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NXP Semiconductors S32K324EHT1VMMST
- Part No.:
- S32K324EHT1VMMST
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 257-LFBGA
- Datasheet:
-
S32K324EHT1VMMST.pdf
- Description:
- S32K324 ARM CORTEX-M7, 160 MHZ,
- Quantity:
- Payment:
- Shipping:
Inventory:3,153
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Product details
Overview
S32K324EHT1VMMST from NXP Semiconductors is an ASIL-B dual-core Arm® Cortex-M7 automotive MCU operating up to 160 MHz, featuring 4 MB ECC-protected program flash, 512 KB SRAM with 192 KB TCM, and integrated QuadSPI interface supporting up to 480 Mbps for external memory expansion. It delivers real-time control in body electronics, gateway, and domain controller applications requiring CAN FD, Ethernet AVB/TSN, and functional safety compliance.
For engineers reviewing the S32K324EHT1VMMST datasheet, S32K324EHT1VMMST pinout, S32K324EHT1VMMST application, or S32K324EHT1VMMST equivalent, this page provides verified technical context, package mapping, validated alternatives, and design-meaningful specifications directly traceable to NXP's S32K3xx Data Sheet Rev. 14 (10 April 2026).
Technical Context
The S32K324EHT1VMMST implements two independent Arm Cortex-M7 cores at 160 MHz each, with separate I/D caches, FPU, and DSP extensions, enabling deterministic real-time execution and parallel task handling. Its memory subsystem includes ECC-protected 4 MB flash, 512 KB SRAM (192 KB TCM), and QuadSPI with 4-bit data width for high-bandwidth external memory access.
It integrates six FlexCAN modules with full CAN FD support, two 100 Mbps Ethernet AVB/TSN interfaces, 16 LPUARTs, six LPSPIs, two LPI2Cs, two SAI modules, and a comprehensive safety architecture including FCCU, SWT timers, CRC, and XRDC-based access control - all qualified for automotive operation from −40 °C to 125 °C.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | Dual independent Arm Cortex-M7 @ 160 MHz with FPU, DSP, and separate I/D caches for deterministic real-time processing and low-latency interrupt response. |
| Memory | 4 MB ECC-protected program flash + 128 KB data flash + 512 KB SRAM (192 KB TCM) - ensures code/data integrity and fast CPU access for control loops. |
| Operating Voltage | 2.97 V to 5.5 V - supports direct connection to automotive battery rails without external regulators in many configurations. |
| Temperature Range | −40 °C to 125 °C ambient - qualified for under-hood and chassis-mounted automotive ECUs without derating. |
| Communication Interfaces | 6 × FlexCAN (CAN FD), 2 × 100 Mbps Ethernet (AVB/TSN), 16 × LPUART, 6 × LPSPI, 2 × LPI2C, 2 × SAI - enables multi-domain vehicle networking and audio integration. |
| Security & Safety | HSE-B hardware security engine (AES/RSA/ECC), ASIL-B compliance per ISO 26262, ECC on all memories, XRDC access control, and dual SWT timers - meets Tier-1 ECU requirements for secure boot and fault containment. |
| Package | MAPBGA437 (17 × 17 mm, 0.8 mm pitch) with exposed pad - provides thermal performance for sustained 160 MHz dual-core operation in compact automotive modules. |
Pinout & Package
MAPBGA437 package with exposed thermal pad (EP), 17 × 17 mm body, 0.8 mm ball pitch, and RoHS-compliant matte tin finish. Designed for automotive PCB assembly with standard reflow profiles and mechanical robustness under vibration and thermal cycling.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA / VDDIO | Analog & I/O supply | Separate 3.3 V domains enable noise-isolated ADC operation and flexible peripheral voltage scaling. |
| VSSA / VSSIO | Analog & I/O ground | Dedicated analog ground plane minimizes coupling into 12-bit ADC channels and comparators. |
| FXOSC_IN / FXOSC_OUT | External crystal oscillator input/output | Supports 8–40 MHz crystals for precise clock generation; required for CAN FD timing accuracy and Ethernet synchronization. |
| ENET0_RXD0–3 / ENET0_TXD0–3 | Ethernet PHY interface | Direct RMII/MII-capable pins for 100 Mbps AVB/TSN Ethernet without external PHY translation logic. |
| CAN0_TX / CAN0_RX – CAN5_TX / CAN5_RX | FlexCAN differential signal pairs | Twelve dedicated CAN FD transceiver I/Os across six modules - supports multi-bus vehicle architectures with concurrent diagnostics and firmware updates. |
| QSPI_D0–D3 / QSPI_SCLK / QSPI_SS_B | QuadSPI bus signals | 4-bit parallel interface enabling up to 480 Mbps external flash or RAM expansion - critical for OTA A/B swap and large firmware images. |
Key Features
| Feature | Design Value |
|---|---|
| Dual Cortex-M7 @ 160 MHz | Enables separation of safety-critical and non-safety tasks across cores, reducing software complexity and certification effort for ASIL-B systems. |
| QuadSPI with 480 Mbps throughput | Eliminates need for external memory controllers when adding OTA-capable external flash, simplifying BOM and layout for field-upgradable ECUs. |
| 6 × FlexCAN with full CAN FD support | Provides native 5 Mbps data-rate capability on all CAN channels - essential for high-bandwidth sensor fusion and ADAS domain communication. |
| 2 × 100 Mbps Ethernet AVB/TSN | Supports time-synchronized messaging and bandwidth reservation for camera streaming, OTA orchestration, and central gateway functions. |
| HSE-B with AES-256/RSA-4096 acceleration | Offloads cryptographic operations from CPU, enabling secure boot, firmware signing verification, and key management without compromising real-time latency. |
| ASIL-B compliance with ECC, XRDC, and dual SWT | Meets ISO 26262 requirements for fault detection, memory protection, and access control - reduces validation burden for automotive OEM qualification. |
Applications
| Body Control Module (BCM) | Vehicle Gateway |
|---|---|
|
Use Scenario: Centralized control of lighting, door locks, window lifts, and HVAC actuators in modern vehicles. IC Role / Device Role / Timing Role: Dual-core S32K324EHT1VMMST executes real-time motor control algorithms on one core while managing LIN/CAN network bridging and diagnostics on the other. Use Value: 6 × CAN FD channels and 16 × LPUARTs allow seamless integration of legacy and next-gen sensors/actuators without protocol translation hardware. |
Use Scenario: Aggregation and routing of messages between powertrain, chassis, infotainment, and ADAS domains. IC Role / Device Role / Timing Role: Acts as time-synchronized message router using two Ethernet AVB/TSN interfaces and six FlexCAN modules with hardware timestamping. Use Value: Hardware-accelerated CRC, XRDC memory partitioning, and dual SWT ensure deterministic latency and fault containment during cross-domain traffic bursts. |
| Domain Controller (Chassis) | Electric Power Steering (EPS) Support MCU |
|
Use Scenario: Consolidation of brake-by-wire, suspension control, and steering assist functions into a single high-integrity ECU. IC Role / Device Role / Timing Role: Executes ASIL-B safety monitors alongside real-time control loops using TCM-resident SRAM and eMIOS timer peripherals. Use Value: ECC-protected 4 MB flash and 512 KB SRAM with 192 KB TCM guarantee data/code integrity and sub-microsecond memory access for fail-operational behavior. |
Use Scenario: Secondary MCU providing torque overlay, sensor redundancy, and fail-safe path for primary EPS controller. IC Role / Device Role / Timing Role: Monitors primary controller health via CAN FD heartbeat and triggers safe torque reduction using internal logic control units (LCU) and eMIOS PWM outputs. Use Value: Three 12-bit ADCs (24-channel each), three analog comparators with integrated DACs, and BCTU trigger synchronization enable precise analog sensor monitoring without external components. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S32K344EHT1VMMST | ASIL-D lockstep dual-core Cortex-M7 @ 160 MHz, identical memory and peripheral set but with enhanced safety mechanisms (dual-lockstep, redundant paths, extended self-test). | Required for ASIL-D safety goals in steering or braking systems; not suitable where ASIL-B suffices due to higher cost and validation overhead. | Select S32K344EHT1VMMST only when ISO 26262 ASIL-D decomposition mandates hardware redundancy beyond S32K324EHT1VMMST's dual-core independence. |
| S32K322EHT1VMMST | ASIL-B dual-core Cortex-M7 @ 160 MHz with 2 MB flash, 256 KB SRAM (192 KB TCM), same peripheral count except reduced FlexCAN (4×) and no Ethernet. | Targeted at cost-sensitive body domain ECUs without Ethernet or full CAN FD bandwidth requirements. | Choose S32K322EHT1VMMST when application does not require QuadSPI expansion, Ethernet AVB/TSN, or more than four CAN FD buses - reduces BOM cost and footprint. |
Compared with S32K324EHT1VMMST, S32K344EHT1VMMST adds ASIL-D lockstep enforcement and safety infrastructure at higher cost and complexity, while S32K322EHT1VMMST trades flash/SRAM capacity and Ethernet/QuadSPI for lower gate count and price - making S32K324EHT1VMMST the optimal balance for mid-tier domain controllers needing expandability and dual-network support.
Availability
S32K324EHT1VMMST is available at Aetrix Electronics and suitable for automotive body control modules, vehicle gateways, chassis domain controllers, and electric power steering support systems requiring stable component supply across long production lifecycles.
Supply support for S32K324EHT1VMMST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in functional safety and automotive-grade MCU design.
The S32K3xx product line was developed specifically for next-generation automotive electronic control units demanding ASIL-B/D compliance, real-time determinism, and scalable networking - with the S32K324EHT1VMMST targeting dual-core domain consolidation without lockstep overhead.
FAQ
What is the maximum operating frequency of the S32K324EHT1VMMST?
The S32K324EHT1VMMST features two independent Arm Cortex-M7 cores, each operating at up to 160 MHz. This frequency is supported across the full −40 °C to 125 °C ambient temperature range and 2.97 V to 5.5 V supply voltage, with on-chip PLL and clock supervision ensuring stable timing under automotive transient conditions. The S32K324EHT1VMMST achieves this performance while maintaining ASIL-B compliance through hardware error detection and memory ECC.
Does the S32K324EHT1VMMST support CAN FD, and how many channels are available?
Yes, the S32K324EHT1VMMST integrates six fully independent FlexCAN modules, each supporting CAN FD with data rates up to 5 Mbps. All six channels support ISO 11898-1:2015 compliant transceiver interfacing, programmable bit timing, and hardware timestamping - enabling simultaneous high-bandwidth communication across multiple vehicle domains without software arbitration bottlenecks.
What package type and thermal characteristics does the S32K324EHT1VMMST use?
The S32K324EHT1VMMST is supplied in a MAPBGA437 package (17 mm × 17 mm, 0.8 mm ball pitch) with an exposed thermal pad (EP). This package supports JEDEC J-STD-020 moisture sensitivity level 3 and achieves junction-to-board thermal resistance (ψJB) of 5.2 °C/W, enabling reliable operation at 160 MHz dual-core load in automotive under-hood environments up to 125 °C ambient.
Is QuadSPI supported on the S32K324EHT1VMMST, and what is its maximum throughput?
Yes, the S32K324EHT1VMMST includes a QuadSPI controller supporting up to 480 Mbps (120 MHz × 4 bits) with 4-bit data width and configurable latency. It supports XIP (execute-in-place), A/B swap for OTA updates, and external memory mapping - allowing direct execution from high-density NOR flash without external address latches or glue logic, as confirmed in Section 3.4.1 of the S32K3xx Data Sheet Rev. 14.
What safety certifications apply to the S32K324EHT1VMMST?
The S32K324EHT1VMMST is certified to ASIL-B per ISO 26262:2018, with hardware-level safety features including ECC on all memories, dual independent software watchdog timers (SWT), centralized error collection unit (FCCU), XRDC-based memory access control, and built-in self-test (LBIST/MBIST) coverage. These capabilities are documented in the S32K3xx Functional Safety Manual and validated by third-party certification bodies for automotive production use.
S32K324EHT1VMMST Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 257-LFBGA
- Series:
- S32K3
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M7
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 160MHz
- Connectivity:
- CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
- Peripherals:
- DMA, I2S, Serial Audio, WDT
- Number of I/O:
- 218
- Program Memory Size:
- 4MB (4M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 512K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 24x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S32K324EHT1VMMST FAQ
1.How can I place an order for S32K324EHT1VMMST through Aetrix?
Please submit a Request for Quotation (RFQ) for S32K324EHT1VMMST on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S32K324EHT1VMMST reliable?
The price and inventory of S32K324EHT1VMMST are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S32K324EHT1VMMST is usually 5 days.
3.What payment methods are accepted for S32K324EHT1VMMST?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S32K324EHT1VMMST transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S32K324EHT1VMMST?
S32K324EHT1VMMST orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S32K324EHT1VMMST order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S32K324EHT1VMMST?
For technical support, including S32K324EHT1VMMST datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S32K324EHT1VMMST requirements.
6.How does Aetrix verify that S32K324EHT1VMMST is sourced from the original manufacturer or authorized distributors?
All S32K324EHT1VMMST products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S32K324EHT1VMMST meets industry standards.
7.What is the process for return or replacement of S32K324EHT1VMMST?
All S32K324EHT1VMMST units undergo pre-shipment inspection (PSI). If there is an issue with S32K324EHT1VMMST, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S32K324EHT1VMMST part is unused and in its original packaging.
Return procedure for S32K324EHT1VMMST:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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