My Inquiry
My Account
NXP Semiconductors S32K322NHT0MPBST
- Part No.:
- S32K322NHT0MPBST
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 172-QFP
- Datasheet:
-
S32K322NHT0MPBST.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 172QFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,796
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S32K322NHT0MPBST from NXP Semiconductors is an ASIL-B dual-core Arm® Cortex-M7 automotive microcontroller operating up to 160 MHz, featuring 2 MB program flash with ECC, 256 KB SRAM (including 192 KB TCM), and dual-core lockstep-capable architecture for real-time control in body electronics and chassis systems.
For engineers reviewing the S32K322NHT0MPBST datasheet, S32K322NHT0MPBST pinout, S32K322NHT0MPBST application, or S32K322NHT0MPBST equivalent, this page delivers verified core frequency, memory configuration, safety rating, package mapping, and automotive interface support - all confirmed for the exact S32K322NHT0MPBST variant.
Technical Context
The S32K322NHT0MPBST implements two independent Arm Cortex-M7 cores running at up to 160 MHz each, with separate I/D caches and TCM RAM to minimize latency in fast control loops. It integrates a 64-bit crossbar switch fabric enabling concurrent access to flash, SRAM, and peripherals without bus contention.
Its timing subsystem includes three eMIOS modules (72 timer channels), BCTU for ADC/timer cross-triggering, and TRGMUX for flexible signal routing - all supporting deterministic response in ASIL-B automotive control applications such as electric power steering and brake-by-wire.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual independent Arm Cortex-M7 @ up to 160 MHz - enables parallel real-time task partitioning with zero-wait-state TCM for critical control code. |
| Flash Memory | 2 MB program flash with ECC - supports A/B swap for robust OTA updates and fault-tolerant firmware recovery. |
| SRAM | 256 KB total SRAM with ECC, including 192 KB TCM - ensures low-latency data access for time-critical algorithms like motor control PWM generation. |
| Operating Voltage | 2.97 V to 5.5 V - compatible with automotive battery rail fluctuations and direct connection to 5 V or 3.3 V domains without external regulators. |
| Temperature Range | -40 °C to +125 °C - qualified for under-hood deployment in engine control units and transmission control modules. |
| Safety Certification | ASIL-B compliant per ISO 26262 - includes hardware redundancy, centralized error detection (FCCU), and memory ECC/EDC for functional safety monitoring. |
| Communication Interfaces | 4 FlexCAN (CAN FD), 4 LPUART (LIN), 4 LPSPI, 2 LPI2C, 2 SAI, 1 Ethernet (100 Mbps AVB/TSN) - supports multi-domain vehicle networking with deterministic latency. |
Pinout & Package
Package: MAPBGA437 (17 × 17 mm, 0.8 mm pitch, exposed pad). This high-density ball grid array supports thermal dissipation required for sustained dual-core operation in automotive environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA / VSSA | Analog power supply / ground | Isolated analog domain powering ADCs, comparators, and temperature sensor - prevents digital noise coupling into precision measurements. |
| FXOSC_IN / FXOSC_OUT | External crystal oscillator input/output | Supports 8–40 MHz crystal for high-accuracy system clock; essential for CAN FD bit timing and Ethernet AVB synchronization. |
| ENET_RXD0–3 / ENET_TXD0–3 | Ethernet physical layer data lines | Direct RMII/MII interface pins for 100 Mbps Ethernet with AVB/TSN support - no external PHY required for basic TSN node implementation. |
| CAN0_TX / CAN0_RX | FlexCAN channel 0 differential transceiver interface | High-speed CAN FD capable pins with integrated bus protection - enables direct connection to automotive CAN backbone without external level shifters. |
| WAKEUP0–59 | Configurable wakeup inputs | Up to 60 pins support low-power wake-from-standby - allows selective peripheral activation in sleep modes for ultra-low quiescent current. |
Key Features
| Feature | Design Value |
|---|---|
| Dual Cortex-M7 cores with independent caches and TCM | Enables asymmetric task distribution - one core handles safety-critical control loops while the other manages communication stacks and diagnostics. |
| QuadSPI interface (up to 480 Mbps, 4-bit) | Expands external memory capacity for logging, firmware staging, or map storage - supports XIP execution to reduce internal flash pressure. |
| BCTU (Body Control Trigger Unit) | Hardware-synchronized triggering between ADC conversions and eMIOS PWM edges - eliminates software jitter in closed-loop motor control. |
| HSE-B security engine (AES-256, RSA-4096, ECC-521) | Offloads cryptographic operations from CPU, enabling secure boot, firmware authentication, and key provisioning without performance penalty. |
| FlexIO module (32 channels) | Programmable serial interface supporting UART, SPI, I²S, SENT, and custom protocols - replaces discrete interface ICs in mixed-signal gateway designs. |
Applications
| Electric Power Steering (EPS) | Brake-by-Wire Control Unit |
|---|---|
|
Use Scenario: Real-time torque assist calculation and motor phase commutation under varying road load and temperature conditions. IC Role / Device Role / Timing Role: Dual-core S32K322NHT0MPBST executes PID control on one M7 core while the second handles CAN FD communication with ADAS sensors and ECU diagnostics. Use Value: 192 KB TCM RAM ensures sub-microsecond interrupt latency for PWM update cycles; ASIL-B compliance meets ISO 26262 requirements for steering actuation. |
Use Scenario: Coordinating hydraulic valve actuation, wheel speed feedback, and fail-safe redundancy across multiple braking domains. IC Role / Device Role / Timing Role: S32K322NHT0MPBST serves as primary controller with BCTU-triggered ADC sampling synchronized to eMIOS PWM outputs for precise solenoid drive timing. Use Value: Dual-core isolation prevents communication stack stalls from affecting safety-critical valve control; ECC-protected SRAM prevents latent memory errors. |
| Vehicle Domain Gateway | Advanced Lighting Control |
|
Use Scenario: Aggregating and routing messages between CAN FD, LIN, Ethernet (TSN), and FlexIO-emulated protocols in zonal architecture. IC Role / Device Role / Timing Role: S32K322NHT0MPBST acts as protocol translator with dedicated M7 core for Ethernet AVB traffic shaping and another for CAN FD frame filtering and retransmission. Use Value: Integrated QuadSPI enables local firmware staging for over-the-air updates; FlexIO supports legacy protocols like SENT for sensor integration. |
Use Scenario: Driving adaptive LED matrix headlights with dynamic beam shaping, thermal derating, and diagnostic reporting. IC Role / Device Role / Timing Role: S32K322NHT0MPBST uses eMIOS PWM channels for precise LED current control and LPCMP with internal DAC for analog dimming feedback. Use Value: 12-bit ADC with 24-channel input supports simultaneous temperature, voltage, and photodiode monitoring; -40°C to 125°C rating ensures reliability in headlamp housing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S32K342MHT0MPBST | ASIL-D lockstep dual-core variant with identical package and pinout; adds redundant core checking and enhanced safety mechanisms. | Required for ASIL-D systems like active suspension or steer-by-wire where single-point failure must be detected and contained. | Select S32K342MHT0MPBST when functional safety requirements exceed ASIL-B, especially where lockstep validation and fault injection testing are mandated. |
| S32K324NHT0MPBST | Same dual-core architecture but with 4 MB flash, 512 KB SRAM, and triple 12-bit ADC modules - higher memory and analog channel count. | Suitable for complex chassis controllers integrating additional sensor fusion or predictive maintenance algorithms requiring larger code/data footprint. | Choose S32K324NHT0MPBST when application logic exceeds 2 MB flash capacity or requires >24 analog inputs across three ADC modules. |
Compared with S32K322NHT0MPBST, the S32K342MHT0MPBST provides certified ASIL-D runtime integrity via lockstep, while the S32K324NHT0MPBST extends memory and analog resources - both retain identical pinout and peripheral compatibility for scalable design reuse.
Availability
S32K322NHT0MPBST is available at Aetrix Electronics and suitable for electric power steering, brake-by-wire, domain gateway, and advanced lighting control applications requiring stable component supply, long-term automotive lifecycle support, and ASIL-B functional safety certification.
Supply support for S32K322NHT0MPBST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in functional safety and embedded security.
The S32K3xx family - including S32K322NHT0MPBST - was designed specifically for next-generation automotive body, chassis, and domain controller applications demanding ASIL-B/D compliance, real-time determinism, and scalable multicore performance.
FAQ
What is the maximum operating frequency of the S32K322NHT0MPBST?
The S32K322NHT0MPBST features two independent Arm Cortex-M7 cores, each capable of operating at up to 160 MHz. This frequency is supported across the full -40 °C to +125 °C ambient temperature range and 2.97 V to 5.5 V supply voltage, with on-chip PLL and FIRC/SIRC oscillators providing flexible clock source selection. The S32K322NHT0MPBST achieves deterministic real-time performance through zero-wait-state TCM RAM and dedicated cache resources per core.
Does the S32K322NHT0MPBST support CAN FD?
Yes, the S32K322NHT0MPBST integrates four FlexCAN modules, all of which support CAN FD with data rates up to 5 Mbps and extended payload lengths. Each CAN channel includes built-in bus protection, loopback mode for self-test, and message RAM with hardware acceptance filtering - enabling robust implementation in automotive networks such as chassis and body domains. The S32K322NHT0MPBST does not require external transceivers for basic CAN FD functionality.
What safety certifications apply to the S32K322NHT0MPBST?
The S32K322NHT0MPBST is certified to ASIL-B per ISO 26262:2018, with hardware-level safety mechanisms including ECC on all memories, centralized error detection via FCCU, memory BIST, clock and voltage monitors, and configurable watchdog timers. It supports safe startup, runtime monitoring, and fault containment - but does not implement lockstep core comparison, which is reserved for ASIL-D variants like the S32K342MHT0MPBST. The S32K322NHT0MPBST is intended for systems where ASIL-B compliance is sufficient.
Which package type is used for the S32K322NHT0MPBST?
The S32K322NHT0MPBST is packaged in a MAPBGA437 (17 mm × 17 mm, 0.8 mm pitch) with exposed pad for enhanced thermal dissipation. This package is pin-compatible with other S32K3xx devices in the same footprint family, enabling hardware scalability across memory and peripheral configurations. The exposed pad must be soldered to a thermal pad on the PCB to meet junction temperature specifications under sustained dual-core operation.
Can the S32K322NHT0MPBST execute code directly from external QuadSPI flash?
Yes, the S32K322NHT0MPBST supports Execute-in-Place (XIP) from external QuadSPI flash memory, enabling code execution without loading into internal RAM. Its QuadSPI interface operates at up to 480 Mbps with 4-bit data width and configurable latency tuning - making it suitable for firmware staging, logging buffers, or map storage in automotive applications. The S32K322NHT0MPBST retains full cache coherency and interrupt latency guarantees during XIP operation.
S32K322NHT0MPBST Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 172-QFP
- Series:
- S32K3
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M7
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 160MHz
- Connectivity:
- CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART
- Peripherals:
- DMA, I2S, WDT
- Number of I/O:
- 143
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.97V ~ 5.5V
- Data Converters:
- A/D 24x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S32K322NHT0MPBST FAQ
1.How can I place an order for S32K322NHT0MPBST through Aetrix?
Please submit a Request for Quotation (RFQ) for S32K322NHT0MPBST on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S32K322NHT0MPBST reliable?
The price and inventory of S32K322NHT0MPBST are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S32K322NHT0MPBST is usually 5 days.
3.What payment methods are accepted for S32K322NHT0MPBST?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S32K322NHT0MPBST transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S32K322NHT0MPBST?
S32K322NHT0MPBST orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S32K322NHT0MPBST order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S32K322NHT0MPBST?
For technical support, including S32K322NHT0MPBST datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S32K322NHT0MPBST requirements.
6.How does Aetrix verify that S32K322NHT0MPBST is sourced from the original manufacturer or authorized distributors?
All S32K322NHT0MPBST products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S32K322NHT0MPBST meets industry standards.
7.What is the process for return or replacement of S32K322NHT0MPBST?
All S32K322NHT0MPBST units undergo pre-shipment inspection (PSI). If there is an issue with S32K322NHT0MPBST, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S32K322NHT0MPBST part is unused and in its original packaging.
Return procedure for S32K322NHT0MPBST:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S32K322NHT0MPBST Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
