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NXP Semiconductors S32M242LCABMKHST
- Part No.:
- S32M242LCABMKHST
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 64-LQFP Exposed Pad
- Datasheet:
-
S32M242LCABMKHST.pdf
- Description:
- S32M242LCABMKHST
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
S32M242LCABMKHST from NXP Semiconductors is an automotive-grade System-in-Package (SiP) microcontroller integrating an Arm Cortex-M4F core @ 80 MHz, 256 kB flash, 32 kB SRAM, and a 6-channel MOSFET gate driver unit for 3-phase BLDC/PMSM motor control. It features integrated 12 V regulator, 5 V/30 mA auxiliary supply, CAN FD physical layer, and ASIL-B compliance per ISO 26262 - deployed in automotive seat/mirror actuation and HVAC blower modules.
For engineers reviewing the S32M242LCABMKHST datasheet, S32M242LCABMKHST pinout, S32M242LCABMKHST application, or S32M242LCABMKHST equivalent, key selection criteria include its integrated GDU with high-side/low-side pre-driver capability, LIN/CXPI/CAN-FD PHY flexibility, on-chip voltage regulation for direct 12 V battery operation, and automotive temperature grade (–40 °C to 125 °C).
Technical Context
The S32M242LCABMKHST implements a dual-domain architecture: MCU subsystem (Cortex-M4F, FlexTimer, LPUART/LPSPI/LPI2C) and Application Extension (AE) subsystem (GDU, HVI/VM battery monitor, DPGA current sense amplifier, LIN/CXPI/CAN-FD PHY). The AE domain provides direct high-voltage interface and motor drive control without external transceivers or gate drivers.
Its 6-channel GDU supports three-phase bridge control with internal PWM logic routing via FTM3; high-side drivers tolerate VSUP up to 42 V with bootstrap operation (VBSx ≤ VHSx + 12 V), and low-side drivers operate with LSx ≤ 10 V. The integrated 12 V regulator supplies VDD_AE10 (3.3 V or 5.0 V), while VPRE enables external P-FET regulation for thermal management under high ambient loads.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | Arm Cortex-M4F @ 80 MHz - deterministic real-time motor control with hardware FPU and DSP extensions. |
| Memory | 256 kB program flash + 32 kB SRAM + 4 kB FlexRAM/64 kB DFlash - sufficient for AUTOSAR MCAL stack and field-oriented control (FOC) algorithms. |
| GDU Channels | 6-channel MOSFET pre-driver (3-phase) - drives external high- and low-side N-channel MOSFETs with integrated dead-time control and fault protection. |
| Communication | 1× CAN FD PHY + 1× LPUART (LIN/CXPI-capable) + 1× LPSPI + 1× LPI2C - eliminates need for external transceivers in body electronics networks. |
| Supply Range | VSUP = 3.5–40 V (transient), VDD_AE10 = 3.13–5.5 V - operates directly from automotive 12 V battery with load-dump tolerance up to 400 ms. |
| Temperature Grade | –40 °C to +125 °C (M-grade) - qualified for under-hood and cabin-mounted motor control applications. |
| Functional Safety | ISO 26262 ASIL-B compliant - includes lockstep CPU, memory ECC, and safety mechanisms documented in S32M24x Safety Manual. |
Pinout & Package
64-pin LQFP-EP package with exposed thermal pad; RoHS-compliant, moisture sensitivity level (MSL) 3. Pin functions are defined per IOMUX configuration in S32M24x Reference Manual; critical domains include MCU I/O (PTA–PTE), GDU terminals (HG0–LG2, HS0–LS2, VBS0–VBS2), and AE analog interfaces (HVI, VM, DPGA inputs).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VSUP | Main high-voltage supply input | Accepts 3.5–40 V automotive battery; powers internal 12 V regulator and GDU high-side circuitry. |
| VDD_AE10 | MCU core & I/O supply output | Internally regulated 3.3 V or 5.0 V output; must be shorted to VDD/VDDA on PCB for S32M24x devices. |
| HG0–HG2 | High-side gate drive outputs | Drive gates of external high-side N-MOSFETs; each referenced to corresponding HSx source node. |
| LG0–LG2 | Low-side gate drive outputs | Drive gates of external low-side N-MOSFETs; each referenced to corresponding LSx source node. |
| HVI | High-voltage input monitor | Direct connection to battery rail for reverse-battery protection and supply monitoring (–32 V to +42 V range). |
| ISENSE_A / AMP_OUT | Differential current sense interface | Connects to DPGA amplifier for shunt-based motor phase current measurement with programmable gain. |
| CAN_TX / CAN_RX | CAN FD physical layer I/O | Direct connection to CAN bus; no external transceiver required - supports data rates up to 5 Mbps. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated 12 V regulator | Enables single-supply operation from automotive battery; eliminates external DC-DC converter in space-constrained modules. |
| 5 V/30 mA auxiliary supply (VLS_OUT) | Powers external Hall sensors or position encoders without additional LDO - reduces BOM count and layout area. |
| ASIL-B certified GDU | Includes built-in open-load, overcurrent, and shoot-through detection with fault reporting to MCU - meets functional safety requirements for Class A/B motor control. |
| Flexible PHY selection (CAN/LIN/CXPI) | Single hardware platform supports multiple vehicle network topologies via software-configurable PHY routing - simplifies variant management. |
| On-chip temperature sensor & battery monitor | Reduces external sensing components; HVI/VM inputs enable real-time battery health and thermal derating decisions in firmware. |
Applications
| Automotive Seat Actuation | HVAC Blower Control |
|---|---|
|
Use Scenario: Precise bidirectional control of multi-motor seat adjustment systems (lumbar, recliner, fore/aft) in passenger vehicles. IC Role / Device Role / Timing Role: Primary motor controller executing FOC algorithms, managing CAN FD communication with body control module, and monitoring motor current/voltage in real time. Use Value: Integrated GDU and 12 V regulator eliminate 4–6 discrete components per motor channel, reducing PCB area by >35% versus SoC + external drivers. |
Use Scenario: Closed-loop speed and torque control of centrifugal blower motors in climate control units across OEM platforms. IC Role / Device Role / Timing Role: Real-time PWM generation (via FlexTimer), current feedback processing (DPGA + ADC), and LIN/CXPI diagnostics reporting to HVAC ECU. Use Value: On-chip 5 V/30 mA supply powers Hall-effect rotor position sensors directly, removing need for external LDO and associated filtering. |
| Power Sliding Door Module | Electric Power Steering (EPS) Assist Motor |
|
Use Scenario: High-reliability motor control for power-operated sliding doors with obstacle detection and soft-stop functionality. IC Role / Device Role / Timing Role: Safety-critical controller handling torque profiling, CAN FD command parsing, and dual-redundant current sensing via DPGA channels. Use Value: ASIL-B certification and integrated watchdogs (SW + external) satisfy ISO 26262 requirements without adding safety co-processor or external monitors. |
Use Scenario: Secondary assist motor control in hybrid EPS systems where primary steering torque is handled by main EPS ECU. IC Role / Device Role / Timing Role: Dedicated motor driver executing torque overlay commands over CAN FD, with independent thermal monitoring via on-die sensor and HVI input. Use Value: VSUP operating range up to 40 V supports load-dump conditions during battery disconnection events - avoids system reset during transient overvoltage. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar motor control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S32M244LCABMKHST | 512 kB flash, 64 kB SRAM, same GDU/CAN FD/ASIL-B spec - higher memory for complex motion profiles and OTA update support. | Preferred for applications requiring dual-motor control with full AUTOSAR stack and secure boot + crypto acceleration. | Select when firmware size exceeds 256 kB or when future feature expansion (e.g., predictive maintenance algorithms) is planned. |
| S32K144HFT0VLHT | Standalone S32K1 MCU (no integrated GDU or 12 V regulator); requires external gate drivers and DC-DC; 512 kB flash, ASIL-B. | Used in distributed architectures where motor drive stage is physically separated from MCU - e.g., centralized chassis controllers. | Choose only if design mandates separation of control and power stages or requires pin compatibility with existing S32K1-based platforms. |
Compared with S32M242LCABMKHST, S32M244LCABMKHST offers double flash/SRAM for enhanced algorithm complexity but shares identical GDU timing, safety architecture, and package; S32K144HFT0VLHT delivers greater MCU flexibility at the cost of added BOM, board area, and thermal design effort due to external power components.
Availability
S32M242LCABMKHST is available at Aetrix Electronics and suitable for automotive seat actuation, HVAC blower control, and power sliding door modules requiring stable component supply across extended production lifecycles and stringent AEC-Q100 qualification.
Supply support for S32M242LCABMKHST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in automotive, industrial, and IoT solutions, with deep expertise in functional safety, secure connectivity, and high-reliability microcontrollers.
The S32M2xx family is designed specifically for cost-optimized, single-motor automotive body electronics - integrating MCU, power regulation, communication PHYs, and gate drivers into one SiP to reduce system-level BOM and board space.
FAQ
What is the maximum VSUP voltage rating for continuous operation of the S32M242LCABMKHST?
The S32M242LCABMKHST supports continuous operation at VSUP = 5.5–18 V. Operation up to 32.5 V is permitted for ≤1 hour cumulative over lifetime (with GDU off), and 40 V is allowed only for transient load-dump pulses <400 ms. Exceeding these limits risks permanent damage per Table 4 Absolute Maximum Ratings.
Does the S32M242LCABMKHST include an integrated CAN FD transceiver?
Yes, the S32M242LCABMKHST integrates a CAN FD physical layer (PHY) - pins CAN_TX and CAN_RX connect directly to the CAN bus without requiring an external transceiver. This is confirmed in Table 1 Feature Comparison and Section 4 Ordering Information ('C' suffix denotes CAN FD phy option).
What package type and thermal characteristics does the S32M242LCABMKHST use?
The S32M242LCABMKHST uses a 64-pin LQFP-EP package with exposed thermal pad. Its M-grade temperature rating supports ambient operation from –40 °C to +125 °C, and junction temperature limits are defined in Table 6 Thermal Operating Characteristics - validated for under-hood and cabin-mounted motor control environments.
How does the GDU in the S32M242LCABMKHST interface with external MOSFETs?
The S32M242LCABMKHST GDU provides six dedicated gate drive outputs: HG0–HG2 (high-side) and LG0–LG2 (low-side), each referenced to their respective source pins (HS0–HS2, LS0–LS2). Bootstrap capacitors (VBS0–VBS2) enable high-side floating operation, and internal dead-time insertion prevents shoot-through - all configurable via GDU registers in the S32M24x Reference Manual.
Is the S32M242LCABMKHST compatible with AUTOSAR MCAL and S32DS IDE?
Yes, the S32M242LCABMKHST is supported in NXP's S32 Design Studio (S32DS) IDE and includes AUTOSAR MCAL drivers (including CAN, LIN, SPI, ADC, GDU) as part of the Family SW package ('S' suffix in ordering code). These drivers are ISO 26262 ASIL-B certified and integrate with standard AUTOSAR 4.x stacks.
S32M242LCABMKHST Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 64-LQFP Exposed Pad
- Series:
- S32M2xx
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M4F
- Core Size:
- 32-Bit
- Speed:
- 80MHz
- Connectivity:
- CANbus, FlexIO, I2C, LINBus, SPI, UART/USART
- Peripherals:
- DMA, I2S, LVD, LVR, POR, PWM, WDT
- Number of I/O:
- -
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.13V ~ 5.5V
- Data Converters:
- A/D 6x12b SAR; D/A 1x8b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S32M242LCABMKHST FAQ
1.How can I place an order for S32M242LCABMKHST through Aetrix?
Please submit a Request for Quotation (RFQ) for S32M242LCABMKHST on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S32M242LCABMKHST reliable?
The price and inventory of S32M242LCABMKHST are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S32M242LCABMKHST is usually 5 days.
3.What payment methods are accepted for S32M242LCABMKHST?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S32M242LCABMKHST transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S32M242LCABMKHST?
S32M242LCABMKHST orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S32M242LCABMKHST order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S32M242LCABMKHST?
For technical support, including S32M242LCABMKHST datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S32M242LCABMKHST requirements.
6.How does Aetrix verify that S32M242LCABMKHST is sourced from the original manufacturer or authorized distributors?
All S32M242LCABMKHST products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S32M242LCABMKHST meets industry standards.
7.What is the process for return or replacement of S32M242LCABMKHST?
All S32M242LCABMKHST units undergo pre-shipment inspection (PSI). If there is an issue with S32M242LCABMKHST, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S32M242LCABMKHST part is unused and in its original packaging.
Return procedure for S32M242LCABMKHST:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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