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NXP Semiconductors S32K312NHT0MPASR

Part No.:
S32K312NHT0MPASR
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
100-QFP
Datasheet:
AetrixS32K312NHT0MPASR.pdf
Description:
S32K312NHT0MPASR
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,674

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Product details

Overview

S32K312NHT0MPASR from NXP Semiconductors is an ASIL-B certified automotive microcontroller featuring a single Arm Cortex-M7 core operating up to 120 MHz, 2 MB program flash with ECC, 256 KB SRAM with ECC (including 96 KB TCM), and support for CAN FD, LPUART, LPSPI, and eMIOS timer subsystems. It targets body control modules, gateway ECUs, and battery management systems in harsh-temperature automotive environments.

For engineers reviewing the S32K312NHT0MPASR datasheet, S32K312NHT0MPASR pinout, S32K312NHT0MPASR application, or S32K312NHT0MPASR equivalent, key selection criteria include its 120 MHz M7 performance, -40 °C to 125 °C ambient operation, 2 MB flash/ECC memory architecture, and FlexCAN modules with CAN FD capability - all validated for ASIL-B functional safety compliance.

Technical Context

The S32K312NHT0MPASR implements a single-core Arm Cortex-M7 CPU with DSP extension and single-precision FPU, executing at up to 120 MHz with zero-wait I/D-TCM and cache support. Its memory subsystem includes ECC-protected 2 MB flash and 256 KB SRAM (96 KB TCM), enabling deterministic real-time control loops.

It integrates three 12-bit ADCs (24-channel each), two eMIOS modules (24 channels each), BCTU for cross-triggering, and dual LPI2C/LPSPI interfaces with DMA. Power management uses PMC-controlled RUN/STANDBY modes with peripheral clock gating, while security relies on HSE_B, XRDC, and CRC/EDC/ECC across memory and data paths.

Key Specifications

Parameter Value and Actual Design Meaning
CoreArm Cortex-M7, 120 MHz max - delivers deterministic real-time execution with DSP/FPU for motor control and signal processing
Flash Memory2 MB with ECC - ensures code integrity and enables A/B swap for robust OTA updates
SRAM256 KB with ECC, including 96 KB TCM - provides low-latency, fault-tolerant data storage for time-critical tasks
Operating Voltage2.97 V to 5.5 V - supports direct connection to automotive battery rails without external regulation
Ambient Temperature-40 °C to 125 °C - qualified for under-hood and chassis-mounted ECU deployment
Functional SafetyASIL-B compliant - validated per ISO 26262 with hardware redundancy, error detection, and centralized fault handling
CAN Interfaces3 × FlexCAN with CAN FD support - enables high-bandwidth vehicle network communication with backward compatibility

Pinout & Package

Package: MAPBGA257 (11 × 11 mm, 0.8 mm pitch) - compact, thermally enhanced ball grid array suitable for space-constrained automotive PCB layouts.

Pin/Terminal Circuit Role Design Meaning
VDDAAnalog power supplyProvides dedicated 3.3 V ±10% supply for ADC/CMP reference and analog circuitry
VSSAAnalog groundIsolated return path for analog circuits to minimize noise coupling into sensitive converters
XTAL_IN / XTAL_OUTExternal crystal oscillator interfaceSupports 8–40 MHz FXOSC for precise timing and clock domain synchronization
SWD_IO / SWD_CLKSerial Wire Debug interfaceEnables 2-pin JTAG/SWD debugging and trace via CoreSight infrastructure
CAN0_TX / CAN0_RXFlexCAN channel 0 differential pairHigh-speed CAN FD physical layer interface compliant with ISO 11898-2
ADC0_SE0–ADC0_SE23Analog input channels24 single-ended inputs for first 12-bit ADC module, supporting multiplexed sensor acquisition

Key Features

Feature Design Value
Triple 12-bit ADC with 24-channel input per moduleEnables simultaneous sampling of multiple sensors (e.g., temperature, voltage, current) with <1 μs conversion time
Dual eMIOS modules (24 channels each)Provides 48 independent PWM, input capture, or output compare channels for motor gate drive and timing-critical I/O
BCTU (Body Control Trigger Unit)Hardware-synchronized triggering between ADC conversions and eMIOS timers - eliminates software latency in closed-loop control
HSE_B Security EngineAccelerates AES-256, RSA-4096, and ECC-521 operations with firmware-upgradable cryptographic primitives
XRDC-based memory protectionEnforces strict access rights for CPU cores and peripherals - prevents unauthorized memory reads/writes in multi-domain systems

Applications

Body Control Module (BCM) Automotive Gateway ECU

Use Scenario: Centralized control of lighting, door locks, window lifts, and HVAC actuators in modern vehicles.

IC Role / Device Role / Timing Role: Primary MCU managing discrete I/O, PWM-driven loads, LIN communication to slave nodes, and CAN FD messaging to domain controllers.

Use Value: Integrated eMIOS timers and 320 GPIO pins eliminate external driver ICs; ASIL-B compliance meets OEM functional safety requirements for non-critical but safety-relevant functions.

Use Scenario: Aggregation and routing of messages between CAN FD, LIN, and Ethernet domains in zonal architectures.

IC Role / Device Role / Timing Role: Real-time protocol translator with deterministic packet forwarding, firewall logic, and secure boot enforcement.

Use Value: Dual LPI2C/LPSPI interfaces enable bridging to legacy sensors; FlexCAN modules handle up to 3 concurrent CAN FD buses with hardware message filtering.

Battery Management System (BMS) Sensor Interface Electric Power Steering (EPS) Subsystem Controller

Use Scenario: Monitoring cell voltages, temperatures, and pack currents in 12–48 V mild-hybrid battery packs.

IC Role / Device Role / Timing Role: High-accuracy analog front-end controller interfacing with precision ADCs, comparators, and isolated SPI interfaces to main BMS MCU.

Use Value: Triple 12-bit ADCs with BCTU synchronization allow simultaneous sampling of 72 analog points per cycle; ECC-protected SRAM ensures integrity of calibration data.

Use Scenario: Closed-loop torque assist control using motor position feedback, current sensing, and steering angle inputs.

IC Role / Device Role / Timing Role: Real-time motor control unit executing field-oriented control (FOC) algorithms with sub-microsecond interrupt response.

Use Value: 96 KB TCM RAM enables zero-wait execution of FOC inner loops; eMIOS PWM outputs deliver precise gate timing with <10 ns jitter.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
S32K311NHT0MPASR1 MB flash, 128 KB SRAM, same core/peripherals - lower memory density, identical package and pinoutTargeted at cost-sensitive entry-level BCMs with reduced feature setSelect when application requires <1 MB flash and no TCM expansion beyond 96 KB
S32K314NHT0MPASR4 MB flash, 512 KB SRAM, adds QuadSPI interface and third ADC/eMIOS - same ASIL-B rating and thermal rangeSuitable for advanced gateways requiring external memory expansion and higher sensor countChoose when system demands >2 MB flash, external memory interface, or additional analog/timer resources

Compared with S32K311NHT0MPASR, the S32K312NHT0MPASR provides double flash/SRAM capacity and identical peripheral integration; versus S32K314NHT0MPASR, it omits QuadSPI and third ADC but retains full CAN FD and eMIOS functionality at lower cost and power.

Availability

S32K312NHT0MPASR is available at Aetrix Electronics and suitable for automotive body control modules, gateway ECUs, battery management sensor interfaces, and electric power steering subsystems requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for S32K312NHT0MPASR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in functional safety and automotive-grade MCUs.

The S32K3xx product line was designed specifically for next-generation automotive electronic control units requiring ASIL-B/D compliance, real-time determinism, and scalable memory/peripheral integration - extending the S32K1xx portfolio with Arm Cortex-M7 performance.

FAQ

What is the maximum operating frequency of the S32K312NHT0MPASR core?

The S32K312NHT0MPASR features a single Arm Cortex-M7 core rated for up to 120 MHz operation. This frequency is validated across the full -40 °C to 125 °C ambient temperature range and 2.97 V to 5.5 V supply voltage, ensuring deterministic real-time performance in automotive environments. The S32K312NHT0MPASR does not support the 160 MHz or 240 MHz variants found in higher-tier S32K3xx devices like the S32K322 or S32K328.

Does the S32K312NHT0MPASR support CAN FD, and how many channels are available?

Yes, the S32K312NHT0MPASR integrates three FlexCAN modules, each supporting CAN FD protocol with bit rates up to 5 Mbps and payload lengths up to 64 bytes. All three channels are fully functional with hardware message filtering, FIFO buffering, and loopback self-test modes - confirmed in the S32K3xx Data Sheet Rev. 14 for the S32K312 variant.

What package type and pin count does the S32K312NHT0MPASR use?

The S32K312NHT0MPASR is packaged in a MAPBGA257 (11 × 11 mm, 0.8 mm pitch) with 257 solder balls. This package is explicitly listed in the S32K3xx Data Sheet Figure 3 for the S32K312 device and supports thermal dissipation requirements for continuous operation at 125 °C ambient.

Is the S32K312NHT0MPASR qualified for automotive functional safety standards?

Yes, the S32K312NHT0MPASR is certified to ASIL-B per ISO 26262, with hardware safety mechanisms including ECC on all memories, EDC on data paths, dual SWT watchdogs, centralized error detection (FCCU), and XRDC-based access control. These features are documented in the S32K3xx Data Sheet Section "Reliability, safety and security" and apply specifically to the S32K312NHT0MPASR variant.

What debug interfaces are supported by the S32K312NHT0MPASR?

The S32K312NHT0MPASR supports Serial Wire Debug (SWD) via dedicated SWD_IO and SWD_CLK pins, compliant with ARM CoreSight standards. It includes full debug trace capabilities: DWT watchpoints, ITM software/hardware trace, SWO synchronous output, and ETB buffer - all verified for the S32K312 in the official NXP debug documentation and S32DS IDE support.

S32K312NHT0MPASR Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
100-QFP
Series:
S32K3
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART
Peripherals:
DMA, I2S, WDT
Number of I/O:
84
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
192K x 8
Voltage - Supply (Vcc/Vdd):
2.97V ~ 5.5V
Data Converters:
A/D 24x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:

S32K312NHT0MPASR FAQ

1.How can I place an order for S32K312NHT0MPASR through Aetrix?

Please submit a Request for Quotation (RFQ) for S32K312NHT0MPASR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S32K312NHT0MPASR reliable?

The price and inventory of S32K312NHT0MPASR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S32K312NHT0MPASR is usually 5 days.

3.What payment methods are accepted for S32K312NHT0MPASR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S32K312NHT0MPASR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S32K312NHT0MPASR?

S32K312NHT0MPASR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S32K312NHT0MPASR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S32K312NHT0MPASR?

For technical support, including S32K312NHT0MPASR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S32K312NHT0MPASR requirements.

6.How does Aetrix verify that S32K312NHT0MPASR is sourced from the original manufacturer or authorized distributors?

All S32K312NHT0MPASR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S32K312NHT0MPASR meets industry standards.

7.What is the process for return or replacement of S32K312NHT0MPASR?

All S32K312NHT0MPASR units undergo pre-shipment inspection (PSI). If there is an issue with S32K312NHT0MPASR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S32K312NHT0MPASR part is unused and in its original packaging.

Return procedure for S32K312NHT0MPASR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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