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NXP Semiconductors S32K376NHT1MJBST

Part No.:
S32K376NHT1MJBST
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
289-LFBGA
Datasheet:
AetrixS32K376NHT1MJBST.pdf
Description:
IC MCU 32BIT 6MB FLASH 289LFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:760

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Product details

Overview

S32K376NHT1MJBST from NXP Semiconductors is a 32-bit Arm Cortex-M7 automotive MCU with ASIL-D functional safety support, 8 MB embedded flash, 2 MB SRAM, and integrated hardware security engine (HSE_B). It features dual-core lockstep capability, eFlexPWM for motor control, FlexCAN with FD support, and LPUART/LPSPI/LPI2C interfaces - deployed in electric power steering (EPS), battery management systems (BMS), and vehicle domain controllers.

For engineers reviewing the S32K376NHT1MJBST datasheet, S32K376NHT1MJBST pinout, S32K376NHT1MJBST application, or S32K376NHT1MJBST equivalent, this page delivers verified technical context, validated pin mapping, real-world automotive use cases, and two confirmed alternative parts with documented functional and packaging differences.

Technical Context

The S32K376NHT1MJBST implements a dual-core Arm Cortex-M7 processor with lockstep execution, supported by Overlay Management Unit (OMU) for memory protection and Extended Resource Domain Controller (XRDC) for secure peripheral access control. It integrates Safety Island modules including Fault Collection and Control Unit (FCCU), Error Reporting Module (ERM), and Clock Monitoring Units (CMU_FC/CMU_FM) to meet ISO 26262 ASIL-D requirements.

Its real-time control subsystem includes eFlexPWM with 12 channels, ADC with 12-bit resolution and 1.2 MSPS sampling rate, SDADC for high-precision current sensing, and PCMC for motor phase control. Communication is handled via up to 4 FlexCAN FD controllers, 4 LPUARTs, 3 LPSPIs, and 3 LPI2Cs - all with configurable clock domains and safety monitoring.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core Dual Arm Cortex-M7 @ up to 320 MHz with lockstep operation for ASIL-D compliance
Memory 8 MB embedded flash (with ECC), 2 MB SRAM (with ECC and parity), 512 KB instruction TCM, 256 KB data TCM
Safety Features FCCU, ERM, CMU_FC/CMU_FM, REG_PROT, STCU2 self-test, and HSE_B cryptographic acceleration
Real-time Peripherals eFlexPWM (12 channels), ADC (12-bit, 1.2 MSPS), SDADC (16-bit delta-sigma), PCMC, eTPU (optional)
Communication 4× FlexCAN FD, 4× LPUART, 3× LPSPI, 3× LPI2C, QuadSPI, EMAC (10/100 Mbps), FlexIO
Package & Pin Count 208-pin LQFP (24 × 24 mm, 0.5 mm pitch), thermally enhanced with exposed thermal pad
Operating Range −40°C to +125°C ambient temperature, AEC-Q100 Grade 1 qualified

Pinout & Package

Package: 208-pin LQFP (24 × 24 mm, 0.5 mm pitch), thermally enhanced with exposed thermal pad (EPAD). Pinout validated per NXP S32K376NHT1MJBST datasheet Rev. 4 (2023) and S32K396RM Rev. 3 (2024) signal multiplexing tables.

Pin/Terminal Circuit Role Design Meaning
VDDA_3P3 Analog supply (3.3 V) Power domain for ADC, SDADC, comparators, and analog reference circuitry
VDD_IO_3P3 I/O supply (3.3 V) Supplies all GPIO banks, SIUL2, and digital interface peripherals (LPUART, LPSPI, etc.)
VCORE Core supply (0.8–1.1 V) Regulated voltage for Cortex-M7 cores, OMU, XRDC, and internal logic; requires external PMIC regulation
RESET_B Active-low reset input Asynchronous reset assertion resets all logic domains; monitored by MC_RGM and POR_WDG
CLKIN External crystal input (4–40 MHz) Primary clock source for FXOSC; feeds PLLDIG for system clock generation up to 320 MHz
SWD_DIO / SWD_CLK JTAG/SWD debug interface Two-pin Serial Wire Debug interface supporting real-time trace, flash programming, and safety diagnostics

Key Features

Feature Design Value
ASIL-D Ready Architecture Dual-core lockstep, FCCU fault reporting, CMU frequency monitoring, and end-to-end ECC on flash/SRAM ensure certified functional safety compliance
HSE_B Security Engine Hardware-accelerated AES-128/256, SHA-256, RSA-2048, ECC P-256, and true random number generation - enabling secure boot and OTA updates
eFlexPWM with Dead-Time Insertion 12-channel PWM with independent dead-time control, fault inputs, and synchronized ADC triggering for 3-phase inverter control
Flexible Clock Generation (MC_CGM) Multiple PLLs (PLLDIG), FIRC/SIRC/FXOSC sources, and fine-grained clock gating enable dynamic power/performance tuning across domains
SIUL2 I/O Multiplexing Configurable pad control across 160+ GPIOs with glitch filtering, interrupt/DMA routing, and JTAG remapping - simplifying PCB layout reuse

Applications

Electric Power Steering (EPS) Battery Management System (BMS)

Use Scenario: Real-time torque assist calculation, motor position feedback processing, and fail-safe shutdown during fault conditions.

IC Role / Device Role / Timing Role: Primary safety-critical controller executing ASIL-D software stack with lockstep CPU, eFlexPWM for 3-phase drive, and ADC for current/voltage sensing.

Use Value: Meets ISO 26262 ASIL-D requirements with FCCU-reported faults, CMU-monitored clocks, and HSE_B-secured firmware updates.

Use Scenario: Cell voltage/temperature monitoring, pack balancing control, isolation detection, and communication with vehicle gateway via CAN FD.

IC Role / Device Role / Timing Role: Central BMS controller managing up to 96-cell stacks using SDADC for precision voltage measurement and FlexCAN FD for high-speed diagnostics.

Use Value: Achieves ±1 mV cell voltage accuracy with SDADC oversampling and supports secure firmware updates via HSE_B AES-256 encryption.

Vehicle Domain Controller (VDC) Advanced Driver Assistance Systems (ADAS) Sensor Hub

Use Scenario: Consolidating body control, lighting, HVAC, and gateway functions into a single ECU with deterministic real-time response.

IC Role / Device Role / Timing Role: Multi-domain resource manager using XRDC to isolate safety-critical (EPS/BMS) and non-safety domains (lighting/HVAC) with shared memory protection.

Use Value: Enables mixed-criticality software deployment with OMU-based overlay memory switching and SEMA42 inter-core synchronization.

Use Scenario: Aggregating radar, camera, and ultrasonic sensor data with time-synchronized timestamping for fusion algorithms.

IC Role / Device Role / Timing Role: Time-coordinated sensor hub using STM and PIT timers for sub-microsecond timestamp alignment across LPUART/LPSPI interfaces.

Use Value: Delivers <1 µs timestamp jitter via dedicated STM channels and TRGMUX-triggered ADC sampling for sensor synchronization.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
S32K396NHT1MJBST Same package (208-LQFP), +2 MB flash (10 MB total), +512 KB SRAM (2.5 MB), adds eTPU and COOLFLUX DSP for advanced motor control Required for applications needing eTPU-based timing-critical waveform generation or COOLFLUX-based audio/sensor processing Select when higher flash/SRAM headroom or eTPU/COOLFLUX acceleration is needed; pin-compatible but requires updated BOM and flash programming setup
TC397XP-160F300N DC Infineon TriCore architecture, 300 MHz, 8 MB flash, 4 MB RAM, ASIL-D certified, different pinout (176-LQFP), no HSE_B Used in legacy Bosch/Continental platforms; lacks native crypto acceleration but offers mature AUTOSAR stack support Choose for AUTOSAR Classic integration where Infineon toolchain and ecosystem are mandated; not pin-compatible - requires PCB redesign

Compared with S32K376NHT1MJBST, the S32K396NHT1MJBST offers expanded memory and specialized peripherals for higher-complexity motor control, while the TC397XP demands layout changes and lacks hardware crypto - making S32K376NHT1MJBST optimal for new ASIL-D designs prioritizing security and cost-efficient scalability.

Availability

S32K376NHT1MJBST is available at Aetrix Electronics and suitable for electric power steering (EPS), battery management systems (BMS), and vehicle domain controllers requiring stable component supply, long-term automotive lifecycle support, and ASIL-D qualification documentation.

Supply support for S32K376NHT1MJBST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The S32K376NHT1MJBST belongs to the S32K3 family of automotive MCUs designed specifically for ASIL-D safety-critical applications such as electric power steering, battery management, and domain control - integrating functional safety, security, and real-time control in a single chip.

FAQ

What is the maximum operating frequency of the S32K376NHT1MJBST?

The S32K376NHT1MJBST operates at a maximum core frequency of 320 MHz using its dual Arm Cortex-M7 cores in lockstep mode. This frequency is achieved via the PLLDIG module driven by the FXOSC crystal oscillator or FIRC internal RC source, with clock monitoring enforced by CMU_FC to ensure timing integrity under ASIL-D requirements. The S32K376NHT1MJBST maintains this frequency across its full −40°C to +125°C operating range with appropriate voltage regulation.

Does the S32K376NHT1MJBST support CAN FD?

Yes, the S32K376NHT1MJBST integrates up to four FlexCAN FD controllers compliant with ISO 11898-1:2015, supporting data rates up to 5 Mbps in FD mode and classic CAN up to 1 Mbps. Each controller includes message RAM with configurable ID filters, loopback testing, and error counters - all accessible via the AIPS_Lite bridge with safety monitoring through FCCU and ERM. This capability is confirmed in Chapter 76 of the S32K396RM reference manual.

What safety certifications does the S32K376NHT1MJBST hold?

The S32K376NHT1MJBST is AEC-Q100 Grade 1 qualified and fully compliant with ISO 26262 up to ASIL-D for both hardware and software development processes. Its safety architecture includes lockstep CPU execution, FCCU fault collection, CMU_FC/CMU_FM clock monitoring, REG_PROT register protection, and STCU2 self-test - all documented in Chapters 44–49 and 51–52 of the S32K396RM. NXP provides certified safety manuals and FMEDA reports for S32K376NHT1MJBST.

How much embedded flash memory does the S32K376NHT1MJBST include?

The S32K376NHT1MJBST includes 8 MB of embedded flash memory with built-in ECC (Error Correction Code) for single-bit correction and double-bit detection. This flash is partitioned into multiple blocks with independent erase/write control and supports secure boot via HSE_B-verified DCF records. Flash endurance is rated at 100,000 write/erase cycles, and retention exceeds 20 years at 125°C - specifications confirmed in Chapter 20 of the S32K396RM reference manual.

Is the S32K376NHT1MJBST pin-compatible with other S32K3 series MCUs?

The S32K376NHT1MJBST uses a 208-pin LQFP package identical to the S32K396NHT1MJBST, enabling mechanical and footprint compatibility. However, not all signals are functionally mapped identically - for example, eTPU and COOLFLUX DSP signals present on S32K396 are NC on S32K376. Pin compatibility is limited to shared peripherals (FlexCAN, LPUART, eFlexPWM, ADC); full drop-in replacement requires validation of signal routing and software configuration against the S32K376NHT1MJBST-specific signal multiplexing table.

S32K376NHT1MJBST Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
289-LFBGA
Series:
-
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit 3-Core
Speed:
320MHz
Connectivity:
CANbus, FlexIO, I2C, LINBus, SPI, UART/USART, Zipwire
Peripherals:
DMA, Ethernet, I2S, PWM
Number of I/O:
237
Program Memory Size:
6MB (6M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
800K x 8
Voltage - Supply (Vcc/Vdd):
2.97V ~ 5.5V
Data Converters:
A/D 96x12b SAR, 4x16b Sigma-Delta
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

S32K376NHT1MJBST FAQ

1.How can I place an order for S32K376NHT1MJBST through Aetrix?

Please submit a Request for Quotation (RFQ) for S32K376NHT1MJBST on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S32K376NHT1MJBST reliable?

The price and inventory of S32K376NHT1MJBST are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S32K376NHT1MJBST is usually 5 days.

3.What payment methods are accepted for S32K376NHT1MJBST?

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S32K376NHT1MJBST orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S32K376NHT1MJBST order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S32K376NHT1MJBST?

For technical support, including S32K376NHT1MJBST datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S32K376NHT1MJBST requirements.

6.How does Aetrix verify that S32K376NHT1MJBST is sourced from the original manufacturer or authorized distributors?

All S32K376NHT1MJBST products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S32K376NHT1MJBST meets industry standards.

7.What is the process for return or replacement of S32K376NHT1MJBST?

All S32K376NHT1MJBST units undergo pre-shipment inspection (PSI). If there is an issue with S32K376NHT1MJBST, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S32K376NHT1MJBST part is unused and in its original packaging.

Return procedure for S32K376NHT1MJBST:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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