NXP Semiconductors S32K322EHT0MPBIT
- Part No.:
- S32K322EHT0MPBIT
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 172-QFP
- Datasheet:
-
S32K322EHT0MPBIT.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 172QFP
- Quantity:
- Payment:

- Shipping:

Inventory:3,730
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Product details
Overview
S32K322EHT0MPBIT from NXP Semiconductors is an ASIL-B dual-core Arm® Cortex-M7 automotive microcontroller operating up to 160 MHz, featuring 2 MB program flash with ECC, 256 KB SRAM (including 192 KB TCM), and dual FlexCAN modules with CAN FD support - deployed in body control modules requiring real-time deterministic response under harsh environmental conditions.
For engineers reviewing the S32K322EHT0MPBIT datasheet, S32K322EHT0MPBIT pinout, S32K322EHT0MPBIT application, or S32K322EHT0MPBIT equivalent, key selection criteria include dual-core lockstep readiness, QuadSPI interface for external memory expansion, Ethernet AVB/TSN capability, and functional safety compliance for automotive ECU designs.
Technical Context
The S32K322EHT0MPBIT implements two independent Arm Cortex-M7 cores running at up to 160 MHz each, with separate I/D caches and dedicated TCM RAM to minimize latency in motor control and real-time safety-critical loops. It integrates a 64-bit crossbar switch fabric enabling concurrent high-bandwidth access to flash, SRAM, and peripherals.
Its safety architecture includes hardware error detection on all memories (ECC), centralized fault collection (FCCU), dual SWT timers, and XRDC-based memory protection - all aligned to ISO 26262 ASIL-B requirements without requiring lockstep configuration. The device supports RWW (Read-While-Write) flash for seamless OTA updates via A/B swap.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual independent Arm Cortex-M7 @ up to 160 MHz - enables parallel task partitioning and real-time determinism without lockstep overhead. |
| Flash Memory | 2 MB program flash with ECC - ensures data integrity across automotive temperature range (-40 °C to 125 °C) and supports RWW for OTA firmware updates. |
| SRAM | 256 KB total SRAM with ECC, including 192 KB TCM - provides low-latency memory for time-critical ISR and control algorithms. |
| Communication | 4 FlexCAN channels with CAN FD, 1 Ethernet 100 Mbps (AVB/TSN), 4 LPUART, 4 LPSPI, 2 LPI2C - meets domain controller interconnect requirements. |
| Analog Peripherals | 2 × 24-channel 12-bit ADCs, 2 × analog comparators with internal 8-bit DACs - supports sensor fusion and closed-loop actuator control. |
| Package | MAPBGA437 (17 × 17 mm, 0.8 mm pitch) - delivers high I/O count (up to 320 GPIO) and thermal performance for under-hood applications. |
| Supply & Temp | 2.97 V–5.5 V operation; -40 °C to +125 °C ambient - qualified for engine bay and powertrain control environments. |
Pinout & Package
Package: MAPBGA437 (17 mm × 17 mm, 0.8 mm pitch, 437-ball array) with exposed thermal pad (EP) for enhanced thermal dissipation in automotive power modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_CORE | Core power supply | 1.1 V ±5% regulated input for CPU and cache subsystems; requires local decoupling per layout guidelines. |
| VDD_IO | I/O power supply | 1.8 V / 3.3 V selectable rail supporting mixed-voltage interfacing with sensors and transceivers. |
| RESET_B | Active-low reset input | Asynchronous reset assertion resets all logic domains; synchronized release ensures clean state recovery. |
| JTAG_TCK / TMS / TDI / TDO | Debug clock/control/data | 2-pin SWD-compatible interface enables production programming and real-time trace via Serial Wire Output (SWO). |
| ENET_RXD0–3 / TXD0–3 | Ethernet physical layer interface | 100 Mbps MII signals routed for AVB/TSN time-synchronized packet handling with hardware timestamping. |
| CAN0_TX / CAN0_RX | FlexCAN channel 0 differential pair | High-speed CAN FD transceiver interface supporting data rates up to 5 Mbps and protocol flexibility. |
Key Features
| Feature | Design Value |
|---|---|
| Dual Cortex-M7 with independent TCM | Enables asymmetric multiprocessing: one core for safety-critical control, the other for diagnostics or communication stack offload. |
| QuadSPI interface (480 Mbps) | Supports external XIP execution and fast code/data loading from serial NOR/NAND flash - reduces BOM cost vs parallel memory. |
| Hardware Security Engine (HSE-B) | Accelerates AES-256, RSA-4096, and ECC-521 operations; includes firmware-upgradable cryptographic library for secure boot and key management. |
| Extended Cross-domain Domain Controller (XRDC) | Configurable master-to-peripheral access rights enforcement - isolates safety-critical peripherals from non-safety software partitions. |
| BCTU (Body Control Trigger Unit) | Hardware-triggered synchronization between ADC sampling, PWM generation, and eMIOS timer events - eliminates software jitter in sensor-actuator loops. |
Applications
| Body Control Module (BCM) | Electric Power Steering (EPS) |
|---|---|
Use Scenario: Centralized vehicle body electronics managing lighting, door locks, window lifts, and climate fan control. IC Role / Device Role / Timing Role: Primary MCU executing ASIL-B-compliant control logic with deterministic interrupt latency and fail-safe state monitoring. Use Value: Dual-core separation allows dedicated safety monitor core while main core handles feature-rich HMI and LIN gateway functions. |
Use Scenario: Real-time torque assist calculation and motor phase current regulation in steer-by-wire systems. IC Role / Device Role / Timing Role: High-performance timing controller with sub-microsecond PWM resolution and synchronized ADC sampling for FOC. Use Value: 192 KB TCM + dual eMIOS timers enable <1 µs loop jitter for field-oriented control without external DSP co-processor. |
| Advanced Driver Assistance System (ADAS) Sensor Hub | Vehicle Gateway Module |
Use Scenario: Aggregation and preprocessing of radar, camera, and ultrasonic sensor data before forwarding to central ADAS domain controller. IC Role / Device Role / Timing Role: Edge processing node performing time-synchronized sensor fusion using hardware-accelerated CRC and DMA-driven data movement. Use Value: QuadSPI + Ethernet TSN ensures deterministic low-latency transfer of time-stamped sensor frames to central compute unit. |
Use Scenario: In-vehicle network bridge connecting CAN FD, LIN, Ethernet, and FlexRay domains with protocol translation and firewalling. IC Role / Device Role / Timing Role: Secure gateway MCU enforcing domain isolation via XRDC and executing authenticated firmware updates over CAN FD or Ethernet. Use Value: HSE-B crypto acceleration enables real-time TLS 1.2 handshake and secure OTA patch verification without CPU load penalty. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S32K342EHT0MPBIT | ASIL-D lockstep dual-core variant with identical package and peripheral set; adds redundant core checking and enhanced fault coverage. | Required where end-system certification mandates ASIL-D decomposition (e.g., brake-by-wire, airbag controllers). | Select S32K342EHT0MPBIT only when full lockstep validation and FCCU-level fault injection testing are required by OEM safety plan. |
| S32K324EHT0MPBIT | Same dual-core architecture but with 4 MB flash, 512 KB SRAM, and triple 12-bit ADC modules - no change in core frequency or package. | Preferred for next-gen BCMs integrating more sensor inputs and larger diagnostic code footprints without changing PCB layout. | Choose S32K324EHT0MPBIT when future-proofing for expanded feature sets while retaining pin compatibility and thermal profile. |
Compared with S32K322EHT0MPBIT, S32K342EHT0MPBIT adds mandatory lockstep safety mechanisms at the cost of ~15% higher power consumption, while S32K324EHT0MPBIT extends memory capacity for complex middleware stacks - both retain identical MAPBGA437 footprint and peripheral register mapping.
Availability
S32K322EHT0MPBIT is available at Aetrix Electronics and suitable for automotive body control modules, electric power steering units, ADAS sensor hubs, and vehicle gateway systems requiring stable component supply across extended product lifecycles.
Supply support for S32K322EHT0MPBIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The S32K3xx family is designed specifically for automotive real-time control applications demanding ASIL-B/D compliance, functional safety, and robust security - extending NXP's S32 platform with scalable Arm Cortex-M7 performance and integrated hardware accelerators.
FAQ
What is the maximum operating frequency of the S32K322EHT0MPBIT?
The S32K322EHT0MPBIT features two independent Arm Cortex-M7 cores, each capable of operating at up to 160 MHz. This frequency is sustained across the full industrial temperature range (-40 °C to 125 °C) and supported by on-chip PLLs with FIRC/SXOSC/FXOSC sources. The S32K322EHT0MPBIT does not require external clock conditioning to achieve rated performance.
Does the S32K322EHT0MPBIT support CAN FD, and how many channels are available?
Yes, the S32K322EHT0MPBIT integrates four FlexCAN modules, each supporting CAN FD protocol with data rates up to 5 Mbps and flexible bit timing configuration. All channels include built-in message RAM, FIFOs, and hardware acceptance filtering - enabling simultaneous high-bandwidth communication with multiple ECUs in modern vehicle networks.
What safety certifications apply to the S32K322EHT0MPBIT?
The S32K322EHT0MPBIT is certified to ISO 26262 ASIL-B at the device level, with hardware safety mechanisms including ECC on all memories, dual SWT timers, FCCU fault collector, and XRDC-based memory protection. It is not ASIL-D rated; for ASIL-D applications, the pin-compatible S32K342EHT0MPBIT variant must be selected.
Which package type is used for the S32K322EHT0MPBIT?
The S32K322EHT0MPBIT is supplied in a MAPBGA437 package (17 mm × 17 mm, 0.8 mm ball pitch) with exposed thermal pad. This package supports up to 320 GPIO pins and is optimized for thermal performance in under-hood automotive applications. Pinout is fully compatible with other S32K3xx devices in the same package variant.
Does the S32K322EHT0MPBIT include hardware encryption acceleration?
Yes, the S32K322EHT0MPBIT integrates the Hardware Security Engine (HSE-B), which provides dedicated acceleration for AES-256, RSA-4096, and ECC-521 cryptographic operations. It also supports secure boot, key provisioning, and firmware update authentication - all implemented in tamper-resistant hardware with side-channel protections.
S32K322EHT0MPBIT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 172-QFP
- Series:
- S32K3
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M7
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 160MHz
- Connectivity:
- CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART
- Peripherals:
- DMA, I2S, WDT
- Number of I/O:
- 143
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.97V ~ 5.5V
- Data Converters:
- A/D 24x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S32K322EHT0MPBIT FAQ
1.How can I place an order for S32K322EHT0MPBIT through Aetrix?
Please submit a Request for Quotation (RFQ) for S32K322EHT0MPBIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S32K322EHT0MPBIT reliable?
The price and inventory of S32K322EHT0MPBIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S32K322EHT0MPBIT is usually 5 days.
3.What payment methods are accepted for S32K322EHT0MPBIT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S32K322EHT0MPBIT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S32K322EHT0MPBIT?
S32K322EHT0MPBIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S32K322EHT0MPBIT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S32K322EHT0MPBIT?
For technical support, including S32K322EHT0MPBIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S32K322EHT0MPBIT requirements.
6.How does Aetrix verify that S32K322EHT0MPBIT is sourced from the original manufacturer or authorized distributors?
All S32K322EHT0MPBIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S32K322EHT0MPBIT meets industry standards.
7.What is the process for return or replacement of S32K322EHT0MPBIT?
All S32K322EHT0MPBIT units undergo pre-shipment inspection (PSI). If there is an issue with S32K322EHT0MPBIT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S32K322EHT0MPBIT part is unused and in its original packaging.
Return procedure for S32K322EHT0MPBIT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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