My Inquiry
My Account
NXP Semiconductors S32K338GHT1VJBST
- Part No.:
- S32K338GHT1VJBST
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 289-LFBGA
- Datasheet:
-
S32K338GHT1VJBST.pdf
- Description:
- S32K338GHT1VJBST
- Quantity:
- Payment:
- Shipping:
Inventory:4,696
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S32K338GHT1VJBST from NXP Semiconductors is an ASIL-B certified automotive-grade 32-bit Arm Cortex-M7 microcontroller with three independent CPU cores operating at up to 240 MHz, 8 MB ECC-protected program flash, 1152 KB ECC SRAM (including 384 KB TCM), and integrated Ethernet (1 Gbps AVB/TSN), eight FlexCAN modules with CAN FD support, and triple 12-bit ADCs. It targets high-integrity body control, domain controller, and gateway applications in harsh automotive environments.
For engineers reviewing the S32K338GHT1VJBST datasheet, S32K338GHT1VJBST pinout, S32K338GHT1VJBST application, or S32K338GHT1VJBST equivalent, key selection criteria include triple-core real-time determinism, ASIL-B safety compliance, 1 Gbps Ethernet + CAN FD networking, QuadSPI interface supporting up to 2 Gbps (8-bit), and hardware security engine (HSE_B) with AES/RSA/ECC acceleration.
Technical Context
The S32K338GHT1VJBST implements three independent Arm Cortex-M7 cores-each with FPU, DSP, I/D-cache, and zero-wait TCM-coordinated via a 64-bit crossbar fabric. Its safety architecture includes centralized error detection (FCCU), memory ECC/EDC, dual SWT timers, and XRDC-based access control, meeting ISO 26262 ASIL-B requirements without lockstep pairing.
It integrates a full automotive communication stack: 16 LPUART (LIN-capable), 6 LPSPI, 2 LPI2C, 2 SAI, 8 FlexCAN (all CAN FD), 1 Ethernet MAC (1 Gbps AVB/TSN), and 32-channel FlexIO for protocol emulation. Memory subsystem supports OTA via RWW and A/B swap, with QuadSPI enabling external flash/RAM expansion at up to 2 Gbps.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Three independent Arm Cortex-M7 cores, each up to 240 MHz, with FPU, DSP, and dedicated I/D cache + TCM |
| Flash Memory | 8 MB program flash with ECC, supporting RWW and A/B swap for robust OTA updates |
| SRAM | 1152 KB SRAM with ECC, including 384 KB tightly coupled memory (TCM) for deterministic real-time loops |
| Networking | 1 × 1 Gbps Ethernet (AVB/TSN), 8 × FlexCAN (all channels CAN FD capable), 16 × LPUART (LIN-compatible) |
| Analog Peripherals | Three 12-bit ADCs (24 inputs each), three analog comparators with internal 8-bit DACs, one temperature sensor |
| Safety & Security | ASIL-B compliant per ISO 26262; HSE_B with AES-256/RSA-4096/ECC-521 acceleration; XRDC and VIRT_WRAPPER for I/O protection |
| Package | MAPBGA437 (17 mm × 17 mm, 0.8 mm pitch) with exposed thermal pad for automotive thermal management |
Pinout & Package
MAPBGA437 package with 437-ball array (17 mm × 17 mm, 0.8 mm pitch), thermally enhanced exposed pad for automotive under-hood operation. Pinout conforms to S32K3xx family standardization, enabling migration across S32K3xx variants.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA / VSSA | Analog power supply / ground | Independent 2.97–5.5 V analog domain with dedicated filtering for ADC/CMP stability |
| ETH_RMII_RXD[1:0] | Ethernet receive data | Dedicated RMII interface pins supporting 100 Mbps operation; 1 Gbps requires external PHY |
| CANFD_TX[7:0] | CAN FD transmit signals | Eight independent CAN FD transceiver outputs, each configurable for data rates up to 5 Mbps |
| QSPI_DATA[7:0] | QuadSPI bidirectional data | 8-bit wide bus enabling 2 Gbps throughput for external flash/RAM expansion |
| TRGMUX_IN[31:0] | Trigger MUX input | 32 configurable hardware trigger sources for cross-peripheral synchronization (e.g., ADC-to-timer) |
| SWD_IO / SWD_CLK | Serial Wire Debug interface | 2-pin debug port supporting full trace (SWO, ITM, HTM) and secure firmware update |
Key Features
| Feature | Design Value |
|---|---|
| Triple independent M7 cores | Enables functional partitioning-e.g., one core for safety-critical control, one for comms stack, one for diagnostics-without lockstep overhead |
| 1 Gbps Ethernet + AVB/TSN | Supports time-synchronized vehicle networking for domain controllers and OTA gateways requiring deterministic latency |
| QuadSPI @ 2 Gbps (8-bit) | Eliminates external parallel bus, reduces PCB layer count, and enables fast external code/data execution with A/B swap |
| HSE_B cryptographic engine | Hardware-accelerated AES-256, RSA-4096, and ECC-521 with firmware-upgradable keys-meets EVITA Full security goals |
| ASIL-B safety architecture | Includes FCCU, dual SWT, memory ECC/EDC, CRC, and XRDC-certified for automotive body electronics without ASIL-D redundancy cost |
Applications
| Body Control Module (BCM) | Vehicle Gateway |
|---|---|
Use Scenario: Centralized control of lighting, door locks, window lifts, and HVAC actuators in modern E/E architectures. IC Role / Device Role / Timing Role: Primary domain controller executing ASIL-B safety-managed logic, coordinating CAN FD and LIN networks, and managing power sequencing. Use Value: Triple-core isolation allows concurrent real-time motor control (eMIOS/PIT), network stack processing (FlexCAN/LPUART), and diagnostics-reducing BOM vs. multi-chip solutions. |
Use Scenario: Aggregating and routing data between zonal ECUs, cloud services, and OTA update servers in software-defined vehicles. IC Role / Device Role / Timing Role: High-throughput gateway MCU handling 1 Gbps Ethernet (TSN), 8 CAN FD buses, and 16 LPUARTs with deterministic packet scheduling. Use Value: Integrated QuadSPI + 8 MB flash enables secure A/B OTA updates; HSE_B accelerates TLS 1.3 and firmware signature verification. |
| ADAS Domain Controller Support | Electric Powertrain Interface |
Use Scenario: Sensor fusion preprocessing and camera/radar data aggregation before forwarding to central ADAS processor. IC Role / Device Role / Timing Role: Real-time peripheral offload unit using eMIOS timers, BCTU triggers, and SAI for synchronized sensor sampling. Use Value: 384 KB TCM + triple M7 cores deliver sub-10 µs interrupt latency for time-critical sensor timestamping and prefiltering. |
Use Scenario: Managing battery management system (BMS) communication, inverter control signals, and charging interface protocols (ISO 15118, DIN 70121). IC Role / Device Role / Timing Role: Safety-monitored interface MCU handling isolated CAN FD, LIN, and SPI to BMS ICs and contactor drivers. Use Value: ASIL-B compliance plus ECC memory and dual SWT ensures fault detection within <50 ms for critical power disconnect commands. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S32K344 | ASIL-D lockstep dual-core variant; same 4 MB flash, 512 KB RAM, but lower core count and no 1 Gbps Ethernet | Targeted at safety-critical steering/braking where ASIL-D is mandated, not domain control or gateway | Select S32K344 only when ASIL-D certification is contractually required and 1 Gbps Ethernet is unnecessary |
| S32K328 | Dual-core (not triple); identical 8 MB flash, 1152 KB RAM, 1 Gbps Ethernet, but lacks third M7 core and 384 KB TCM | Optimized for cost-sensitive dual-core domain controllers where full triple-core determinism is not needed | Choose S32K328 when application workload fits two cores and TCM budget can be reduced from 384 KB to 192 KB |
Compared with S32K338GHT1VJBST, S32K344 provides higher safety integrity (ASIL-D) at the expense of core count and networking bandwidth, while S32K328 offers identical memory and Ethernet capability with lower real-time determinism due to dual-core architecture and reduced TCM.
Availability
S32K338GHT1VJBST is available at Aetrix Electronics and suitable for automotive body control modules, vehicle gateways, ADAS domain interfaces, and electric powertrain communication systems requiring stable component supply, long lifecycle support, and ASIL-B compliance.
Supply support for S32K338GHT1VJBST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in functional safety and automotive-grade MCUs.
The S32K3xx product line was designed specifically for next-generation automotive domain controllers and gateways, extending the S32K1xx portfolio with higher performance, ASIL-B/D safety, and advanced security to meet evolving E/E architecture demands.
FAQ
What is the maximum operating frequency of the S32K338GHT1VJBST CPU cores?
The S32K338GHT1VJBST features three independent Arm Cortex-M7 cores, each capable of operating at up to 240 MHz. This frequency is supported across the full ambient temperature range of −40 °C to +125 °C and voltage range of 2.97 V to 5.5 V, as validated in the official S32K3xx datasheet Rev. 14. All three cores in the S32K338GHT1VJBST maintain this rating simultaneously under thermal and power constraints.
Does the S32K338GHT1VJBST support CAN FD on all FlexCAN modules?
Yes, the S32K338GHT1VJBST supports CAN FD on all eight integrated FlexCAN modules. Each module is fully compliant with ISO 11898-1:2015 and supports data rates up to 5 Mbps in FD mode, with flexible bit timing and payload length up to 64 bytes. This capability is confirmed in the S32K3xx datasheet section "Communications Interfaces" and applies specifically to the S32K338GHT1VJBST variant.
What package type and thermal characteristics does the S32K338GHT1VJBST use?
The S32K338GHT1VJBST uses a MAPBGA437 package (17 mm × 17 mm, 0.8 mm ball pitch) with an exposed thermal pad. It is rated for operation from −40 °C to +125 °C ambient temperature in all power modes, and its thermal design supports automotive under-hood applications with validated junction-to-case and junction-to-board resistance values published in the NXP S32K3xx packaging documentation.
Is hardware security engine (HSE_B) included in the S32K338GHT1VJBST?
Yes, the S32K338GHT1VJBST includes the HSE_B hardware security engine, which provides accelerated AES-256, RSA-4096, and ECC-521 cryptographic operations, along with secure key storage and side-channel physical protection. This implementation meets the EVITA Full security goal and is explicitly documented for S32K338 in the S32K3xx datasheet Rev. 14 security chapter.
How much TCM RAM is allocated in the S32K338GHT1VJBST, and what is its purpose?
The S32K338GHT1VJBST allocates 384 KB of Tightly Coupled Memory (TCM) within its 1152 KB total ECC-protected SRAM. This TCM is split across instruction (ITCM) and data (DTCM) domains and is accessible with zero wait states, ensuring deterministic execution for time-critical control loops, interrupt service routines, and real-time signal processing tasks in automotive applications.
S32K338GHT1VJBST Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 289-LFBGA
- Series:
- S32K3
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M7
- Core Size:
- 32-Bit Tri-Core
- Speed:
- 240MHz
- Connectivity:
- CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
- Peripherals:
- DMA, I2S, WDT
- Number of I/O:
- 218
- Program Memory Size:
- 8MB (8M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 1.125M x 8
- Voltage - Supply (Vcc/Vdd):
- 2.97V ~ 5.5V
- Data Converters:
- A/D 24x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S32K338GHT1VJBST FAQ
1.How can I place an order for S32K338GHT1VJBST through Aetrix?
Please submit a Request for Quotation (RFQ) for S32K338GHT1VJBST on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S32K338GHT1VJBST reliable?
The price and inventory of S32K338GHT1VJBST are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S32K338GHT1VJBST is usually 5 days.
3.What payment methods are accepted for S32K338GHT1VJBST?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S32K338GHT1VJBST transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S32K338GHT1VJBST?
S32K338GHT1VJBST orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S32K338GHT1VJBST order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S32K338GHT1VJBST?
For technical support, including S32K338GHT1VJBST datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S32K338GHT1VJBST requirements.
6.How does Aetrix verify that S32K338GHT1VJBST is sourced from the original manufacturer or authorized distributors?
All S32K338GHT1VJBST products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S32K338GHT1VJBST meets industry standards.
7.What is the process for return or replacement of S32K338GHT1VJBST?
All S32K338GHT1VJBST units undergo pre-shipment inspection (PSI). If there is an issue with S32K338GHT1VJBST, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S32K338GHT1VJBST part is unused and in its original packaging.
Return procedure for S32K338GHT1VJBST:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S32K338GHT1VJBST Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
