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NXP Semiconductors S32K314EHT1MMMSR
- Part No.:
- S32K314EHT1MMMSR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 257-LFBGA
- Datasheet:
-
S32K314EHT1MMMSR.pdf
- Description:
- S32K314EHT1MMMSR
- Quantity:
- Payment:
- Shipping:
Inventory:4,256
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Product details
Overview
S32K314EHT1MMMSR from NXP Semiconductors is an ASIL-B qualified automotive MCU featuring a single Arm Cortex-M7 core operating up to 160 MHz, 4 MB program flash with ECC, 512 KB SRAM with ECC (including 192 KB TCM), and support for CAN FD, Ethernet AVB/TSN, QuadSPI, and triple 12-bit ADCs. It targets body control modules, gateway ECUs, and chassis domain controllers requiring high-integrity real-time processing in harsh environments.
For engineers reviewing the S32K314EHT1MMMSR datasheet, S32K314EHT1MMMSR pinout, S32K314EHT1MMMSR application, or S32K314EHT1MMMSR equivalent, key selection criteria include its 160 MHz Cortex-M7 performance, ASIL-B safety certification, 4 MB flash + 512 KB SRAM memory configuration, QuadSPI interface for external memory expansion, and integrated hardware security engine (HSE_B) supporting AES acceleration.
Technical Context
The S32K314EHT1MMMSR implements a single-core Arm Cortex-M7 CPU with DSP extension and single-precision FPU, executing at up to 160 MHz with zero-wait-state I/D-TCM for deterministic real-time control. Its memory subsystem includes ECC-protected 4 MB flash, 512 KB SRAM (192 KB TCM), and QuadSPI supporting up to 480 Mbps with 4-bit data width.
Peripherals include six FlexCAN modules (all channels CAN FD-capable), sixteen LPUARTs, six LPSPIs, two LPI2Cs, two SAI audio interfaces, three eMIOS timer modules (72 channels total), and a BCTU for cross-triggering between ADCs and timers-enabling tightly synchronized sensor acquisition and actuator control in automotive domain controllers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | Arm Cortex-M7, single core, up to 160 MHz - delivers deterministic real-time control with DSP/FPU for motor and sensor algorithms. |
| Flash Memory | 4 MB program flash with ECC - ensures code integrity and supports A/B swap for robust OTA updates. |
| SRAM | 512 KB SRAM with ECC, including 192 KB TCM - provides low-latency memory for time-critical ISR and control loops. |
| ADC | Three 12-bit ADCs, up to 24 channels each - enables simultaneous high-resolution analog sensing across multiple vehicle subsystems. |
| CAN FD | Six FlexCAN modules, all channels support CAN FD - allows high-bandwidth, low-latency communication for modern E/E architectures. |
| QuadSPI | 1 × QuadSPI interface, up to 480 Mbps, 4-bit data width - enables fast external flash/RAM expansion without sacrificing internal bus bandwidth. |
| Operating Voltage | 2.97 V to 5.5 V - supports direct connection to automotive battery rails with minimal external regulation. |
| Temperature Range | −40 °C to +125 °C - certified for under-hood and chassis-mounted applications per AEC-Q100 Grade 1. |
Pinout & Package
Package: MAPBGA437 (17 × 17 mm, 0.8 mm pitch) with exposed pad - optimized for thermal dissipation in compact automotive modules and compatible with standard reflow profiles.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_CORE | Core power supply | 1.1 V ±5% regulated input for Cortex-M7 core and cache subsystem; requires low-noise decoupling. |
| VDD_IO | I/O power supply | 1.8–5.5 V configurable rail supporting mixed-voltage GPIO interfacing (e.g., 3.3 V LIN, 5 V sensors). |
| FXOSC_IN / FXOSC_OUT | External crystal oscillator interface | Supports 8–40 MHz crystals for precise clock generation; essential for CAN FD timing accuracy and Ethernet synchronization. |
| ETH_RXD0–ETH_RXD3 | Ethernet receive data lanes | Four-bit RMII/MII interface for 100 Mbps AVB/TSN Ethernet - enables time-synchronized networked control in zonal architectures. |
| CAN_FD0_TX / CAN_FD0_RX | FlexCAN channel 0 differential pair | High-speed CAN FD transceiver interface (up to 5 Mbps) with built-in loopback and bus-off recovery logic. |
| QSPI_D0–QSPI_D3 | QuadSPI data lines | 4-bit bidirectional data bus for external flash/RAM; supports double-data-rate mode to achieve 480 Mbps throughput. |
Key Features
| Feature | Design Value |
|---|---|
| ASIL-B compliance | Fully certified per ISO 26262:2018 Part 5/6 - includes lockstep monitor, ECC on all memories, centralized error detection (FCCU), and hardware watchdogs (SWT). |
| HSE_B security engine | Integrated Hardware Security Engine supporting AES-256, RSA-4096, and ECC-521 - enables secure boot, key management, and firmware encryption without software overhead. |
| Flexible clock architecture | Multiple oscillators (FXOSC, FIRC, SIRC, SXOSC) + SPLL - allows dynamic clock switching between run/standby modes while maintaining CAN/Ethernet timing stability. |
| Real-time peripheral triggering | BCTU + TRGMUX + eMIOS + ADC cross-triggering - eliminates software latency in closed-loop control (e.g., PWM update on ADC end-of-conversion). |
| OTA-ready memory | RWW (Read-While-Write) flash with A/B swap capability - enables seamless field updates with zero downtime and rollback safety. |
| Low-power domain control | PMC with RUN/STANDBY modes and peripheral-specific clock gating - reduces active current to <10 mA while retaining CAN wakeup and RTC functionality. |
Applications
| Body Control Module (BCM) | Vehicle Gateway ECU |
|---|---|
Use Scenario: Centralized control of lighting, door locks, window lifts, and HVAC actuators in 12 V automotive platforms. IC Role / Device Role / Timing Role: Primary real-time controller managing PWM-driven loads, LIN slave coordination, and CAN FD messaging with sub-millisecond response. Use Value: Integrated eMIOS (72 channels) and six FlexCAN modules eliminate external timing ICs and reduce BOM count by 3+ components versus discrete solutions. |
Use Scenario: Aggregation and routing of data between CAN FD, LIN, Ethernet TSN, and FlexIO-emulated protocols in zonal E/E architectures. IC Role / Device Role / Timing Role: High-throughput protocol translator with hardware-accelerated CRC, DMA-managed LPUART/LPSPI, and deterministic Ethernet timestamping. Use Value: Dual-bus Ethernet (100 Mbps AVB/TSN) + 16 LPUARTs enable concurrent OTA updates, diagnostics, and infotainment streaming without CPU intervention. |
| Chassis Domain Controller | Advanced Driver Assistance Systems (ADAS) Sensor Hub |
Use Scenario: Real-time coordination of brake-by-wire, steering angle feedback, and suspension damping signals across distributed ECUs. IC Role / Device Role / Timing Role: Safety-critical timing hub synchronizing ADC sampling, PWM output, and CAN FD transmission using BCTU-triggered eMIOS channels. Use Value: ASIL-B certified ECC memory, dual SWT watchdogs, and XRDC-based memory protection ensure fault containment during transient voltage events. |
Use Scenario: Consolidation of radar, camera, and ultrasonic sensor preprocessing in entry-level ADAS clusters. IC Role / Device Role / Timing Role: Sensor fusion preprocessor running FFT and filtering on Cortex-M7 FPU, with DMA-fed ADC inputs and FlexIO-emulated SENT outputs. Use Value: Triple 12-bit ADCs (72 total channels) + 320 GPIOs allow direct connection of 12+ analog sensors without external multiplexers or signal conditioners. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S32K324EHT1MMMSR | Dual-core Cortex-M7 @ 160 MHz, identical memory (4 MB flash / 512 KB SRAM), same package and pinout. | Required where parallel task execution (e.g., safety monitor + application core) or higher compute throughput is needed. | Select when functional separation or lockstep redundancy is not required but dual-core scheduling improves determinism. |
| S32K344EHT1MMMSR | ASIL-D lockstep dual-core Cortex-M7 @ 160 MHz, identical memory and peripherals, same MAPBGA437 package. | Mandated for ASIL-D systems such as electric powertrain control or automated driving supervisors. | Choose only if full ASIL-D certification and hardware lockstep are contractually required; adds ~15% cost and complexity. |
Compared with S32K314EHT1MMMSR, the S32K324EHT1MMMSR offers dual-core flexibility without safety certification overhead, while the S32K344EHT1MMMSR adds ASIL-D lockstep at the cost of reduced software portability and higher BOM cost-making S32K314EHT1MMMSR optimal for ASIL-B domain controllers balancing performance, safety, and cost.
Availability
S32K314EHT1MMMSR is available at Aetrix Electronics and suitable for automotive body control modules, vehicle gateway ECUs, and chassis domain controllers requiring stable component supply across multi-year production cycles.
Supply support for S32K314EHT1MMMSR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in functional safety and automotive-grade reliability.
The S32K3xx product line was designed specifically for next-generation automotive domain controllers and zonal gateways, emphasizing ASIL-B/D compliance, hardware-accelerated security, and scalable multicore architectures for software-defined vehicles.
FAQ
What is the maximum operating frequency of the S32K314EHT1MMMSR?
The S32K314EHT1MMMSR features a single Arm Cortex-M7 core rated for operation up to 160 MHz. This frequency is achievable across the full −40 °C to +125 °C ambient temperature range and 2.97 V to 5.5 V supply voltage, with all on-chip memories and peripherals fully functional. The S32K314EHT1MMMSR uses a system PLL driven by the FXOSC or FIRC to generate this core clock, and its I/D-TCM ensures zero-wait-state execution at maximum speed.
Does the S32K314EHT1MMMSR support CAN FD, and how many channels are available?
Yes, the S32K314EHT1MMMSR integrates six independent FlexCAN modules, and every channel supports CAN FD with data rates up to 5 Mbps. Each module includes dedicated message RAM, flexible bit-timing configuration, and built-in protocol error handling. This enables the S32K314EHT1MMMSR to serve as a high-bandwidth backbone node in modern automotive networks, replacing multiple legacy CAN controllers with a single device.
What safety certifications does the S32K314EHT1MMMSR hold?
The S32K314EHT1MMMSR is certified to ASIL-B per ISO 26262:2018 Parts 5 and 6. It includes hardware safety mechanisms such as ECC on all memories (flash, SRAM, TCM), centralized error collection via FCCU, dual independent software watchdog timers (SWT), clock and voltage monitors, and memory protection units (MPU/XRDC). These features are documented in NXP's FMEDA report and safety manual for the S32K3xx series.
Is QuadSPI supported on the S32K314EHT1MMMSR, and what are its performance specs?
Yes, the S32K314EHT1MMMSR includes one QuadSPI interface supporting up to 480 Mbps with 4-bit data width in double-data-rate mode. It is capable of memory-mapped execution (XIP) and supports common flash vendors (Micron, Cypress, Winbond). The interface connects directly to the XBAR fabric, ensuring minimal latency for external code/data access-critical for OTA update staging and extended sensor buffer storage in the S32K314EHT1MMMSR.
What package type and pin count does the S32K314EHT1MMMSR use?
The S32K314EHT1MMMSR is offered exclusively in the MAPBGA437 package: a 17 mm × 17 mm body with 437 I/O balls arranged in a 0.8 mm pitch grid and an exposed thermal pad. This package is RoHS-compliant, AEC-Q100 Grade 1 qualified, and supports standard PCB assembly processes. Pin compatibility is maintained across the S32K3xx family, enabling migration to higher-memory variants like S32K324EHT1MMMSR without layout changes.
S32K314EHT1MMMSR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 257-LFBGA
- Series:
- S32K3
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M7
- Core Size:
- 32-Bit
- Speed:
- 160MHz
- Connectivity:
- CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
- Peripherals:
- DMA, I2S, WDT
- Number of I/O:
- 218
- Program Memory Size:
- 4MB (4M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 512K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.97V ~ 5.5V
- Data Converters:
- A/D 24x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S32K314EHT1MMMSR FAQ
1.How can I place an order for S32K314EHT1MMMSR through Aetrix?
Please submit a Request for Quotation (RFQ) for S32K314EHT1MMMSR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S32K314EHT1MMMSR reliable?
The price and inventory of S32K314EHT1MMMSR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S32K314EHT1MMMSR is usually 5 days.
3.What payment methods are accepted for S32K314EHT1MMMSR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S32K314EHT1MMMSR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S32K314EHT1MMMSR?
S32K314EHT1MMMSR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S32K314EHT1MMMSR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S32K314EHT1MMMSR?
For technical support, including S32K314EHT1MMMSR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S32K314EHT1MMMSR requirements.
6.How does Aetrix verify that S32K314EHT1MMMSR is sourced from the original manufacturer or authorized distributors?
All S32K314EHT1MMMSR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S32K314EHT1MMMSR meets industry standards.
7.What is the process for return or replacement of S32K314EHT1MMMSR?
All S32K314EHT1MMMSR units undergo pre-shipment inspection (PSI). If there is an issue with S32K314EHT1MMMSR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S32K314EHT1MMMSR part is unused and in its original packaging.
Return procedure for S32K314EHT1MMMSR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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