
Use Scenario: Monitoring cell voltages, temperatures, and pack isolation in 12–48 V EV/HEV battery packs. IC Role / Device Role / Timing Role: Analog acquisition MCU interfacing with multi-cell ADCs, temperature sensors, and isolation barriers. Use Value: Dual 12-bit ADCs with BCTU synchronization capture voltage and temperature simultaneously - critical for accurate state-of-charge estimation. |
Use Scenario: High-integration vehicle gateway consolidating infotainment, telematics, ADAS, and powertrain communications. IC Role / Device Role / Timing Role: Primary MCU handling protocol translation, firewall logic, and secure boot verification across heterogeneous networks. Use Value: HSE-B engine accelerates AES-256 encryption for secure V2X message signing; XRDC enforces strict memory access isolation between domains. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S32K312NHT0VLFST | 2 MB flash, 192 KB SRAM, same core/peripherals but higher memory density | Required for larger firmware images or extended diagnostic logging in Tier-1 modules | Select when firmware size exceeds 1 MB or additional SRAM is needed for complex CAN FD message buffering |
| S32K310NHT0VLFST | 512 KB flash, 112 KB SRAM, identical package and pinout but reduced memory | Suitable for cost-sensitive entry-level BCMs with minimal feature set | Choose for legacy design reuse where existing PCB layout must be retained and memory headroom is sufficient |
Compared with S32K311NHT0VLFST, the S32K312 offers scalable memory for future firmware growth without changing peripherals or safety architecture, while the S32K310 provides a pin-compatible cost reduction path where application code fits within tighter memory constraints.
Availability
S32K311NHT0VLFST is available at Aetrix Electronics and suitable for automotive body control modules, battery management systems, and gateway ECUs requiring stable component supply across extended production lifecycles.
Supply support for S32K311NHT0VLFST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in functional safety and automotive-grade reliability.
The S32K3xx product line delivers scalable Arm Cortex-M7 MCUs optimized for ASIL-B/D automotive applications, emphasizing real-time performance, integrated safety mechanisms, and hardware-accelerated security for next-generation vehicle architectures.
FAQ
What is the maximum operating frequency of the S32K311NHT0VLFST?
The S32K311NHT0VLFST operates at up to 120 MHz using its Arm Cortex-M7 core. This frequency is achieved with the System PLL (SPLL) driven by the Fast External Oscillator (FXOSC) or Fast Internal RC oscillator (FIRC). The core maintains full performance across its specified -40 °C to 125 °C ambient temperature range, and the S32K311NHT0VLFST datasheet confirms this rating under all power modes.
Does the S32K311NHT0VLFST support CAN FD?
Yes, the S32K311NHT0VLFST integrates three FlexCAN modules, each fully supporting CAN FD with data rates up to 5 Mbps and payload lengths up to 64 bytes. CAN FD operation is enabled via hardware message filtering and bit-rate switching logic embedded in the FlexCAN peripheral, and the S32K311NHT0VLFST reference manual specifies full compliance with ISO 11898-1:2015.
What package type is used for the S32K311NHT0VLFST?
The S32K311NHT0VLFST uses the HDQFP100 package: a 100-pin heat sink exposed pad quad flat package with 0.5 mm pitch. This package is explicitly listed in the S32K3xx Data Sheet Rev. 14 for the S32K311 variant and supports thermal dissipation requirements for continuous operation at 120 MHz in automotive under-hood environments.
How much SRAM does the S32K311NHT0VLFST include, and what is its ECC coverage?
The S32K311NHT0VLFST includes 128 KB of SRAM, all protected by Error-Correcting Code (ECC). Of this, 96 KB is allocated as Tightly Coupled Memory (TCM) for ultra-low-latency CPU access, while the remaining 32 KB serves as general-purpose data SRAM. ECC coverage applies to both instruction and data SRAM regions, as confirmed in the S32K311NHT0VLFST memory map section of the reference manual.
Is the S32K311NHT0VLFST qualified for automotive ASIL-B applications?
Yes, the S32K311NHT0VLFST is certified to ASIL-B per ISO 26262:2018. Its safety features include dual watchdog timers (SWT), Fault Collection and Control Unit (FCCU), ECC on all memories, centralized error detection, and hardware memory protection unit (MPU). These capabilities are documented in the S32K311NHT0VLFST functional safety manual and supported by NXP's ASIL-B safety case.
S32K311NHT0VLFST Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
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- Packaging:
- Tray
- Product Status:
- Active
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S32K311NHT0VLFST FAQ
1.How can I place an order for S32K311NHT0VLFST through Aetrix?
Please submit a Request for Quotation (RFQ) for S32K311NHT0VLFST on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S32K311NHT0VLFST reliable?
The price and inventory of S32K311NHT0VLFST are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S32K311NHT0VLFST is usually 5 days.
3.What payment methods are accepted for S32K311NHT0VLFST?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S32K311NHT0VLFST transactions.
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4.How is shipping managed for S32K311NHT0VLFST?
S32K311NHT0VLFST orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S32K311NHT0VLFST order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S32K311NHT0VLFST?
For technical support, including S32K311NHT0VLFST datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S32K311NHT0VLFST requirements.
6.How does Aetrix verify that S32K311NHT0VLFST is sourced from the original manufacturer or authorized distributors?
All S32K311NHT0VLFST products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S32K311NHT0VLFST meets industry standards.
7.What is the process for return or replacement of S32K311NHT0VLFST?
All S32K311NHT0VLFST units undergo pre-shipment inspection (PSI). If there is an issue with S32K311NHT0VLFST, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S32K311NHT0VLFST part is unused and in its original packaging.
Return procedure for S32K311NHT0VLFST:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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