My Inquiry
My Account
NXP Semiconductors S32M241CCABMKHST
- Part No.:
- S32M241CCABMKHST
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 64-LQFP Exposed Pad
- Datasheet:
-
S32M241CCABMKHST.pdf
- Description:
- S32M241CCABMKHST
- Quantity:
- Payment:
- Shipping:
Inventory:4,788
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S32M241CCABMKHST from NXP Semiconductors is an automotive-grade System-in-Package (SiP) microcontroller integrating an Arm Cortex-M4F core @ 80 MHz, 128 kB flash, 32 kB SRAM, and a 6-channel MOSFET gate driver unit for BLDC/PMSM motor control. It operates directly from a 12 V car battery (3.5–40 V VSUP), includes integrated 5 V/30 mA supply for external Hall sensors, and supports CAN FD physical layer communication without external transceiver. Designed for single-motor drive in automotive body electronics and HVAC actuators.
For engineers reviewing the S32M241CCABMKHST datasheet, S32M241CCABMKHST pinout, S32M241CCABMKHST application, or S32M241CCABMKHST equivalent, key selection considerations include ASIL-B compliance, integrated high-voltage regulation, gate driver timing specs, LIN/CXPI/CAN-FD PHY option mapping, and thermal derating above 105 °C ambient.
Technical Context
The S32M241CCABMKHST implements a dual-domain SiP architecture: the MCU subsystem (Cortex-M4F, flash, RAM, peripherals) and the Application Extension (AE) subsystem (12 V regulator, CAN FD PHY, 6-channel GDU, HVI/VM monitoring, DPGA current sense amplifier). The GDU outputs are internally routed to six FTM3 timer channels for synchronized PWM generation with dead-time insertion and fault protection.
All analog sensing paths-including two 12-bit ADCs, one 8-bit DAC comparator, and six internal ADC channels for phase voltage, DC-link, current sense (DPGA), and temperature-are mapped to dedicated AE pins. The device supports ISO 26262 ASIL-B functional safety via CSEc hardware security engine and includes SW watchdog, external watchdog monitor, and reset controller with wake-up capability.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | Arm Cortex-M4F @ 80 MHz - enables real-time motor control loop execution within ≤12.5 µs per cycle. |
| Flash / RAM | 128 kB program flash + 32 kB SRAM - sufficient for AUTOSAR MCAL stack, field-oriented control (FOC), and diagnostics. |
| Operating Voltage | VSUP = 3.5–40 V - supports direct connection to automotive battery with load-dump tolerance up to 40 V (≤400 ms). |
| Gate Driver | 6-channel pre-driver (3-phase) - drives external high- and low-side N-channel MOSFETs with bootstrap operation and HD-level overvoltage detection. |
| Communication | 1× CAN FD PHY + 1× LPUART (LIN/CXPI-capable) - eliminates need for external transceivers in body control modules. |
| Regulation | Integrated 12 V regulator + 5 V/30 mA output - powers external Hall sensors or logic without discrete LDOs. |
| Safety | ISO 26262 ASIL-B compliant with CSEc - provides cryptographic acceleration, secure boot, and memory protection for safety-critical firmware. |
| Package | 64-pin LQFP-EP - exposes thermal pad for PCB-level heat dissipation in motor drive applications. |
Pinout & Package
64-pin LQFP-EP (exposed pad) package with 0.5 mm pitch; thermal pad must be soldered to PCB ground plane for junction temperature management under continuous GDU operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VSUP | Main HV supply input | Accepts 3.5–40 V battery input; powers internal regulator, CAN FD PHY, and GDU high-side circuitry. |
| VLS_OUT | GDU low-side supply output | Internally generated ~12 V rail for low-side gate drivers; requires external 4.7 µF decoupling. |
| HG0–HG2, LG0–LG2 | GDU high-/low-side gate outputs | Drive external N-MOSFET gates; support bootstrap operation with VBSx pins and charge pump (CP/CP1/VCP). |
| HS0–HS2, LS0–LS2 | GDU high-/low-side source terminals | Connect to MOSFET sources; HSx tolerates −7 V negative pulses (100 ns); LSx tolerates −7 V (100 ns). |
| HVI, VM | Battery monitor inputs | HVI measures battery voltage via resistor divider; VM monitors VSUP for undervoltage/overvoltage detection. |
| DPGA+, DPGA−, AMP_OUT | Current sense amplifier I/O | Differential input for shunt-based motor phase current sensing; rail-to-rail output referenced to VDD_AE10. |
| CAN0_TX, CAN0_RX | CAN FD PHY interface | Direct connection to CAN H/L bus; no external transceiver required; supports bit rates up to 5 Mbps. |
| PTA5, RESET_B | Reset control | PTA5 and RESET_B must be shorted on PCB per datasheet requirement to enable proper reset sequencing. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated 12 V regulator | Eliminates external buck converter; supports 100 mA load with thermal foldback above 125 °C junction. |
| 6-channel GDU with HD monitoring | Enables 3-phase BLDC drive with programmable shoot-through protection and overvoltage shutdown at HD pin. |
| Dual 12-bit ADC with PDB trigger | Supports simultaneous sampling of motor phase currents and DC-link voltage with ≤1 µs inter-channel skew. |
| CSEc hardware security engine | Provides AES-128, SHA-256, RNG, and secure boot verification - required for ASIL-B diagnostic software integrity. |
| 5 V/30 mA auxiliary supply | Powers Hall-effect position sensors or external comparators without adding discrete regulators. |
| LIN/CXPI/CAN-FD PHY select | Single pin-strapped configuration (via ordering code 'C') fixes CAN FD PHY; no runtime reconfiguration needed. |
Applications
| Electric Power Steering (EPS) Assist Module | Automotive HVAC Blower Motor Control |
|---|---|
Use Scenario: Compact 3-phase BLDC drive for steering column assist actuator requiring <50 W output and fail-safe torque limitation. IC Role / Device Role / Timing Role: S32M241CCABMKHST executes FOC algorithm, generates synchronized 6-PWM signals via GDU, monitors phase current via DPGA, and communicates torque commands via CAN FD. Use Value: Integrated GDU and CAN FD PHY reduce BOM count by ≥4 components (transceiver, gate drivers, LDO, current sense op-amp) while meeting ASIL-B requirements. | Use Scenario: Low-noise, variable-speed blower motor control in premium vehicle cabin systems with LIN/CXPI bus integration. IC Role / Device Role / Timing Role: S32M241CCABMKHST runs sensorless commutation, regulates speed via PWM duty cycle, supplies 5 V to Hall sensor, and interfaces to body control module via LIN PHY. Use Value: Single-chip solution replaces MCU + discrete gate drivers + LIN transceiver + 5 V regulator, reducing PCB area by 35% and enabling Grade 1 (−40 °C to +105 °C) operation. |
| Seat Position Memory Actuator | Engine Cooling Fan Controller |
Use Scenario: Dual-motor seat adjuster with position feedback, soft-start, and stall detection in confined space behind seat backrest. IC Role / Device Role / Timing Role: S32M241CCABMKHST manages two independent brushed DC motors using 6-GDU channels in half-bridge mode, reads potentiometer feedback via ADC, and stores position in D-flash. Use Value: On-chip 128 kB flash and 4 kB FlexRAM allow firmware updates and parameter storage without external EEPROM; integrated 12 V regulator simplifies power tree. | Use Scenario: High-reliability cooling fan controller operating under engine bay temperatures up to 125 °C ambient with pulse-width modulated speed control. IC Role / Device Role / Timing Role: S32M241CCABMKHST monitors coolant temperature via ADC, adjusts fan speed via GDU PWM, detects overcurrent faults, and reports status via CAN FD to ECU. Use Value: M-grade (−40 °C to +125 °C) thermal rating and ASIL-B compliance ensure functional safety in critical thermal management; VLS_OUT rail sustains 12 V gate drive under high-temp derating. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar motor control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S32M242CCABMKHST | 256 kB flash, same 32 kB SRAM, identical GDU/PHY/peripheral set - differs only in program memory size. | Preferred when bootloader, OTA update partition, or expanded diagnostics require >128 kB executable space. | Select S32M242CCABMKHST if future firmware growth or dual-bank flash updates are required; pin-compatible and drop-in replaceable. |
| MC9S12VR64CPV | Legacy 16-bit S12VR MCU with 64 kB flash, no integrated GDU or CAN FD PHY - requires external gate drivers and transceiver. | Used in cost-sensitive legacy platforms where ASIL-B is not mandated and design reuse is prioritized over integration. | Choose MC9S12VR64CPV only for brownfield designs with existing S12 toolchain and no need for functional safety certification. |
Compared with S32M241CCABMKHST, S32M242CCABMKHST offers scalable flash without layout or firmware changes, while MC9S12VR64CPV increases component count and lacks ASIL-B support - making S32M241CCABMKHST optimal for new ASIL-B-compliant motor control designs requiring minimal BOM and thermal footprint.
Availability
S32M241CCABMKHST is available at Aetrix Electronics and suitable for automotive HVAC actuators, EPS assist modules, seat position memory systems, and engine cooling fan controllers requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for S32M241CCABMKHST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in automotive, industrial, and IoT solutions, with deep expertise in functional safety, secure connectivity, and high-voltage analog integration.
The S32M2xx product line targets cost-optimized, ASIL-B-compliant motor control SiPs for single BLDC/PMSM or multi-brushed DC motors - designed to replace discrete MCU + gate driver + transceiver combinations in automotive body electronics.
FAQ
What is the maximum allowable VSUP voltage for continuous operation of the S32M241CCABMKHST?
The S32M241CCABMKHST supports continuous operation at VSUP = 3.5–18 V. Operation at 18–40 V is permitted only for transient conditions (e.g., load dump), with strict limits: ≤400 ms duration per event and ≤1 hour cumulative lifetime exposure above 32.5 V when GDU is active. Exceeding these violates functional reliability guarantees.
Does the S32M241CCABMKHST require an external crystal oscillator?
No, the S32M241CCABMKHST includes an internal RC oscillator and supports external clock sources, but does not mandate an external crystal. Its system clock is derived from internal PLLs locked to either internal reference or optional external crystal (1–20 MHz). Crystal use is optional and depends on timing precision requirements for CAN FD bit rate stability.
How is the 5 V auxiliary supply on the S32M241CCABMKHST configured and rated?
The S32M241CCABMKHST provides a regulated 5 V output (VDD_AE10) capable of delivering up to 30 mA continuously. It is internally generated from VSUP and intended for powering external Hall-effect sensors or low-power logic. Output voltage is fixed at 5.0 V ±5% across temperature and load; external 2.2 µF ceramic capacitor is required per datasheet layout guidelines.
Can the S32M241CCABMKHST drive both high-side and low-side N-channel MOSFETs in a 3-phase inverter?
Yes, the S32M241CCABMKHST's 6-channel GDU supports full 3-phase inverter topologies using external N-channel MOSFETs. It provides independent HGx/LGx outputs with bootstrap charging (via CP/CP1/VCP pins), VBSx bootstrap capacitor nodes, and HD-level overvoltage detection to disable high-side drive during overvoltage events - all confirmed in the S32M24x Reference Manual section on GDU operation.
What safety certifications apply to the S32M241CCABMKHST?
The S32M241CCABMKHST is certified to ISO 26262 ASIL-B at the device level, with hardware safety mechanisms including lockstep CPU cores (not applicable to M4F), memory ECC, CSEc-based secure boot, and diagnostic libraries for runtime self-test. Functional safety documentation - including FMEDA, safety manual, and HW-SW interface definition - is provided by NXP for integration into ASIL-B system architectures.
S32M241CCABMKHST Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 64-LQFP Exposed Pad
- Series:
- S32M2xx
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M4F
- Core Size:
- 32-Bit
- Speed:
- 80MHz
- Connectivity:
- CANbus, FlexIO, I2C, LINBus, SPI, UART/USART
- Peripherals:
- DMA, I2S, LVD, LVR, POR, PWM, WDT
- Number of I/O:
- -
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.13V ~ 5.5V
- Data Converters:
- A/D 6x12b SAR; D/A 1x8b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S32M241CCABMKHST FAQ
1.How can I place an order for S32M241CCABMKHST through Aetrix?
Please submit a Request for Quotation (RFQ) for S32M241CCABMKHST on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S32M241CCABMKHST reliable?
The price and inventory of S32M241CCABMKHST are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S32M241CCABMKHST is usually 5 days.
3.What payment methods are accepted for S32M241CCABMKHST?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S32M241CCABMKHST transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S32M241CCABMKHST?
S32M241CCABMKHST orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S32M241CCABMKHST order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S32M241CCABMKHST?
For technical support, including S32M241CCABMKHST datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S32M241CCABMKHST requirements.
6.How does Aetrix verify that S32M241CCABMKHST is sourced from the original manufacturer or authorized distributors?
All S32M241CCABMKHST products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S32M241CCABMKHST meets industry standards.
7.What is the process for return or replacement of S32M241CCABMKHST?
All S32M241CCABMKHST units undergo pre-shipment inspection (PSI). If there is an issue with S32M241CCABMKHST, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S32M241CCABMKHST part is unused and in its original packaging.
Return procedure for S32M241CCABMKHST:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S32M241CCABMKHST Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
