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NXP Semiconductors S32M241CCABMKHSR
- Part No.:
- S32M241CCABMKHSR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 64-LQFP Exposed Pad
- Datasheet:
-
S32M241CCABMKHSR.pdf
- Description:
- S32M241CCABMKHSR
- Quantity:
- Payment:
- Shipping:
Inventory:3,078
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Product details
Overview
S32M241CCABMKHSR from NXP Semiconductors is an automotive-grade System-in-Package (SiP) microcontroller integrating an Arm Cortex-M4F core @ 80 MHz, 128 kB flash, 32 kB SRAM, and a 6-channel MOSFET gate driver unit for BLDC/PMSM motor control. It features integrated 12 V regulator, 5 V/30 mA auxiliary supply, LIN/CXPI/CAN FD physical interface, and ASIL-B compliance per ISO 26262 - deployed in single-motor automotive body and chassis actuation systems.
For engineers reviewing the S32M241CCABMKHSR datasheet, S32M241CCABMKHSR pinout, S32M241CCABMKHSR application, or S32M241CCABMKHSR equivalent, key selection criteria include its 64-pin LQFP-EP package with integrated high-voltage analog front-end, automotive temperature grade (–40 °C to 125 °C), and functional integration of voltage regulation, current sensing (DPGA), and motor gate drive - eliminating external regulators, PHYs, and pre-drivers in cost-sensitive motor control designs.
Technical Context
The S32M241CCABMKHSR implements a dual-domain SiP architecture: the MCU domain hosts the Arm Cortex-M4F core with FlexTimer modules (FTM0–FTM3), LPUART/LPI2C/LPSPI peripherals, and SWD/JTAG debug; the Application Extension (AE) domain integrates analog and power functions including a 6-channel GDU, DPGA-based current sense amplifier, HVI/VM battery monitor, and LIN/CXPI/CAN FD PHY - all operating from a single 12 V automotive battery input.
Its power management includes a built-in 12 V regulator with VLS_OUT output, VPRE pre-regulation stage (up to 7.5 V), and external FET control via GCTL pin for thermal optimization. The device supports single-shunt 3-phase motor control with internal PWM-to-GDU signal routing, ADC-triggered PDB for precise timing, and hardware safety features including CSEc security engine and ASIL-B fault handling.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | Arm Cortex-M4F @ 80 MHz - delivers deterministic real-time motor control with FPU support for field-oriented control (FOC) math. |
| Memory | 128 kB flash / 32 kB SRAM / 4 kB FlexRAM + 64 kB DFlash - sufficient for AUTOSAR MCAL, core self-test, and application firmware with data logging. |
| Motor Drive | 6-channel GDU supporting 3-phase BLDC/PMSM - enables direct connection to external high-side/low-side MOSFETs without external drivers. |
| Analog Front-End | 1× DPGA, 2× 12-bit ADC, 1× 8-bit DAC, HVI/VM inputs - provides isolated current sensing, DC-link monitoring, and battery diagnostics. |
| Communication | 1× CAN-FD PHY, 1× LIN/CXPI PHY, 1× LPUART, 1× LPSPI, 1× LPI2C - allows direct bus connectivity without external transceivers. |
| Supply & Temp | VSUP = 3.5–40 V (transient); TA = –40 °C to +125 °C (Grade M); 64-pin LQFP-EP with exposed pad - qualified for under-hood automotive environments. |
| Functional Safety | ISO 26262 ASIL-B compliant with CSEc hardware security - supports secure boot, cryptographic acceleration, and memory protection for safety-critical motor control. |
Pinout & Package
Package: 64-pin LQFP-EP (exposed thermal pad), RoHS-compliant, moisture sensitivity level 3. Pinout validated per S32M24x Reference Manual IOMUX files and datasheet Figures 1–2.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VSUP | Main HV supply input | Accepts 12 V automotive battery (3.5–40 V); powers internal regulator, GDU, and AE domain. |
| VLS_OUT | GDU low-side supply | Internally generated ~10 V rail for low-side gate drivers; requires external 4.7 µF decoupling. |
| HG0–HG2, LG0–LG2 | GDU high-/low-side gate outputs | Drive external N-channel MOSFET gates; each pair controls one half-bridge in 3-phase topology. |
| HS0–HS2, LS0–LS2 | GDU high-/low-side source returns | Return paths tied to phase nodes; enable bootstrap operation and current sensing via shunt resistors. |
| ISENSE_A, AMP_OUT | Current sense interface | Connects to DPGA inputs for single-shunt motor current measurement with programmable gain. |
| LIN_TX/RX, CAN_TX/RX | PHY interface pins | Direct connection to LIN bus or CAN FD H/L lines; no external transceiver required. |
| PTA5, RESET_B | Reset control | Must be externally connected per datasheet Figure 1; enables reliable power-on reset and watchdog recovery. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated 12 V regulator | Eliminates external buck converter; supplies MCU, AE, and external sensors (e.g., Hall ICs) from raw battery. |
| 5 V/30 mA auxiliary output (VDD_AE10) | Power external position sensors or logic without adding LDOs - reduces BOM count and board area. |
| Hardware current sensing (DPGA + ADC) | Enables accurate single-shunt FOC with <1% gain error and programmable offset correction - no external op-amps needed. |
| ASIL-B certified safety architecture | Includes lockstep timer monitors, memory ECC, CSEc crypto engine, and fault collection unit - meets ISO 26262 requirements out-of-box. |
| Thermal-aware GCTL-controlled pre-regulation | External p-FET controlled by GCTL pin reduces on-die power dissipation at high ambient temps - extends junction life in under-hood use. |
Applications
| Electric Power Steering (EPS) | Automotive HVAC Blower |
|---|---|
Use Scenario: Closed-loop torque assist in rack-and-pinion steering systems with fail-safe redundancy. IC Role / Device Role / Timing Role: Primary motor controller executing FOC algorithm, managing CAN FD communication with ADAS ECU, and monitoring battery voltage/current via HVI/DPGA. Use Value: Integrated GDU and ASIL-B safety features eliminate need for external driver ICs and safety co-processors - reducing system latency and PCB footprint by >35%. | Use Scenario: Variable-speed centrifugal blower in climate control units requiring quiet, efficient airflow modulation. IC Role / Device Role / Timing Role: Standalone motor controller using LIN/CXPI for body control module (BCM) commands and internal ADC for thermal feedback. Use Value: On-chip 5 V supply powers Hall-effect rotor position sensor; integrated 12 V regulator removes need for separate power rail - simplifying harness design. |
| Seat Motor Actuation | Active Suspension Dampers |
Use Scenario: Multi-directional seat adjustment with overload detection and soft-start profiles. IC Role / Device Role / Timing Role: Dual-motor controller (via time-sliced GDU channels) with LIN interface for body domain network and internal temperature sensor for thermal derating. Use Value: Single-chip solution replaces discrete MCU + gate driver + regulator + LIN transceiver - cutting BoM cost by ~$1.80/unit at volume. | Use Scenario: High-bandwidth electromagnetic damper control requiring fast current loop response and vibration damping algorithms. IC Role / Device Role / Timing Role: Real-time motor controller running at 80 MHz with PDB-triggered ADC sampling synchronized to PWM edges. Use Value: Hardware-accelerated current sensing (DPGA + PDB) achieves <2 µs current loop latency - enabling 5 kHz control bandwidth for road noise cancellation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar motor control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S32M242CCABMKHSR | 256 kB flash / 32 kB SRAM vs. 128 kB / 32 kB; identical GDU, peripherals, and package. | Same motor control use cases but supports larger AUTOSAR stacks or dual-application firmware images. | Select when firmware size exceeds 128 kB or future-proofing for feature expansion is required. |
| MC9S12VR64CPV | Legacy S12VR 16-bit MCU; no integrated GDU, no CAN FD, no DPGA; requires external gate drivers and regulators. | Lower-cost retrofit for legacy 12 V brushed DC motor systems without FOC or safety certification needs. | Choose only for brownfield designs where toolchain continuity outweighs integration benefits. |
Compared with S32M242CCABMKHSR, the S32M241CCABMKHSR offers identical motor control capability at lower flash cost - ideal for fixed-function EPS or HVAC controllers. Versus MC9S12VR64CPV, it delivers full SiP integration, ASIL-B compliance, and modern peripheral sets - reducing total system BOM, layout complexity, and validation effort.
Availability
S32M241CCABMKHSR is available at Aetrix Electronics and suitable for electric power steering (EPS), HVAC blower control, and seat actuation systems requiring stable component supply, automotive qualification, and long-term lifecycle support.
Supply support for S32M241CCABMKHSR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in automotive, industrial, and IoT solutions, with deep expertise in microcontrollers, radar, and secure connectivity.
The S32M2xx product line targets cost-optimized, high-integration motor control for automotive body electronics - combining Arm-based MCU performance with automotive-qualified analog and power functions in a single SiP.
FAQ
What is the maximum operating junction temperature for the S32M241CCABMKHSR?
The S32M241CCABMKHSR is rated for Grade M operation with ambient temperature range –40 °C to +125 °C. Its maximum junction temperature (TJ) is 150 °C under continuous operation, verified per thermal characterization in the S32M2xx Data Sheet Rev. 10. Derating is applied above 125 °C ambient, and thermal management via the GCTL-controlled external FET is recommended for sustained high-load conditions. The S32M241CCABMKHSR includes on-die temperature sensor (TMON_PHY) for real-time monitoring.
Does the S32M241CCABMKHSR support CAN FD communication natively?
Yes, the S32M241CCABMKHSR includes a fully integrated CAN FD physical layer (PHY) with dedicated CAN_TX and CAN_RX pins - enabling direct connection to CAN FD bus without external transceivers. The CAN FD module supports data rates up to 5 Mbps and frame payloads up to 64 bytes. Configuration and protocol handling are managed by the on-chip CAN controller, and the S32M241CCABMKHSR's software stack (AUTOSAR MCAL) provides full CAN FD driver support.
How is current sensing implemented in the S32M241CCABMKHSR for motor control?
The S32M241CCABMKHSR implements current sensing via a dedicated Differential Programmable Gain Amplifier (DPGA) feeding two 12-bit ADCs. The DPGA accepts shunt voltage inputs (ISENSE_A, AMP_OUT) with programmable gain (1–32×) and offset correction, enabling high-accuracy single-shunt FOC. ADC conversion is hardware-triggered by the Programmable Delay Block (PDB) synchronized to PWM edges - achieving <2 µs sampling jitter. This integrated path eliminates external op-amps and precision ADCs in the S32M241CCABMKHSR design.
What package type and thermal characteristics does the S32M241CCABMKHSR use?
The S32M241CCABMKHSR uses a 64-pin LQFP-EP (leadless quad flat package with exposed pad) measuring 10 mm × 10 mm × 1.4 mm. The exposed thermal pad improves heat dissipation from the AE domain (GDU, regulators), achieving θJA ≈ 32 °C/W on 4-layer boards with 1-in² copper pour. Thermal vias under the pad are mandatory per AN5032 guidelines. The S32M241CCABMKHSR's package supports reflow soldering per J-STD-020 and is qualified to AEC-Q100 Grade 1 (–40 °C to +125 °C).
Is the S32M241CCABMKHSR compatible with AUTOSAR software stacks?
Yes, the S32M241CCABMKHSR is supported by NXP's S32DS IDE and includes AUTOSAR MCAL drivers certified to ISO 26262 ASIL-B. The S32M241CCABMKHSR's family software package (denoted by 'S' in ordering code) delivers standardized MCAL modules for CAN, LIN, SPI, ADC, GDU, and Crypto (CSEc), along with core self-test libraries and safety manual documentation. Integration with EB tresos or Vector DaVinci tools is validated, and the S32M241CCABMKHSR's memory map and interrupt vectors align with AUTOSAR OS requirements.
S32M241CCABMKHSR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 64-LQFP Exposed Pad
- Series:
- S32M2xx
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M4F
- Core Size:
- 32-Bit
- Speed:
- 80MHz
- Connectivity:
- CANbus, FlexIO, I2C, LINBus, SPI, UART/USART
- Peripherals:
- DMA, I2S, LVD, LVR, POR, PWM, WDT
- Number of I/O:
- -
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.13V ~ 5.5V
- Data Converters:
- A/D 6x12b SAR; D/A 1x8b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S32M241CCABMKHSR FAQ
1.How can I place an order for S32M241CCABMKHSR through Aetrix?
Please submit a Request for Quotation (RFQ) for S32M241CCABMKHSR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S32M241CCABMKHSR reliable?
The price and inventory of S32M241CCABMKHSR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S32M241CCABMKHSR is usually 5 days.
3.What payment methods are accepted for S32M241CCABMKHSR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S32M241CCABMKHSR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S32M241CCABMKHSR?
S32M241CCABMKHSR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S32M241CCABMKHSR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S32M241CCABMKHSR?
For technical support, including S32M241CCABMKHSR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S32M241CCABMKHSR requirements.
6.How does Aetrix verify that S32M241CCABMKHSR is sourced from the original manufacturer or authorized distributors?
All S32M241CCABMKHSR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S32M241CCABMKHSR meets industry standards.
7.What is the process for return or replacement of S32M241CCABMKHSR?
All S32M241CCABMKHSR units undergo pre-shipment inspection (PSI). If there is an issue with S32M241CCABMKHSR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S32M241CCABMKHSR part is unused and in its original packaging.
Return procedure for S32M241CCABMKHSR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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