NXP Semiconductors S32K338GHT1MJBSR

Overview

S32K338GHT1MJBSR from NXP Semiconductors is an ASIL-B certified automotive MCU featuring three independent Arm Cortex-M7 cores running at 240 MHz, 8 MB ECC-protected program flash, 1152 KB SRAM with 384 KB TCM, and integrated Ethernet (1 Gbps), eight FlexCAN modules with CAN FD support, and triple 12-bit ADCs (24-channel each). It targets high-integrity body control, domain controller, and gateway applications in harsh automotive environments.

For engineers reviewing the S32K338GHT1MJBSR datasheet, S32K338GHT1MJBSR pinout, S32K338GHT1MJBSR application, or S32K338GHT1MJBSR equivalent, this page delivers verified core count, memory configuration, safety rating, interface bandwidth, and package-specific thermal and routing constraints essential for ECU architecture planning and ISO 26262-compliant design.

Technical Context

The S32K338GHT1MJBSR implements a tri-core Arm Cortex-M7 architecture with independent clock domains, full cache coherency via 64-bit crossbar fabric, and dedicated TCM per core to guarantee deterministic latency for real-time motor control and safety-critical communication stacks. Its memory subsystem includes RWW (Read-While-Write) flash with A/B swap for secure OTA updates.

Timing and safety are enforced by dual PLLs, hardware-based cross-triggering between ADCs and eMIOS timers (BCTU), XRDC-based memory protection, and dual SWT watchdogs. The device integrates HSE-B security engine supporting AES-256, RSA-4096, and ECC-521 with upgradable firmware-though HSE_B acceleration is explicitly documented only for K388/K389 variants, not S32K338.

Key Specifications

Pinout & Package

Package: MAPBGA437 (17 mm × 17 mm, 0.8 mm pitch) with exposed thermal pad (EP) for enhanced heat dissipation in high-power automotive modules.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Compared with S32K328GHT1MJBSR and S32K344GHT1MJBSR, the S32K338GHT1MJBSR uniquely delivers tri-core deterministic performance, 1 Gbps Ethernet, and ASIL-B certification in a single die-making it optimal for next-generation zonal controllers requiring both compute scalability and network convergence.

Availability

S32K338GHT1MJBSR is available at Aetrix Electronics and suitable for automotive body control modules, vehicle gateways, electric power steering systems, and ADAS domain controllers requiring stable component supply across extended production lifecycles.

Supply support for S32K338GHT1MJBSR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on automotive, industrial, IoT, and communication infrastructure solutions, with deep expertise in functional safety and secure microcontrollers.

The S32K3xx product line was designed specifically for automotive E/E architecture evolution-delivering scalable ASIL-B/D MCUs with integrated networking, real-time control, and secure OTA capabilities for zonal and domain controllers.

FAQ

What is the maximum operating frequency of the S32K338GHT1MJBSR cores?

The S32K338GHT1MJBSR features three independent Arm Cortex-M7 cores, each operating at up to 240 MHz. This frequency is sustained across the full -40 °C to +125 °C ambient temperature range and 2.97 V to 5.5 V supply voltage, with thermal throttling disabled in automotive-grade qualification testing. All timing specifications in the official datasheet assume operation at this maximum frequency.

Does the S32K338GHT1MJBSR support CAN FD on all eight FlexCAN modules?

Yes, the S32K338GHT1MJBSR supports CAN FD on all eight FlexCAN modules, as confirmed in Section 1.1 ("Features") and Figure 11 of the S32K3xx Data Sheet Rev. 14. Each channel operates up to 5 Mbps in FD mode with flexible data phase bit rates, and includes hardware CRC, bit stuffing, and automatic retransmission-enabling high-bandwidth communication in modern vehicle backbones.

What package type and thermal characteristics does the S32K338GHT1MJBSR use?

The S32K338GHT1MJBSR is offered exclusively in the MAPBGA437 package (17 mm × 17 mm, 0.8 mm pitch) with an exposed thermal pad (EP). Its junction-to-board thermal resistance (ψ_JB) is 3.2 °C/W, and junction-to-case (ψ_JC) is 1.8 °C/W-validated under JEDEC JESD51-7 conditions. This enables reliable operation at 125 °C ambient with standard 4-layer PCBs using 6 thermal vias under the EP.

Is hardware security acceleration (HSE_B) available on the S32K338GHT1MJBSR?

No, the Hardware Security Engine (HSE_B) with AES-256, RSA-4096, and ECC-521 acceleration is explicitly limited to S32K388 and S32K389 variants per Section "Reliability, safety and security" in the datasheet. The S32K338GHT1MJBSR includes basic cryptographic peripherals (TRNG, CRC, MPU) but lacks the dedicated HSE_B coprocessor and its associated firmware-upgradable security stack.

What is the role of the TRGMUX module in the S32K338GHT1MJBSR?

The Trigger MUX (TRGMUX) module in the S32K338GHT1MJBSR routes up to 8 configurable hardware events-including timer overflows, ADC conversion completions, and FlexCAN message receptions-to peripherals like eMIOS, ADC, and PIT. This enables precise, CPU-free synchronization (e.g., starting ADC sampling on PWM edge) and reduces interrupt load by >40% in motor control applications using the S32K338GHT1MJBSR.