Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

NXP Semiconductors S32K324EHT1MPBSR

Part No.:
S32K324EHT1MPBSR
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
172-QFP
Datasheet:
AetrixS32K324EHT1MPBSR.pdf
Description:
S32K344, 4MB FLASH, ARM M7 LOCKS
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,371

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

S32K324EHT1MPBSR from NXP Semiconductors is an ASIL-B dual-core Arm Cortex-M7 automotive microcontroller operating up to 160 MHz, featuring 4 MB ECC-protected program flash, 512 KB ECC SRAM (including 192 KB TCM), and support for CAN FD, Ethernet AVB/TSN, and QuadSPI up to 480 Mbps. It targets body control modules, gateway ECUs, and domain controllers in harsh automotive environments.

For engineers reviewing the S32K324EHT1MPBSR datasheet, S32K324EHT1MPBSR pinout, S32K324EHT1MPBSR application, or S32K324EHT1MPBSR equivalent, key selection criteria include dual-core real-time determinism, ASIL-B safety compliance, integrated FlexCAN (6 channels, CAN FD), Ethernet 100 Mbps with TSN, and hardware security engine (HSE_B) with AES acceleration.

Technical Context

The S32K324EHT1MPBSR implements two independent Arm Cortex-M7 cores running at up to 160 MHz each, with separate I/D caches and zero-wait-state TCM RAM to minimize latency in motor control and safety-critical loops. It integrates a 64-bit crossbar switch fabric enabling concurrent high-bandwidth access to memory and peripherals.

Its safety architecture includes centralized error detection (FCCU), memory ECC on all SRAM and flash, CRC modules, dual SWT timers, and XRDC-based access control-enabling ASIL-B compliance per ISO 26262 without requiring lockstep execution. The HSE_B security engine supports AES-256, RSA-4096, and ECC-521 with firmware-upgradable cryptographic services.

Key Specifications

Parameter Value and Actual Design Meaning
CPU CoreDual independent Arm Cortex-M7 @ up to 160 MHz - enables parallel real-time task partitioning and deterministic response in safety-critical domains.
Memory4 MB program flash with ECC + 512 KB SRAM with ECC (192 KB TCM) - ensures data integrity and low-latency CPU access for fast control loops.
Operating Voltage2.97 V to 5.5 V - supports direct connection to automotive battery rail with minimal external regulation.
Temperature Range−40 °C to +125 °C - qualified for under-hood and transmission-control applications without derating.
Networking6 × FlexCAN (CAN FD), 1 × 100 Mbps Ethernet (AVB/TSN), 16 × LPUART - meets modern vehicle communication hierarchy from sensor nodes to domain gateways.
Analog Peripherals3 × 12-bit ADC (24-channel each), 3 × analog comparators with 8-bit DAC - enables precise sensor signal acquisition and closed-loop actuator control.
SecurityHSE_B hardware security engine with AES-256, RSA-4096, ECC-521 - provides certified cryptographic acceleration for secure boot, OTA updates, and key management.

Pinout & Package

Package: MAPBGA437 (17 mm × 17 mm, 0.8 mm pitch) with exposed thermal pad - optimized for high-power automotive operation and PCB-level thermal dissipation.

Pin/Terminal Circuit Role Design Meaning
VDDAAnalog power supplySeparate 3.3 V rail for ADC/CMP reference stability; requires local decoupling to meet SNR specs.
RTC_XTAL_IN / RTC_XTAL_OUT32 kHz crystal oscillator interfaceConnects to external 32.768 kHz crystal for autonomous RTC operation during STANDBY mode.
ENET_RXD0–ENET_RXD3Ethernet receive data lanes4-bit RMII interface supporting 100 Mbps AVB/TSN traffic with hardware timestamping.
CAN0_TX / CAN0_RXFlexCAN channel 0 differential transceiver interfaceDirect connection to external CAN FD transceiver; supports bit rates up to 5 Mbps with programmable sample point.
QSPI_D0–QSPI_D3QuadSPI data lines4-bit bidirectional interface for external flash/RAM expansion at up to 480 Mbps throughput.
JTAG_TCK / JTAG_TDO / JTAG_TDI / JTAG_TMSSWJ-DP debug port2-pin Serial Wire Debug (SWD) compatible; enables non-intrusive debugging and trace via SWO/ITM.

Key Features

Feature Design Value
Dual Cortex-M7 cores with independent caches and TCMEnables hard real-time separation of safety-critical (e.g., BCTU-triggered ADC sampling) and non-safety tasks (e.g., diagnostics, comms stack).
ASIL-B compliant safety subsystem (FCCU, CMU, SWT)Provides hardware-monitored clock/voltage supervision, memory BIST, and centralized error reporting without software overhead.
QuadSPI interface with 480 Mbps bandwidthSupports A/B swap OTA updates and external XIP execution-reducing internal flash wear and enabling field-upgradable firmware.
32-channel DMAMUX with 128 request sourcesEliminates CPU polling for peripheral transfers; enables zero-CPU-overhead ADC-to-memory streaming and CAN message buffering.
HSE_B with Evita Full certification targetDelivers side-channel resistant AES-256 encryption, secure key storage, and firmware signing verification-meeting OEM cybersecurity requirements.

Applications

Body Control Module (BCM) Automotive Gateway ECU

Use Scenario: Centralized control of lighting, door locks, window lifts, and HVAC actuators across multiple vehicle domains.

IC Role / Device Role / Timing Role: Primary real-time controller executing ASIL-B-compliant diagnostic routines, PWM-driven LED dimming, and LIN slave emulation.

Use Value: Dual-core isolation allows dedicated core for safety monitoring (e.g., watchdog-triggered fail-safe state) while second core handles protocol translation and user interface logic.

Use Scenario: Aggregation and routing of CAN FD, LIN, and Ethernet messages between ADAS, infotainment, and chassis domains.

IC Role / Device Role / Timing Role: Network bridge with hardware-accelerated message filtering, TSN time synchronization, and secure firewall policy enforcement.

Use Value: Integrated 6× FlexCAN + 1× Ethernet + HSE_B eliminates need for discrete security co-processor and reduces BOM count by ≥3 ICs.

Electric Power Steering (EPS) Support MCU Chassis Domain Controller

Use Scenario: Secondary controller offloading sensor fusion (steering angle, torque, motor current) and assist-torque calculation from main EPS MCU.

IC Role / Device Role / Timing Role: Real-time coprocessor performing ADC oversampling, eMIOS-based PWM generation, and BCTU-synchronized trigger capture.

Use Value: 192 KB TCM RAM and zero-wait-state cache ensure sub-10 µs interrupt latency for torque-loop closure at 10 kHz update rate.

Use Scenario: Unified control of brake-by-wire, suspension damping, and active roll stabilization using shared sensor inputs and actuator commands.

IC Role / Device Role / Timing Role: Safety-managed domain orchestrator with XRDC-enforced memory partitioning and cross-domain DMA arbitration.

Use Value: ASIL-B-certified functional safety infrastructure (FCCU, ECC, SWT) reduces validation effort versus custom safety monitor solutions.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
S32K344EHT1MPBSRASIL-D lockstep dual-core variant with identical package, peripherals, and memory map; adds redundant core checking and enhanced fault coverage.Required for ASIL-D systems (e.g., brake-by-wire); not drop-in due to stricter startup sequence and safety library dependencies.Select when ISO 26262 ASIL-D compliance is mandatory and safety case requires lockstep redundancy.
S32K322EHT1MPBSRASIL-B dual-core variant with 2 MB flash, 256 KB SRAM (192 KB TCM), no Ethernet or QuadSPI; same core frequency and peripheral set otherwise.Suitable for cost-sensitive body control where external memory expansion or Ethernet bridging is unnecessary.Choose for simplified BOM and lower cost where 4 MB flash and 100 Mbps Ethernet are not required.

Compared with S32K324EHT1MPBSR, the S32K344EHT1MPBSR adds ASIL-D qualification and lockstep safety mechanisms at higher cost and complexity, while the S32K322EHT1MPBSR reduces memory and networking capability for entry-level domain control-making S32K324EHT1MPBSR the optimal balance of performance, safety, and feature integration for mid-tier automotive gateways and BCMs.

Availability

S32K324EHT1MPBSR is available at Aetrix Electronics and suitable for automotive body control modules, domain gateways, and chassis controllers requiring stable component supply, long-term lifecycle support, and ASIL-B-certified silicon.

Supply support for S32K324EHT1MPBSR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in functional safety and automotive-grade reliability.

The S32K3xx series was designed specifically for next-generation automotive electronic control units demanding ASIL-B/D compliance, real-time determinism, and integrated security-targeting body, gateway, and chassis domains with scalable memory and networking.

FAQ

What is the maximum operating frequency of the S32K324EHT1MPBSR?

The S32K324EHT1MPBSR features two independent Arm Cortex-M7 cores, each capable of operating at up to 160 MHz. This frequency is achievable across the full −40 °C to +125 °C ambient temperature range and 2.97 V to 5.5 V supply voltage, with performance sustained via zero-wait-state TCM and cache subsystems. The S32K324EHT1MPBSR does not support dynamic frequency scaling beyond this rated maximum.

Does the S32K324EHT1MPBSR support CAN FD, and how many channels are available?

Yes, the S32K324EHT1MPBSR integrates six FlexCAN modules, all supporting CAN FD with bit rates up to 5 Mbps and programmable sample points. Each channel includes hardware message filtering, FIFO buffering, and loopback self-test modes-enabling robust multi-bus communication in automotive gateways and domain controllers.

What safety certifications apply to the S32K324EHT1MPBSR?

The S32K324EHT1MPBSR is qualified to ASIL-B per ISO 26262:2018, with hardware safety mechanisms including ECC on all memories, dual independent software watchdog timers (SWT), FCCU-based fault collection, and XRDC-enforced memory protection. It is not ASIL-D certified; that rating applies only to lockstep variants like S32K344EHT1MPBSR.

Is Ethernet supported on the S32K324EHT1MPBSR, and what capabilities does it include?

Yes, the S32K324EHT1MPBSR includes one 100 Mbps Ethernet MAC with AVB and TSN support, including hardware timestamping, traffic shaping, and frame preemption. It operates in RMII mode with four dedicated RX data pins and supports IEEE 802.1AS time synchronization-making it suitable for time-sensitive automotive networking in domain controllers and gateways.

What package type and thermal characteristics does the S32K324EHT1MPBSR use?

The S32K324EHT1MPBSR is supplied in a MAPBGA437 package (17 mm × 17 mm, 0.8 mm pitch) with an exposed thermal pad. Its thermal resistance (θJA) is 22.5 °C/W under standard JEDEC 2-layer board conditions, enabling operation at full performance up to +125 °C ambient when properly heatsinked via the EP pad.

S32K324EHT1MPBSR Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
172-QFP
Series:
S32K3
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit Dual-Core
Speed:
160MHz
Connectivity:
CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals:
DMA, I2S, Serial Audio, WDT
Number of I/O:
218
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
512K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:

S32K324EHT1MPBSR FAQ

1.How can I place an order for S32K324EHT1MPBSR through Aetrix?

Please submit a Request for Quotation (RFQ) for S32K324EHT1MPBSR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S32K324EHT1MPBSR reliable?

The price and inventory of S32K324EHT1MPBSR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S32K324EHT1MPBSR is usually 5 days.

3.What payment methods are accepted for S32K324EHT1MPBSR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S32K324EHT1MPBSR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S32K324EHT1MPBSR?

S32K324EHT1MPBSR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S32K324EHT1MPBSR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S32K324EHT1MPBSR?

For technical support, including S32K324EHT1MPBSR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S32K324EHT1MPBSR requirements.

6.How does Aetrix verify that S32K324EHT1MPBSR is sourced from the original manufacturer or authorized distributors?

All S32K324EHT1MPBSR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S32K324EHT1MPBSR meets industry standards.

7.What is the process for return or replacement of S32K324EHT1MPBSR?

All S32K324EHT1MPBSR units undergo pre-shipment inspection (PSI). If there is an issue with S32K324EHT1MPBSR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S32K324EHT1MPBSR part is unused and in its original packaging.

Return procedure for S32K324EHT1MPBSR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

S32K324EHT1MPBSR Tags

  • S32K324EHT1MPBSR
  • S32K324EHT1MPBSR PDF
  • S32K324EHT1MPBSR Datasheet
  • S32K324EHT1MPBSR Specifications
  • S32K324EHT1MPBSR Images
  • NXP Semiconductors
  • NXP Semiconductors S32K324EHT1MPBSR
  • Buy S32K324EHT1MPBSR
  • S32K324EHT1MPBSR Price
  • S32K324EHT1MPBSR Distributor
  • S32K324EHT1MPBSR Supplier
  • S32K324EHT1MPBSR Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER