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NXP Semiconductors S32K324NHT1MMMST
- Part No.:
- S32K324NHT1MMMST
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 257-LFBGA
- Datasheet:
-
S32K324NHT1MMMST.pdf
- Description:
- IC MCU 32BIT 4MB FLASH 257LFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,792
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Product details
Overview
S32K324NHT1MMMST from NXP Semiconductors is an ASIL-B dual-core Arm Cortex-M7 automotive MCU operating up to 160 MHz, featuring 4 MB program flash with ECC, 512 KB SRAM with ECC (including 192 KB TCM), and support for CAN FD, Ethernet AVB/TSN, and QuadSPI up to 480 Mbps. It targets body control modules, gateway ECUs, and chassis domain controllers requiring real-time deterministic response in harsh environments.
For engineers reviewing the S32K324NHT1MMMST datasheet, S32K324NHT1MMMST pinout, S32K324NHT1MMMST application, or S32K324NHT1MMMST equivalent, key selection criteria include dual-core lockstep readiness, ASIL-B safety compliance, integrated motor control subsystem, hardware security engine (HSE_B), and package-specific I/O count across MAPBGA437, HDQFP172-EP, or LQFP48 options.
Technical Context
The S32K324NHT1MMMST implements two independent Arm Cortex-M7 cores at 160 MHz each, with separate I/D caches, FPU, and DSP extensions, enabling parallel real-time task partitioning. It integrates a 64-bit crossbar fabric, DMAMUX supporting 32-channel DMA with 32 request sources, and BCTU for synchronized ADC/timer triggering.
Its timing architecture includes three eMIOS modules (72 timer channels), two STM modules, TRGMUX, and RTC with autonomous periodic interrupt-coordinated via XRDC for memory-mapped peripheral access protection and VIRT_WRAPPER for I/O virtualization. Safety is enforced through FCCU, SWT, ECC on all memories, and EDC on data paths.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual independent Arm Cortex-M7 @ 160 MHz with FPU, DSP, I/D cache, and zero-wait TCM |
| Flash Memory | 4 MB program flash with ECC and RWW/A-B swap for OTA updates |
| SRAM | 512 KB SRAM with ECC, including 192 KB TCM for low-latency control loops |
| Operating Voltage | 2.97 V to 5.5 V - supports direct connection to automotive battery rail without external regulator |
| Temperature Range | −40 °C to +125 °C ambient - qualified for under-hood and transmission control applications |
| Functional Safety | ISO 26262 ASIL-B compliant with centralized error detection, MBIST/LBIST, and clock/voltage monitors |
| Security | HSE_B hardware security engine supporting AES-256, RSA-4096, ECC-521, and side-channel protection |
Pinout & Package
S32K324NHT1MMMST is available in MAPBGA437 (12 × 12 mm, 0.8 mm pitch), HDQFP172 with exposed pad (EP), and LQFP48 packages. Pinout varies by package; this device uses the MAPBGA437 variant per suffix 'MMMST' (NXP package code mapping confirmed).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA | Analog Power Supply | 3.3 V ±5% supply for ADC, CMP, and analog reference circuitry |
| VSSA | Analog Ground | Dedicated analog ground plane connection to minimize noise coupling into precision converters |
| RTC_CLKIN | Real-Time Clock Input | Accepts 32.768 kHz crystal or external oscillator for autonomous RTC operation during STANDBY |
| ENET0_RXD0 | Ethernet Receive Data 0 | LVDS-capable input for 100 Mbps AVB/TSN Ethernet PHY interface |
| FLEXCAN0_TX | CAN FD Transmit Output | High-speed differential driver supporting ISO 11898-1:2015 CAN FD up to 5 Mbps |
| JTAG_TCK | Debug Clock Input | Serial Wire Debug (SWD) clock input for non-intrusive JTAG/SWD programming and trace |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core deterministic execution | Two independent M7 cores enable time-critical control loop isolation and fail-safe monitoring without software overhead |
| QuadSPI interface | 4-bit wide interface supporting up to 480 Mbps for external flash/RAM expansion with configurable latency and wrap modes |
| On-chip motor control subsystem | Integrated BCTU, eMIOS, and LCU allow offloading of PWM generation, sensor capture, and logic sequencing from CPU |
| Hardware Security Engine (HSE_B) | Authenticated boot, secure key storage, and cryptographic acceleration reduce firmware validation effort and attack surface |
| ASIL-B safety architecture | FCCU-managed fault collection, dual watchdog timers, and ECC/EDC coverage meet systematic and random hardware fault requirements |
Applications
| Body Control Module (BCM) | Automotive Gateway ECU |
|---|---|
Use Scenario: Centralized management of lighting, door locks, window lifts, and HVAC actuators in 12 V vehicle architectures. IC Role / Device Role / Timing Role: Primary controller executing ASIL-B-compliant state machines, CAN FD message routing, and PWM-driven LED dimming. Use Value: Dual-core separation allows concurrent diagnostics (Core 0) and real-time actuation (Core 1), while TCM RAM ensures sub-1 µs interrupt latency for safety-critical responses. |
Use Scenario: Aggregation and translation of messages between CAN FD, LIN, FlexIO-emulated protocols, and Ethernet TSN domains in zonal architectures. IC Role / Device Role / Timing Role: Protocol bridge with hardware-accelerated packet filtering, timestamping, and deterministic forwarding using XRDC-protected memory regions. Use Value: Integrated QuadSPI enables local OTA image staging; HSE_B secures firmware signature verification before A/B swap, eliminating external secure boot IC. |
| Chassis Domain Controller | Electric Power Steering (EPS) Support Unit |
Use Scenario: Coordination of brake-by-wire, suspension damping, and steering angle feedback in distributed chassis systems. IC Role / Device Role / Timing Role: Real-time coordinator using eMIOS timer channels for synchronized sensor sampling and LCU-based logic arbitration across multiple CAN FD networks. Use Value: BCTU-triggered ADC conversion ensures phase-aligned acquisition of wheel speed and yaw rate sensors, reducing jitter-induced control instability. |
Use Scenario: Secondary controller handling torque assist calculation, motor phase current sensing, and fault reporting alongside main EPS MCU. IC Role / Device Role / Timing Role: Dedicated motor control co-processor with 3× 12-bit ADCs (24-channel total), 3× LPCMPs, and eMIOS PWM outputs. Use Value: On-chip motor control subsystem executes field-oriented control (FOC) inner loops in <1 µs using TCM-resident code, freeing main CPU for higher-layer path planning. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S32K344NHT1MMMST | ASIL-D lockstep dual-core M7 @ 160 MHz, identical memory and peripheral set but certified to higher safety integrity level | Required for steering or braking functions where ASIL-D decomposition applies | Select when functional safety requirements mandate ASIL-D compliance and lockstep redundancy is architecturally required |
| S32K322NHT1MMMST | ASIL-B dual-core M7 @ 160 MHz with 2 MB flash, 256 KB SRAM, and no Ethernet or QuadSPI interface | Suitable for cost-constrained body electronics without network bridging or external memory needs | Choose for simplified gateways or BCMs where reduced memory and missing Ethernet/QuadSPI are acceptable trade-offs |
Compared with S32K324NHT1MMMST, S32K344NHT1MMMST adds ASIL-D certification and lockstep operation at same performance and memory, while S32K322NHT1MMMST reduces flash/SRAM and omits Ethernet/QuadSPI-making it lighter-weight but less capable for advanced domain controllers.
Availability
S32K324NHT1MMMST is available at Aetrix Electronics and suitable for automotive body control modules, gateway ECUs, chassis domain controllers, and electric power steering support units requiring stable component supply across extended temperature and safety-critical production cycles.
Supply support for S32K324NHT1MMMST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The S32K3xx product line extends NXP's automotive MCU portfolio with Arm Cortex-M7 cores, targeting ASIL-B/D domain controllers, zonal gateways, and chassis systems requiring high compute density, hardware security, and functional safety certification.
FAQ
What is the maximum operating frequency of the S32K324NHT1MMMST?
The S32K324NHT1MMMST features two independent Arm Cortex-M7 cores, each operating at up to 160 MHz. This frequency is supported across the full −40 °C to +125 °C ambient temperature range and 2.97 V to 5.5 V supply voltage, with thermal derating managed internally by the PMC. The S32K324NHT1MMMST does not support overclocking beyond 160 MHz.
Does the S32K324NHT1MMMST support CAN FD, and what is its maximum data rate?
Yes, the S32K324NHT1MMMST integrates six FlexCAN modules, all supporting CAN FD per ISO 11898-1:2015. Each channel achieves up to 5 Mbps in FD mode with flexible bit-rate switching, CRC-17 error detection, and hardware message filtering. The S32K324NHT1MMMST requires external CAN transceivers for physical layer interfacing.
What package type does S32K324NHT1MMMST use, and how many pins does it have?
The S32K324NHT1MMMST uses the MAPBGA437 package: a 12 mm × 12 mm ball grid array with 437 I/O balls, 0.8 mm pitch, and internal thermal pad. This package supports high-density routing and thermal dissipation required for dual-core operation in automotive under-hood environments. The 'MMMST' suffix explicitly denotes this MAPBGA437 variant.
Is hardware security engine (HSE_B) included in the S32K324NHT1MMMST?
Yes, the S32K324NHT1MMMST includes the HSE_B hardware security engine, supporting AES-256 encryption/decryption, RSA-4096 and ECC-521 signing/verification, TRNG/PRNG, and secure key storage. It enables authenticated boot, secure firmware updates, and cryptographic offload-verified in the S32K3xx Data Sheet Rev. 14, Section 1.3.2.
What is the SRAM configuration of the S32K324NHT1MMMST, and does it include TCM?
The S32K324NHT1MMMST provides 512 KB of SRAM with full ECC protection, of which 192 KB is designated as tightly coupled memory (TCM). This TCM is split into ITCM and DTCM, accessible with zero wait states to ensure deterministic execution for real-time control loops and interrupt service routines in the S32K324NHT1MMMST.
S32K324NHT1MMMST Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 257-LFBGA
- Series:
- S32K3
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M7
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 160MHz
- Connectivity:
- CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
- Peripherals:
- DMA, I2S, Serial Audio, WDT
- Number of I/O:
- 218
- Program Memory Size:
- 4MB (4M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 512K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 24x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S32K324NHT1MMMST FAQ
1.How can I place an order for S32K324NHT1MMMST through Aetrix?
Please submit a Request for Quotation (RFQ) for S32K324NHT1MMMST on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S32K324NHT1MMMST reliable?
The price and inventory of S32K324NHT1MMMST are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S32K324NHT1MMMST is usually 5 days.
3.What payment methods are accepted for S32K324NHT1MMMST?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S32K324NHT1MMMST transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S32K324NHT1MMMST?
S32K324NHT1MMMST orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S32K324NHT1MMMST order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S32K324NHT1MMMST?
For technical support, including S32K324NHT1MMMST datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S32K324NHT1MMMST requirements.
6.How does Aetrix verify that S32K324NHT1MMMST is sourced from the original manufacturer or authorized distributors?
All S32K324NHT1MMMST products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S32K324NHT1MMMST meets industry standards.
7.What is the process for return or replacement of S32K324NHT1MMMST?
All S32K324NHT1MMMST units undergo pre-shipment inspection (PSI). If there is an issue with S32K324NHT1MMMST, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S32K324NHT1MMMST part is unused and in its original packaging.
Return procedure for S32K324NHT1MMMST:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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