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NXP Semiconductors S32M241LCABMKHST
- Part No.:
- S32M241LCABMKHST
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 64-LQFP Exposed Pad
- Datasheet:
-
S32M241LCABMKHST.pdf
- Description:
- S32M241LCABMKHST
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
S32M241LCABMKHST from NXP Semiconductors is an automotive-grade System-in-Package (SiP) microcontroller integrating an Arm Cortex-M4F core @ 80 MHz, 128 kB flash, 32 kB SRAM, and a 6-channel MOSFET gate driver unit for 3-phase BLDC/PMSM motor control. It features integrated 12 V regulator, 5 V/30 mA auxiliary supply, LIN/CXPI/CAN FD physical interface, and ASIL-B compliance per ISO 26262 - deployed in automotive seat/mirror/window actuator modules.
For engineers reviewing the S32M241LCABMKHST datasheet, S32M241LCABMKHST pinout, S32M241LCABMKHST application, or S32M241LCABMKHST equivalent, key selection criteria include its integrated high-voltage analog subsystem (HVI, DPGA, VM), single-shunt current sensing capability, Grade M (-40°C to +125°C) thermal rating, and LQFP-EP 64-pin package with exposed pad for thermal management.
Technical Context
The S32M241LCABMKHST implements a dual-domain SiP architecture: the MCU domain (Cortex-M4F, FlexTimer, ADCs, LPUART/LPSPI/LPI2C) and Application Extension (AE) domain (GDU, LIN/CXPI/CAN FD PHY, voltage regulators, HVI/VM monitoring). The GDU provides six high- and low-side gate outputs with bootstrap charge pump (VCP/VCP1), HD overvoltage protection, and internal PWM routing via FTM3.
Its AE subsystem supports direct connection to 12 V battery (VSUP = 3.5–40 V transient), delivers regulated 5 V output for Hall sensors, and integrates analog front-end functions including a differential programmable gain amplifier (DPGA) for current sense, temperature sensor, and high-voltage input (HVI) for battery monitoring - all operating under ASIL-B functional safety constraints.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | Arm Cortex-M4F @ 80 MHz - enables real-time motor control loop execution with floating-point support for field-oriented control (FOC) algorithms. |
| Flash / SRAM | 128 kB program flash + 32 kB SRAM - sufficient for AUTOSAR MCAL stack, core self-test, and application firmware with safety-critical diagnostics. |
| GDU Channels | 6-channel MOSFET pre-driver (3-phase) - drives external high- and low-side N-channel MOSFETs without external gate drivers, reducing BOM count. |
| Supply Input | VSUP: 3.5–40 V (transient) - operates directly from automotive 12 V battery with reverse-battery protection and load-dump tolerance up to 400 ms. |
| Communication | 1× CAN-FD PHY + 1× LPUART (LIN/CXPI-capable) - enables direct bus communication without external transceivers in body electronics applications. |
| Thermal Grade | Grade M: -40°C to +125°C ambient - qualified for under-hood and cabin-mounted motor control units requiring extended temperature operation. |
| Functional Safety | ISO 26262 ASIL-B compliant - includes CSEc hardware security engine, SW watchdog, external watchdog monitor, and safety-aware debug interfaces (SWD/JTAG). |
Pinout & Package
Package: 64-pin LQFP-EP (exposed pad), RoHS-compliant, moisture sensitivity level 3. Thermal pad must be soldered to PCB ground plane for junction temperature control in motor drive applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VSUP | Battery input supply | Accepts 3.5–40 V automotive battery rail; powers internal regulators and GDU; requires external 2.2 µF ceramic decoupling. |
| VLS_OUT | GDU low-side supply | Internally generated ~12 V supply for low-side gate drivers; connects to LSx pins and external bootstrap capacitors. |
| HG0–HG2, LG0–LG2 | GDU gate outputs | High- and low-side gate drive signals for three half-bridges; each pair controls one phase of BLDC/PMSM motor. |
| HVI, VM | High-voltage monitor inputs | HVI measures battery voltage (up to 42 V); VM monitors VSUP via internal resistor divider - both feed into safety-critical monitoring logic. |
| ISENSE_A, AMP_OUT | Current sense interface | DPGA input (ISENSE_A) and amplified output (AMP_OUT) enable single-shunt current reconstruction for FOC without external op-amps. |
| CAN0_TX/RX | CAN-FD physical interface | Direct connection to CAN H/L bus; no external transceiver required - reduces component count and board space in distributed ECU designs. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated 12 V regulator | Eliminates need for external DC-DC converter; supplies MCU core, I/O, and AE subsystems from raw battery input. |
| 5 V / 30 mA auxiliary output | Powers external Hall-effect position sensors or encoders - removes requirement for separate LDO in motor feedback path. |
| Single-shunt current sensing | DPGA + internal ADC channels enable accurate phase current reconstruction using only one shunt resistor - simplifies PCB layout and improves thermal performance. |
| ASIL-B certified safety architecture | CSEc security engine, lockstep timer monitoring, memory ECC, and fault collection unit (FCCU) support diagnostic coverage for ISO 26262 compliance. |
| LIN/CXPI/CAN FD PHY integration | Configurable physical layer allows same silicon to serve multiple vehicle architectures - reduces qualification effort across OEM platforms. |
Applications
| Automotive Seat Actuator | Power Window Control Unit |
|---|---|
Use Scenario: Bidirectional linear actuator controlling seat fore/aft, recline, and lumbar adjustment in premium vehicles. IC Role / Device Role / Timing Role: S32M241LCABMKHST serves as main motor controller, executing FOC algorithm, managing LIN communication with body domain ECU, and monitoring motor stall/overcurrent via DPGA and HVI. Use Value: Integrated GDU and 5 V sensor supply reduce system BOM by ≥4 components; ASIL-B compliance satisfies OEM functional safety requirements for Class 3 actuators. | Use Scenario: Intelligent window lift module with anti-pinch detection, express-up/down, and rain-sensing auto-close. IC Role / Device Role / Timing Role: S32M241LCABMKHST performs real-time current profiling during glass movement, triggers emergency stop on torque anomaly, and communicates status via LIN to door module. Use Value: Single-shunt current sensing enables precise torque estimation at <1% error; integrated 12 V regulator eliminates external buck converter, saving >15 mm² PCB area. |
| Adjustable Mirror Driver | Engine Cooling Fan Controller |
Use Scenario: Dual-motor mirror positioning system with memory recall, auto-fold, and collision detection. IC Role / Device Role / Timing Role: S32M241LCABMKHST runs two independent motor control loops, manages CAN FD diagnostics, and monitors battery voltage (HVI) to prevent brown-out during cold cranking. Use Value: Grade M temperature rating ensures reliable operation at +125°C ambient near headlamp assemblies; integrated LIN/CAN FD PHY supports multi-protocol gateway functionality. | Use Scenario: Variable-speed radiator fan controller responding to coolant temperature, engine RPM, and AC demand in ICE and hybrid powertrains. IC Role / Device Role / Timing Role: S32M241LCABMKHST executes PWM-based speed regulation, reads thermistor via ADC, detects fan lock-up using current sense (DPGA), and reports faults over CAN FD. Use Value: Direct VSUP operation (3.5–40 V) eliminates need for pre-regulator during load dump; ASIL-B diagnostics cover fan stall, open-circuit, and short-circuit failure modes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar motor control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S32M242LCABMKHST | 256 kB flash, same core/peripherals/package - differs only in memory size and ordering code. | Identical pinout and thermal grade; suitable where larger firmware image or data logging is required. | Select when bootloader, OTA update partition, or enhanced diagnostics require >128 kB flash. |
| MC9S12VR64MLC | Legacy S12VR 16-bit MCU; no integrated GDU, no CAN FD, no ASIL-B certification; requires external gate drivers and transceivers. | Used in cost-sensitive legacy platforms; lacks integrated high-voltage analog subsystem and modern safety features. | Only consider for brownfield redesigns with strict legacy toolchain dependencies - not recommended for new designs. |
Compared with S32M242LCABMKHST, the S32M241LCABMKHST offers identical peripheral set and safety architecture but targets tighter firmware footprints; versus MC9S12VR64MLC, it delivers full SiP integration, ASIL-B compliance, and CAN FD - enabling next-generation compact, safe, and connected motor controllers.
Availability
S32M241LCABMKHST is available at Aetrix Electronics and suitable for automotive seat actuators, power window control units, adjustable mirror drivers, and engine cooling fan controllers requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for S32M241LCABMKHST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in ARM-based microcontrollers and functional safety.
The S32M2xx product line was designed specifically for cost-optimized, high-integration automotive motor control - combining MCU, gate drivers, analog sensing, and communications in a single SiP to replace multi-chip solutions in body electronics.
FAQ
What is the maximum operating ambient temperature for S32M241LCABMKHST?
The S32M241LCABMKHST is rated for Grade M operation, supporting ambient temperatures from -40°C to +125°C. This specification is validated per JEDEC JESD22-A108 and applies to continuous operation under defined thermal conditions with proper PCB heatsinking via the exposed pad. Operation beyond +125°C ambient is not guaranteed and may trigger thermal shutdown or violate ASIL-B safety constraints.
Does S32M241LCABMKHST include an integrated CAN FD transceiver?
Yes, the S32M241LCABMKHST integrates a CAN FD physical layer (PHY) compliant with ISO 11898-2:2016. The CAN0_TX and CAN0_RX pins connect directly to the CAN H and CAN L bus lines without requiring an external transceiver - reducing bill-of-materials and PCB footprint while maintaining full CAN FD data rates up to 5 Mbps.
How does the DPGA in S32M241LCABMKHST support single-shunt motor current sensing?
The DPGA in S32M241LCABMKHST provides programmable gain (1× to 32×) and differential input buffering for the ISENSE_A pin, enabling precise amplification of small shunt voltage signals. Its output (AMP_OUT) feeds into dedicated ADC channels, allowing real-time reconstruction of all three motor phase currents from a single shunt resistor - critical for efficient FOC implementation with minimal external components.
What safety certifications apply to S32M241LCABMKHST?
The S32M241LCABMKHST is certified to ISO 26262 ASIL-B at the device level, with hardware safety mechanisms including CSEc cryptographic engine, lockstep timer monitoring, memory ECC, and fault collection unit (FCCU). It supports AUTOSAR MCAL drivers and is qualified for use in safety-related systems such as seat and window actuators where ASIL-B decomposition is required.
Can S32M241LCABMKHST operate directly from a 12 V automotive battery without external regulators?
Yes, the S32M241LCABMKHST features an integrated 12 V regulator that accepts VSUP input from 3.5 V to 40 V (transient), enabling direct connection to automotive battery rails. It generates internal supplies including VDD_AE10 (3.3 V or 5 V), VLS_OUT (~12 V for GDU), and VDD/VDDA - eliminating the need for external DC-DC converters in most body electronics motor control applications.
S32M241LCABMKHST Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 64-LQFP Exposed Pad
- Series:
- S32M2xx
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M4F
- Core Size:
- 32-Bit
- Speed:
- 80MHz
- Connectivity:
- CANbus, FlexIO, I2C, LINBus, SPI, UART/USART
- Peripherals:
- DMA, I2S, LVD, LVR, POR, PWM, WDT
- Number of I/O:
- -
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.13V ~ 5.5V
- Data Converters:
- A/D 6x12b SAR; D/A 1x8b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S32M241LCABMKHST FAQ
1.How can I place an order for S32M241LCABMKHST through Aetrix?
Please submit a Request for Quotation (RFQ) for S32M241LCABMKHST on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S32M241LCABMKHST reliable?
The price and inventory of S32M241LCABMKHST are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S32M241LCABMKHST is usually 5 days.
3.What payment methods are accepted for S32M241LCABMKHST?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S32M241LCABMKHST transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S32M241LCABMKHST?
S32M241LCABMKHST orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S32M241LCABMKHST order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S32M241LCABMKHST?
For technical support, including S32M241LCABMKHST datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S32M241LCABMKHST requirements.
6.How does Aetrix verify that S32M241LCABMKHST is sourced from the original manufacturer or authorized distributors?
All S32M241LCABMKHST products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S32M241LCABMKHST meets industry standards.
7.What is the process for return or replacement of S32M241LCABMKHST?
All S32M241LCABMKHST units undergo pre-shipment inspection (PSI). If there is an issue with S32M241LCABMKHST, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S32M241LCABMKHST part is unused and in its original packaging.
Return procedure for S32M241LCABMKHST:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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