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NXP Semiconductors S32K324EHT1MPBST

Part No.:
S32K324EHT1MPBST
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
172-QFP
Datasheet:
AetrixS32K324EHT1MPBST.pdf
Description:
S32K344, 4MB FLASH, ARM M7 LOCKS
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,542

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Product details

Overview

S32K324EHT1MPBST from NXP Semiconductors is an ASIL-B dual-core Arm Cortex-M7 automotive MCU operating up to 160 MHz, featuring 4 MB program flash with ECC, 512 KB SRAM with ECC (including 192 KB TCM), and integrated QuadSPI supporting up to 480 Mbps for external memory expansion. It delivers real-time control in body electronics, gateway, and domain controller applications requiring functional safety and CAN FD networking.

For engineers reviewing the S32K324EHT1MPBST datasheet, S32K324EHT1MPBST pinout, S32K324EHT1MPBST application, or S32K324EHT1MPBST equivalent, key selection criteria include dual-core lockstep readiness, 6 FlexCAN channels with CAN FD support, Ethernet AVB/TSN capability, and ASIL-B compliance across -40 °C to 125 °C ambient operation.

Technical Context

The S32K324EHT1MPBST implements two independent Arm Cortex-M7 cores at 160 MHz each, with separate I/D caches and zero-wait-state TCM RAM optimized for deterministic motor control and safety-critical loops. Its cross-triggering architecture tightly couples BCTU, eMIOS timers, and ADCs for synchronized sensor acquisition and actuator response.

It integrates a dedicated Cortex-M0+ subsystem for lifecycle management and security orchestration, alongside HSE-B hardware security engine supporting AES acceleration, TRNG, and Evita Full-compliant firmware protection - all coordinated via XRDC access control and VIRT_WRAPPER I/O isolation.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core Dual independent Arm Cortex-M7 @ 160 MHz with FPU, DSP, and 32 KB I-cache / 32 KB D-cache per core
Memory 4 MB ECC-protected program flash, 128 KB ECC-protected data flash, 512 KB ECC-protected SRAM (192 KB TCM)
Operating Voltage 2.97 V to 5.5 V - supports direct connection to automotive battery rails without external LDO buffering
Temperature Range -40 °C to 125 °C - qualified for under-hood and chassis-mounted automotive ECUs
Functional Safety ISO 26262 ASIL-B compliant with hardware redundancy, centralized error detection, and FCCU fault collection
Networking 6 FlexCAN modules (all channels CAN FD capable), 1x 100 Mbps Ethernet with AVB/TSN, 16 LPUART, 6 LPSPI, 2 LPI2C
Analog Peripherals 3× 12-bit ADC (24-channel each), 3× analog comparators with internal 8-bit DAC, temperature sensor, BCTU trigger unit

Pinout & Package

Package: MAPBGA437 (17 mm × 17 mm, 0.8 mm pitch) with exposed thermal pad - optimized for high-power automotive ECU thermal dissipation and PCB routing density.

Pin/Terminal Circuit Role Design Meaning
VDD_CORE Core power supply Supplies 0.8–1.1 V to dual Cortex-M7 cores and TCM; requires low-noise regulation and local decoupling
VDD_IO I/O power supply Configurable 1.8 V / 3.3 V bank for flexible interface voltage matching (e.g., LIN transceivers, CAN PHY)
FXOSC_IN / FXOSC_OUT External crystal oscillator input/output Supports 8–40 MHz crystal for high-accuracy system clock; enables SPLL-based frequency synthesis up to 160 MHz
ETH_RXD0–ETH_RXD3 Ethernet receive data lines 4-bit RMII/MII interface supporting 100 Mbps AVB/TSN traffic with hardware timestamping and packet filtering
CAN0_TX / CAN0_RX FlexCAN channel 0 differential bus interface Direct connection to CAN FD transceiver; supports bit rates up to 5 Mbps with protocol acceleration and loopback self-test
TRGMUX_IN0–TRGMUX_IN7 Trigger MUX input sources Enables hardware-synchronized event routing between ADC conversions, eMIOS captures, and PWM updates without CPU intervention

Key Features

Feature Design Value
Dual-core deterministic execution Two independent Cortex-M7 cores with dedicated TCM and cache enable parallel real-time tasks (e.g., CAN stack + motor control) without resource contention
QuadSPI with 4-bit data width Up to 480 Mbps external flash/RAM expansion - eliminates need for external memory controllers in boot-from-external designs
BCTU + eMIOS timer integration Hardware-triggered ADC sampling synchronized to PWM edges or encoder signals - critical for field-oriented motor control accuracy
HSE-B security subsystem AES-256, RSA-4096, and ECC-521 acceleration with firmware-upgradable crypto library - meets Evita Full requirements for secure OTA updates
ASIL-B safety architecture Integrated FCCU, SWT, CRC, ECC on all memories, and centralized error reporting - reduces FMEDA effort for ISO 26262 compliance

Applications

Body Control Module (BCM) Automotive Gateway

Use Scenario: Centralized control of lighting, door locks, window lifts, and HVAC actuators in 12 V vehicle architectures.

IC Role / Device Role / Timing Role: Primary application processor executing AUTOSAR BSW and application SW, managing CAN FD, LIN, and GPIO peripherals with deterministic timing.

Use Value: Dual-core architecture isolates safety-critical diagnostics from non-critical UI functions; ASIL-B compliance satisfies OEM BCM functional safety requirements.

Use Scenario: Protocol translation and message routing between powertrain (CAN FD), infotainment (Ethernet), and chassis (LIN) domains.

IC Role / Device Role / Timing Role: Real-time network bridge with hardware-accelerated packet filtering, timestamping, and firewall rules enforced by XRDC and VIRT_WRAPPER.

Use Value: Integrated 100 Mbps Ethernet + 6 FlexCAN channels eliminate external switch ICs; reduces BOM cost and board area vs. multi-chip solutions.

Electric Power Steering (EPS) ECU Domain Controller for ADAS Sensors

Use Scenario: Closed-loop torque assist control using motor current, position, and torque sensor feedback in safety-critical steering systems.

IC Role / Device Role / Timing Role: Real-time motor control unit running FOC algorithms with sub-microsecond PWM update latency via eMIOS and TCM-resident code.

Use Value: 192 KB TCM RAM ensures zero-wait instruction/data access for control loops; BCTU-triggered ADC sampling achieves <1 µs jitter between sensing and actuation.

Use Scenario: Aggregation and preprocessing of radar, camera, and ultrasonic sensor data before forwarding to central ADAS processor.

IC Role / Device Role / Timing Role: Sensor hub MCU handling time-synchronized data capture, CRC validation, and CAN FD/Ethernet packetization.

Use Value: Hardware CRC, ECC, and secure boot ensure data integrity and firmware authenticity; QuadSPI enables local sensor firmware storage and updates.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
S32K344EHT1MPBST ASIL-D lockstep dual-core variant with identical package, memory map, and peripheral set; adds redundant core monitoring and enhanced fault coverage Required for ASIL-D–rated subsystems (e.g., brake-by-wire); not drop-in due to stricter diagnostic requirements and different startup sequence Select S32K344EHT1MPBST only when full ASIL-D decomposition is mandated; S32K324EHT1MPBST suffices for ASIL-B–only domains like gateway or BCM.
S32K314EHT1MPBST Single-core Cortex-M7 @ 160 MHz, 4 MB flash, 512 KB SRAM, same package but reduced peripheral count (4 FlexCAN, no Ethernet, 8 LPUART) Suitable for cost-sensitive body control units where Ethernet or multi-CAN domain bridging is unnecessary Choose S32K314EHT1MPBST to reduce software complexity and BOM cost when dual-core processing or Ethernet is unused in target application.

Compared with S32K344EHT1MPBST, the S32K324EHT1MPBST provides identical performance and feature set at ASIL-B level - reducing certification overhead while retaining scalability. Against S32K314EHT1MPBST, it adds dual-core determinism and Ethernet connectivity essential for next-generation zonal architectures.

Availability

S32K324EHT1MPBST is available at Aetrix Electronics and suitable for automotive body electronics, gateway modules, and domain controllers requiring stable component supply, long-term lifecycle support, and ASIL-B certified silicon.

Supply support for S32K324EHT1MPBST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure, reliable, and energy-efficient automotive, industrial, and IoT solutions.

The S32K3xx family was designed specifically for automotive electronic control units demanding ASIL-B/D functional safety, real-time deterministic performance, and scalable networking - extending the S32K1xx portfolio with Arm Cortex-M7 architecture.

FAQ

What is the maximum operating frequency of the S32K324EHT1MPBST?

The S32K324EHT1MPBST features two independent Arm Cortex-M7 cores, each operating at up to 160 MHz. This frequency is achieved using the System PLL (SPLL) driven by the 8–40 MHz Fast External Oscillator (FXOSC), with full support for dynamic frequency scaling and low-power mode transitions. The S32K324EHT1MPBST maintains timing integrity across all power modes within its specified -40 °C to 125 °C ambient range.

Does the S32K324EHT1MPBST support CAN FD, and how many channels are available?

Yes, the S32K324EHT1MPBST integrates six FlexCAN modules, and all channels support CAN FD protocol with data bit rates up to 5 Mbps. Each module includes hardware message filtering, FIFO buffering, and loopback self-test capability. The S32K324EHT1MPBST uses dedicated DMA channels and DMAMUX for zero-CPU-overhead CAN FD frame transmission and reception.

What package type and pin count does the S32K324EHT1MPBST use?

The S32K324EHT1MPBST is offered in a MAPBGA437 package - a 17 mm × 17 mm ball grid array with 437 I/O balls and an exposed thermal pad. This package supports high-density automotive PCB layouts and provides robust thermal performance for sustained operation at 125 °C ambient. Pinout compatibility is maintained across the S32K3xx family for migration flexibility.

Is Ethernet functionality included in the S32K324EHT1MPBST, and what standards does it support?

Yes, the S32K324EHT1MPBST includes one 100 Mbps Ethernet MAC with AVB (Audio Video Bridging) and TSN (Time-Sensitive Networking) support. It implements IEEE 802.1AS timing synchronization, 802.1Qbv time-aware shaping, and hardware timestamping - enabling deterministic communication for audio streaming and sensor fusion in automotive networks. The S32K324EHT1MPBST requires an external PHY for physical layer interfacing.

How does the S32K324EHT1MPBST implement functional safety per ISO 26262?

The S32K324EHT1MPBST achieves ASIL-B compliance through integrated hardware safety mechanisms including ECC on all memories, CRC modules for data path integrity, dual watchdog timers (SWT), FCCU fault collection unit, and centralized error reporting via EIM/ERM. It supports lockstep-ready configuration and provides safety manuals, FMEDA reports, and driver libraries - all validated for use in S32K324EHT1MPBST-based automotive ECUs meeting ISO 26262 Part 5 requirements.

S32K324EHT1MPBST Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
172-QFP
Series:
S32K3
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit Dual-Core
Speed:
160MHz
Connectivity:
CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals:
DMA, I2S, Serial Audio, WDT
Number of I/O:
218
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
512K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:

S32K324EHT1MPBST FAQ

1.How can I place an order for S32K324EHT1MPBST through Aetrix?

Please submit a Request for Quotation (RFQ) for S32K324EHT1MPBST on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S32K324EHT1MPBST reliable?

The price and inventory of S32K324EHT1MPBST are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S32K324EHT1MPBST is usually 5 days.

3.What payment methods are accepted for S32K324EHT1MPBST?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S32K324EHT1MPBST transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S32K324EHT1MPBST?

S32K324EHT1MPBST orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S32K324EHT1MPBST order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S32K324EHT1MPBST?

For technical support, including S32K324EHT1MPBST datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S32K324EHT1MPBST requirements.

6.How does Aetrix verify that S32K324EHT1MPBST is sourced from the original manufacturer or authorized distributors?

All S32K324EHT1MPBST products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S32K324EHT1MPBST meets industry standards.

7.What is the process for return or replacement of S32K324EHT1MPBST?

All S32K324EHT1MPBST units undergo pre-shipment inspection (PSI). If there is an issue with S32K324EHT1MPBST, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S32K324EHT1MPBST part is unused and in its original packaging.

Return procedure for S32K324EHT1MPBST:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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