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NXP Semiconductors S32M241LCABMKHSR

Part No.:
S32M241LCABMKHSR
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
64-LQFP Exposed Pad
Datasheet:
AetrixS32M241LCABMKHSR.pdf
Description:
S32M241LCABMKHSR
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,126

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Product details

Overview

S32M241LCABMKHSR from NXP Semiconductors is an automotive-grade System-in-Package (SiP) microcontroller integrating an Arm Cortex-M4F core @ 80 MHz, 128 kB flash, 32 kB SRAM, and a 6-channel MOSFET gate driver unit for BLDC/PMSM motor control. It features integrated 12 V voltage regulation, LIN/CXPI/CAN-FD physical layer, 5 V/30 mA auxiliary supply, and ASIL-B compliance - deployed in single-motor automotive body electronics such as electric power steering assist modules.

For engineers reviewing the S32M241LCABMKHSR datasheet, S32M241LCABMKHSR pinout, S32M241LCABMKHSR application, or S32M241LCABMKHSR equivalent, key selection criteria include its Grade M (-40°C to +125°C) thermal rating, LQFP-EP 64-pin package with exposed pad, integrated high-voltage analog front-end (HVI, DPGA, VM), and functional safety support via CSEc hardware security engine.

Technical Context

The S32M241LCABMKHSR implements a dual-domain SiP architecture: an MCU subsystem (Cortex-M4F, flash/SRAM, peripherals) tightly coupled with an Application Extension (AE) subsystem containing high-voltage regulators, LIN/CXPI/CAN-FD PHYs, and a 6-channel MOSFET pre-driver. The AE domain operates directly from 12 V battery input (VSUP = 3.5–40 V), enabling direct connection to automotive power rails without external DC-DC conversion.

Its gate driver unit supports three-phase BLDC/PMSM control with internal PWM logic routing from FlexTimer modules, while the DPGA enables single-shunt current sensing and HVI provides battery voltage monitoring. All analog measurement paths (ADC, DPGA, HVI, VM, temperature sensor) are internally routed to two 12-bit ADCs with PDB-triggered sampling.

Key Specifications

Parameter Value and Actual Design Meaning
Core Arm Cortex-M4F @ 80 MHz - delivers deterministic real-time motor control with FPU for field-oriented control (FOC) math.
Flash / SRAM 128 kB program flash + 32 kB SRAM - sufficient for AUTOSAR MCAL stack, safety monitors, and closed-loop motor firmware.
Operating Temp -40°C to +125°C (Grade M) - qualified for under-hood automotive environments including EPS and HVAC actuators.
Supply Input VSUP: 3.5–40 V - accepts full automotive battery range including load dump transients up to 40 V (t < 400 ms).
Integrated PHY LIN/CXPI/CAN-FD physical interface - eliminates need for external transceiver in LIN-based seat/mirror/door modules.
GDU Channels 6-channel MOSFET pre-driver (3-phase) - drives external high-side/low-side N-channel MOSFETs with bootstrap and charge pump support.
Security CSEc hardware security engine - enables secure boot, cryptographic acceleration (AES-128/256, SHA-256), and key management per ISO 21434.

Pinout & Package

Package: 64-pin LQFP-EP (exposed pad), RoHS-compliant, moisture sensitivity level 3. Thermal pad must be soldered to PCB ground plane for junction temperature control and EMI suppression.

Pin/Terminal Circuit Role Design Meaning
VSUP Main HV supply input Accepts 3.5–40 V battery input; powers internal 12 V regulator, AE subsystem, and GDU - requires 2.2 µF ceramic + 4.7 µF bulk capacitance.
VDD_AE10 MCU core & I/O supply Internally regulated 3.3 V or 5.0 V output (configurable); powers MCU logic, ADC, and digital I/O - must be shorted to VDD/VDDA on PCB.
HG0–HG2, LG0–LG2 GDU high-/low-side gate outputs Drive external N-MOSFET gates; HGx referenced to HSx (floating source), LGx referenced to VSS - require bootstrap capacitors (220 nF) per phase.
HVI0 High-voltage input monitor Measures battery voltage (VHVI = VSUP) with ±0.5% accuracy; supports reverse-battery protection when used with external 10 kΩ series resistor.
DPGA_IN+, DPGA_IN− Differential current sense inputs Interface to shunt resistor; programmable gain (1–100×) enables precise single-shunt phase current reconstruction for FOC algorithms.
LIN_TX, LIN_RX LIN physical layer I/O Direct connection to LIN bus (19.2 kbps typical); no external transceiver needed - supports wake-up via dominant pulse detection.

Key Features

Feature Design Value
Integrated 12 V regulator Eliminates external buck converter - reduces BOM count and PCB area in space-constrained motor modules.
5 V/30 mA auxiliary supply (VLS_OUT) Powers external Hall sensors or position encoders without additional LDO - simplifies sensor interface design.
ASIL-B compliant architecture Includes lockstep CPU checkers, memory ECC, SW watchdog, and hardware safety monitor - meets ISO 26262 Part 6 requirements.
Single-shunt FOC support DPGA + dual 12-bit ADC + PDB trigger enable accurate current sampling at PWM center-aligned points - critical for torque ripple reduction.
CSEc hardware security Enables secure firmware updates, encrypted communication, and anti-tampering via dedicated crypto accelerators - required for OTA-capable ECUs.

Applications

Electric Power Steering (EPS) Automotive HVAC Blower

Use Scenario: Closed-loop torque assist control using three-phase BLDC motor driven by external MOSFETs.

IC Role / Device Role / Timing Role: Real-time FOC execution (PWM generation, current/voltage sensing, position estimation) and LIN communication with vehicle CAN gateway.

Use Value: Integrated GDU and DPGA reduce component count by 7 parts vs discrete solution; ASIL-B compliance satisfies functional safety requirements for steering systems.

Use Scenario: Variable-speed blower motor control in climate control units with LIN command interface.

IC Role / Device Role / Timing Role: Motor commutation timing, speed feedback processing, and LIN message handling (e.g., target RPM, fault reporting).

Use Value: On-chip 12 V regulator and 5 V auxiliary supply eliminate 2 external regulators; Grade M rating ensures operation at dashboard temperatures up to 125°C.

Seat Position Actuator Door Lock Actuator

Use Scenario: Bidirectional brushed DC motor control for seat fore/aft and recline functions with position feedback.

IC Role / Device Role / Timing Role: Dual H-bridge drive logic (via GDU), analog position sensing (potentiometer/encoder), and LIN status reporting.

Use Value: Six GDU channels support dual-motor configurations; integrated LIN PHY reduces wiring harness complexity and EMI susceptibility.

Use Scenario: High-reliability solenoid or small BLDC motor actuation for central locking with wake-on-LIN capability.

IC Role / Device Role / Timing Role: Low-power standby monitoring, fast wake-up response (< 100 µs), and controlled motor energization sequence.

Use Value: VSUP operating range down to 3.5 V ensures function during cranking; built-in watchdog and reset controller prevent lock-up during voltage dips.

Equivalent & Alternatives

The following parts are listed as comparable options for similar motor control applications.

Alternative Part Technical Difference Application Difference Selection Advice
S32M242LCABMKHSR 256 kB flash, 32 kB SRAM - identical peripheral set and pinout. Same motor control use cases but supports larger firmware (e.g., dual-motor control + diagnostics stack). Select when firmware size exceeds 128 kB or future scalability is required; no PCB change needed.
S32K144WFT0VLHT Standalone S32K1 MCU (no integrated GDU, no HV regulator, no LIN/CAN-FD PHY); requires external drivers and transceivers. Used in modular designs where motor drive stage is separate; higher BOM cost but greater flexibility in MOSFET selection. Choose for non-integrated architectures or when leveraging existing S32K software ecosystem; requires full external analog/power interface.

Compared with S32M241LCABMKHSR, S32M242LCABMKHSR offers double flash capacity with identical packaging and safety features, while S32K144WFT0VLHT shifts system integration burden to external components - making it suitable only when modularity or legacy S32K toolchain reuse outweighs SiP-level optimization.

Availability

S32M241LCABMKHSR is available at Aetrix Electronics and suitable for electric power steering, HVAC blower control, seat position actuation, and door lock actuation requiring stable component supply across automotive production lifecycles.

Supply support for S32M241LCABMKHSR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on automotive, industrial, and IoT applications, delivering secure, energy-efficient, and scalable silicon solutions.

The S32M2xx family targets cost-sensitive, high-reliability automotive motor control - integrating MCU, power management, communications, and gate driving into a single SiP to replace multi-chip solutions in body electronics.

FAQ

What is the maximum allowable VSUP voltage for continuous operation of the S32M241LCABMKHSR?

The S32M241LCABMKHSR supports continuous operation at VSUP up to 18 V. Operation at 32.5 V is permitted only for ≤1 hour over lifetime (e.g., during load dump), and 40 V is allowed for transient pulses <400 ms. Exceeding these limits risks permanent damage to the internal 12 V regulator and AE subsystem.

Does the S32M241LCABMKHSR support CAN FD communication out of the box?

Yes, the S32M241LCABMKHSR includes an integrated CAN-FD physical layer. When ordered with 'C' in the communications option field (as in S32M241LCABMKHSR), the CAN0 module is internally connected to the CAN-FD PHY - enabling direct connection to CAN-FD bus without external transceiver.

How is functional safety implemented in the S32M241LCABMKHSR?

The S32M241LCABMKHSR achieves ASIL-B compliance through hardware redundancy (lockstep CPU cores), memory ECC, clock and voltage monitors, SW watchdog, and CSEc-based secure boot. Safety mechanisms are documented in the S32M24x Functional Safety Manual and validated per ISO 26262 Part 5.

Can the S32M241LCABMKHSR drive external MOSFETs without bootstrap components?

No. The S32M241LCABMKHSR's GDU requires external bootstrap capacitors (220 nF recommended) on each high-side channel (VBS0–VBS2) and charge pump components (CP, CP1, VCP) to sustain gate drive voltage during 100% duty cycle operation - per Figure 1 in the datasheet.

What is the purpose of the VPRE pin on the S32M241LCABMKHSR?

The VPRE pin enables external pre-regulation of the internal 12 V supply using a P-channel FET controlled by GCTL. This reduces on-die power dissipation and prevents junction temperature exceedance in high-ambient, high-load conditions - particularly critical in sealed EPS modules.

S32M241LCABMKHSR Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
64-LQFP Exposed Pad
Series:
S32M2xx
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit
Speed:
80MHz
Connectivity:
CANbus, FlexIO, I2C, LINBus, SPI, UART/USART
Peripherals:
DMA, I2S, LVD, LVR, POR, PWM, WDT
Number of I/O:
-
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
32K x 8
Voltage - Supply (Vcc/Vdd):
3.13V ~ 5.5V
Data Converters:
A/D 6x12b SAR; D/A 1x8b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:

S32M241LCABMKHSR FAQ

1.How can I place an order for S32M241LCABMKHSR through Aetrix?

Please submit a Request for Quotation (RFQ) for S32M241LCABMKHSR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S32M241LCABMKHSR reliable?

The price and inventory of S32M241LCABMKHSR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S32M241LCABMKHSR is usually 5 days.

3.What payment methods are accepted for S32M241LCABMKHSR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S32M241LCABMKHSR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S32M241LCABMKHSR?

S32M241LCABMKHSR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S32M241LCABMKHSR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S32M241LCABMKHSR?

For technical support, including S32M241LCABMKHSR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S32M241LCABMKHSR requirements.

6.How does Aetrix verify that S32M241LCABMKHSR is sourced from the original manufacturer or authorized distributors?

All S32M241LCABMKHSR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S32M241LCABMKHSR meets industry standards.

7.What is the process for return or replacement of S32M241LCABMKHSR?

All S32M241LCABMKHSR units undergo pre-shipment inspection (PSI). If there is an issue with S32M241LCABMKHSR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S32M241LCABMKHSR part is unused and in its original packaging.

Return procedure for S32M241LCABMKHSR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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