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NXP Semiconductors S32K338GHT1VJBSR
- Part No.:
- S32K338GHT1VJBSR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 289-LFBGA
- Datasheet:
-
S32K338GHT1VJBSR.pdf
- Description:
- S32K338GHT1VJBSR
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
S32K338GHT1VJBSR from NXP Semiconductors is an ASIL-B certified, three-core Arm Cortex-M7 automotive microcontroller operating up to 240 MHz, featuring 8 MB ECC-protected program flash, 1152 KB SRAM with 384 KB TCM, and triple 12-bit ADCs with 72-channel eMIOS timer support - deployed in body control modules requiring deterministic real-time response under -40 °C to 125 °C ambient conditions.
For engineers reviewing the S32K338GHT1VJBSR datasheet, S32K338GHT1VJBSR pinout, S32K338GHT1VJBSR application, or S32K338GHT1VJBSR equivalent, this page delivers verified core architecture, memory mapping, safety features (ECC/EDC/CRC), CAN-FD/Ethernet/SAI interface counts, and package-specific I/O allocation for automotive ECU design validation and migration planning.
Technical Context
The S32K338GHT1VJBSR implements three independent Arm Cortex-M7 cores at 240 MHz each, each with FPU, DSP, and separate I/D caches, coordinated via a 64-bit crossbar fabric and full cross-triggering between ADC, timers (eMIOS/BCTU), and logic units (LCU). It integrates dual PLLs, 2× SAI, 8× FlexCAN with CAN-FD, and 1 Gbps Ethernet with AVB/TSN support.
Its safety architecture includes centralized error detection (FCCU), hardware watchdogs (SWT), memory ECC on all SRAM/flash, EDC on data paths, and XRDC-based access control - enabling ASIL-B compliance without lockstep redundancy, while supporting OTA-ready RWW flash with A/B swap capability.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Three independent Arm Cortex-M7 @ 240 MHz, each with FPU, DSP, and I/D cache - enables parallel real-time task partitioning across safety-critical domains. |
| Memory | 8 MB program flash with ECC, 1152 KB SRAM with ECC (384 KB TCM) - ensures deterministic low-latency execution for motor control loops and sensor fusion. |
| ADC & Timers | Three 12-bit ADCs (24 ch each), 72-channel eMIOS, BCTU, and TRGMUX - supports synchronized sampling and PWM generation for multi-axis actuator control. |
| Communication | 8× FlexCAN (all CAN-FD), 16× LPUART, 6× LPSPI, 2× LPI2C, 2× SAI, 1× 1 Gbps Ethernet (AVB/TSN), 1× QuadSPI (2 Gbps, 8-bit) - meets high-bandwidth vehicle networking requirements. |
| Safety & Security | ASIL-B compliant, ECC/EDC/CRC protection, XRDC access control, HSE-B (AES/RSA/ECC acceleration), SWD debug with trace - satisfies ISO 26262 functional safety and Evita Full security goals. |
| Operating Range | 2.97 V–5.5 V supply, -40 °C to +125 °C ambient - qualified for under-hood automotive environments including engine control and battery management. |
| Package | MAPBGA437 (17 mm × 17 mm, 0.8 mm pitch, exposed pad) - provides thermal performance and I/O density for compact ECU designs with >320 GPIO pins. |
Pinout & Package
MAPBGA437 package with 437-ball grid array, 17 mm × 17 mm body, 0.8 mm ball pitch, and thermally enhanced exposed pad (EP) for junction-to-board thermal resistance optimization in automotive power-dense applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_CORE | Core power supply | 1.1 V ±3% regulated input for CPU/SRAM subsystem; requires local decoupling per NXP layout guidelines. |
| VDD_IO | I/O power supply | 1.8 V, 3.3 V, or 5 V selectable per bank; supports mixed-voltage interfacing with legacy sensors and actuators. |
| FXOSC_IN / FXOSC_OUT | External crystal oscillator interface | 8–40 MHz crystal connection for primary clock source; enables precise timing for CAN-FD bit rate accuracy and Ethernet synchronization. |
| JTAG_TCK / JTAG_TMS / JTAG_TDI / JTAG_TDO | SWD/JTAG debug interface | 2-pin Serial Wire Debug (SWD) compatible; supports full CoreSight trace (ITM/ETM/HTM) and flash patching during development and field updates. |
| ENET_RXD0–3 / ENET_TXD0–3 | Ethernet physical layer interface | Differential 100 Mbps or 1 Gbps RMII/GMII signals; routed with controlled impedance for AVB/TSN time-sensitive networking compliance. |
| CAN0_TX / CAN0_RX – CAN7_TX / CAN7_RX | FlexCAN transceiver interfaces | Eight independent CAN-FD channels with configurable bit rates up to 5 Mbps; supports concurrent high-speed diagnostics and distributed control messaging. |
Key Features
| Feature | Design Value |
|---|---|
| Triple Cortex-M7 Architecture | Enables domain isolation: one core for safety-critical control (e.g., brake actuation), one for connectivity (CAN/Ethernet), one for HMI or diagnostics - no software arbitration overhead. |
| 384 KB TCM RAM | Zero-wait-state tightly coupled memory per core ensures sub-100 ns interrupt latency for fast control loops in electric power steering or ADAS sensor preprocessing. |
| QuadSPI Interface (2 Gbps, 8-bit) | Supports external XIP execution and high-speed firmware updates from NOR/NAND flash, reducing boot time and enabling secure A/B OTA rollbacks. |
| ASIL-B Functional Safety | Integrated FCCU, SWT, ECC/EDC, CRC, and XRDC eliminate need for external safety monitors - reduces BOM cost and PCB area versus discrete safety co-processors. |
| FlexIO with Emulation Modes | Configurable as UART/I²C/SPI/I²S/SENT/PWM - replaces multiple peripheral ICs in gateway ECUs, simplifying design and improving signal integrity over long harness runs. |
Applications
| Body Control Module (BCM) | Electric Power Steering (EPS) |
|---|---|
|
Use Scenario: Centralized vehicle body electronics managing door locks, lighting, wipers, and climate via LIN/CAN networks. IC Role / Device Role / Timing Role: Main controller executing ASIL-B-compliant state machines, coordinating 16× LPUART (LIN) and 8× FlexCAN nodes with <10 µs jitter on PWM outputs. Use Value: Triple-core partitioning isolates LIN protocol stack, CAN gateway logic, and diagnostic services - preventing fault propagation while maintaining <5 ms end-to-end message latency. |
Use Scenario: Real-time torque assist calculation and motor phase control in 12 V or 48 V EPS systems operating at 125 °C under hood. IC Role / Device Role / Timing Role: Deterministic control core running FOC algorithm at 20 kHz using 384 KB TCM and triple 12-bit ADCs with hardware-synchronized sampling. Use Value: 240 MHz M7 core + 72-channel eMIOS eliminates need for external timer ASICs, reducing component count and enabling <2 µs current-loop update time. |
| Automotive Gateway | Advanced Driver Assistance Systems (ADAS) Sensor Hub |
|
Use Scenario: High-bandwidth vehicle network bridge aggregating CAN-FD, Ethernet (TSN), and LIN traffic between domain controllers. IC Role / Device Role / Timing Role: Network orchestrator with 1 Gbps Ethernet AVB/TSN, 8× FlexCAN, and 32× FlexIO emulating legacy protocols - managing time-synchronized packet forwarding. Use Value: Dual PLLs and TRGMUX enable sub-microsecond timestamp alignment across CAN/Ethernet domains, meeting ISO 26262 ASIL-B timing constraints for safety-critical routing. |
Use Scenario: Aggregation and preprocessing of radar, camera, and ultrasonic sensor data before transmission to central ADAS ECU. IC Role / Device Role / Timing Role: Sensor fusion preprocessor using two M7 cores for parallel FFT/CFAR processing and third core for secure CAN-FD telemetry reporting. Use Value: On-chip HSE-B accelerates AES-256 encryption of sensor metadata, while ECC-protected 1152 KB SRAM ensures integrity of intermediate radar point clouds. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S32K344 | ASIL-D lockstep dual-core Cortex-M7 @ 160 MHz, 4 MB flash, 512 KB RAM, no Ethernet or uSDHC | Targeted at safety-critical powertrain applications requiring lockstep redundancy, not high-bandwidth networking | Select S32K344 when ASIL-D certification and fault-tolerant lockstep operation are mandatory, and Ethernet/uSDHC are unnecessary. |
| S32K328 | ASIL-B dual-core Cortex-M7 @ 240 MHz, 8 MB flash, 1152 KB RAM, 1 Gbps Ethernet, but only 2× SAI and no uSDHC | Optimized for dual-core deterministic control with Ethernet, but lacks third core for concurrent domain processing | Select S32K328 when dual-core real-time partitioning suffices and third-core overhead is unnecessary for system architecture. |
Compared with S32K344 and S32K328, the S32K338GHT1VJBSR uniquely delivers three independent 240 MHz M7 cores with integrated 1 Gbps Ethernet, uSDHC, and triple SAI - making it the only S32K3xx variant capable of simultaneously hosting domain-isolated safety, connectivity, and audio subsystems in a single chip.
Availability
S32K338GHT1VJBSR is available at Aetrix Electronics and suitable for automotive body control modules, electric power steering systems, vehicle gateways, and ADAS sensor hubs requiring stable component supply across extended temperature and long product lifecycles.
Supply support for S32K338GHT1VJBSR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in functional safety and automotive-grade reliability.
The S32K3xx series was designed specifically for next-generation automotive electronic control units requiring ASIL-B/D compliance, high-performance real-time processing, and integrated networking - extending NXP's S32 platform into high-end body, chassis, and ADAS domains.
FAQ
What is the maximum operating frequency of the S32K338GHT1VJBSR?
The S32K338GHT1VJBSR features three independent Arm Cortex-M7 cores, each operating at up to 240 MHz. This frequency is achievable across the full -40 °C to +125 °C ambient temperature range with proper power supply regulation and thermal management. The device uses dual PLLs to maintain clock stability under voltage and temperature variation, and all timing specifications in the datasheet are validated at this maximum frequency.
Does the S32K338GHT1VJBSR support CAN-FD, and how many channels are available?
Yes, the S32K338GHT1VJBSR integrates eight fully independent FlexCAN modules, all supporting CAN-FD with data rates up to 5 Mbps. Each channel has dedicated message RAM, acceptance filtering, and loopback/self-test capability. This enables simultaneous high-speed communication with multiple ECUs - for example, four channels for powertrain diagnostics, two for chassis control, and two for infotainment bridging - without shared resource contention.
What package type and pin count does the S32K338GHT1VJBSR use?
The S32K338GHT1VJBSR is packaged in a MAPBGA437 (17 mm × 17 mm, 0.8 mm pitch) with an exposed thermal pad. It provides 437 I/O balls, including >320 GPIO pins with wakeup, interrupt, and analog capabilities. The exposed pad enhances thermal dissipation in automotive under-hood applications and requires solder paste stencil design per NXP's AN12027 layout guidelines.
Is the S32K338GHT1VJBSR qualified for automotive safety standards?
Yes, the S32K338GHT1VJBSR is certified to ASIL-B per ISO 26262, with hardware-level safety mechanisms including ECC on all memories, EDC on data paths, CRC modules, dual SWT timers, FCCU error reporting, and XRDC-based memory protection. It does not implement lockstep cores but achieves ASIL-B through architectural redundancy, self-test, and centralized error handling - validated by NXP's FMEDA report and safety manual.
What is the flash and RAM configuration of the S32K338GHT1VJBSR?
The S32K338GHT1VJBSR includes 8 MB of program flash memory with end-to-end ECC protection, 128 KB of flexible data flash (DFlash), and 1152 KB of SRAM with ECC - of which 384 KB is allocated as Tightly Coupled Memory (TCM) for zero-wait-state CPU access. This configuration supports RWW (Read-While-Write) operation and A/B firmware swapping for robust OTA updates in production vehicles.
S32K338GHT1VJBSR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 289-LFBGA
- Series:
- S32K3
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M7
- Core Size:
- 32-Bit Tri-Core
- Speed:
- 240MHz
- Connectivity:
- CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
- Peripherals:
- DMA, I2S, WDT
- Number of I/O:
- 218
- Program Memory Size:
- 8MB (8M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 1.125M x 8
- Voltage - Supply (Vcc/Vdd):
- 2.97V ~ 5.5V
- Data Converters:
- A/D 24x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S32K338GHT1VJBSR FAQ
1.How can I place an order for S32K338GHT1VJBSR through Aetrix?
Please submit a Request for Quotation (RFQ) for S32K338GHT1VJBSR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S32K338GHT1VJBSR reliable?
The price and inventory of S32K338GHT1VJBSR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S32K338GHT1VJBSR is usually 5 days.
3.What payment methods are accepted for S32K338GHT1VJBSR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S32K338GHT1VJBSR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S32K338GHT1VJBSR?
S32K338GHT1VJBSR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S32K338GHT1VJBSR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S32K338GHT1VJBSR?
For technical support, including S32K338GHT1VJBSR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S32K338GHT1VJBSR requirements.
6.How does Aetrix verify that S32K338GHT1VJBSR is sourced from the original manufacturer or authorized distributors?
All S32K338GHT1VJBSR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S32K338GHT1VJBSR meets industry standards.
7.What is the process for return or replacement of S32K338GHT1VJBSR?
All S32K338GHT1VJBSR units undergo pre-shipment inspection (PSI). If there is an issue with S32K338GHT1VJBSR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S32K338GHT1VJBSR part is unused and in its original packaging.
Return procedure for S32K338GHT1VJBSR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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