NXP Semiconductors S32M243CCABWKHSR
- Part No.:
- S32M243CCABWKHSR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 64-LQFP Exposed Pad
- Datasheet:
-
S32M243CCABWKHSR.pdf
- Description:
- S32M243CCABWKHSR
- Quantity:
- Payment:

- Shipping:

Inventory:1,234
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S32M243CCABWKHSR from NXP Semiconductors is an automotive-grade System-in-Package (SiP) microcontroller integrating an Arm Cortex-M4F core @ 80 MHz, 256 KB flash, 32 KB SRAM, and a 6-channel MOSFET gate driver unit (GDU) for BLDC/PMSM motor control. It features integrated 12 V regulator, 5 V/30 mA auxiliary supply, CAN FD physical layer, and ASIL-B compliance per ISO 26262 - deployed in automotive body electronics and electric power steering modules.
For engineers reviewing the S32M243CCABWKHSR datasheet, S32M243CCABWKHSR pinout, S32M243CCABWKHSR application, or S32M243CCABWKHSR equivalent, key selection criteria include its Grade 0 temperature range (−40 °C to +150 °C), integrated high-voltage analog front-end (HVI/VM/DPGA), LIN/CXPI/CAN FD PHY flexibility, and 64-pin LQFP-EP package with exposed thermal pad.
Technical Context
The S32M243CCABWKHSR implements a dual-domain SiP architecture: MCU subsystem (Cortex-M4F, FlexTimer, ADCs, LPUART/LPSPI/LPI2C) and Application Extension (AE) subsystem (GDU, charge pump, boost controller, LIN/CXPI/CAN FD PHY). The GDU drives three-phase motors via six high-/low-side outputs with internal dead-time insertion and fault protection.
It operates directly from reverse-battery-protected 12 V automotive battery (VSUP = 3.5–40 V), delivers regulated 5 V output for Hall sensors, and supports single-shunt current sensing via DPGA and internal ADC channels. All analog and digital supplies are internally generated or tightly coupled to VSUP, minimizing external components.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | Arm Cortex-M4F @ 80 MHz - deterministic real-time motor control with FPU support for field-oriented control (FOC) math. |
| Flash / SRAM | 256 KB program flash + 32 KB SRAM - sufficient for AUTOSAR MCAL stack, safety libraries, and application firmware. |
| Operating Temp | −40 °C to +150 °C (Grade W) - qualified for under-hood motor control applications without external cooling. |
| GDU Outputs | 6-channel pre-driver (3-phase) - supports external N-channel MOSFETs with bootstrap gate drive and overcurrent shutdown. |
| PHY Interface | CAN FD physical layer - enables high-speed diagnostics and ECU-to-ECU communication at up to 5 Mbps. |
| Supply Input | VSUP: 3.5–40 V - withstands load dump transients (≤400 ms at 40 V) and cold-crank down to 3.5 V without reset. |
| Security | CSEc hardware security engine - provides secure boot, cryptographic acceleration (AES-128/256, SHA-256), and key management. |
Pinout & Package
64-pin LQFP-EP (exposed pad) package with 0.5 mm pitch; thermal pad soldered to PCB ground plane for junction temperature control in high-power motor drive operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VSUP | Main HV supply input | Accepts reverse-battery-protected 12 V battery; powers internal regulators, GDU, and PHY blocks. |
| VLS_OUT | GDU low-side supply | Internally generated ~10 V rail for low-side gate drivers; requires external decoupling. |
| HG0–HG2 / LG0–LG2 | GDU high-/low-side gate outputs | Drive external N-MOSFET gates; each pair controls one motor phase leg with shoot-through prevention. |
| HS0–HS2 / LS0–LS2 | GDU high-/low-side source terminals | Return paths for gate drive current; HSx tied to phase node, LSx tied to motor winding common. |
| CAN0_TX / CAN0_RX | CAN FD transceiver I/O | Direct connection to CAN bus differential pair; no external transceiver required. |
| PTA2 / PTA3 / PTA6 / PTA7 | FlexTimer PWM outputs | Configurable as complementary PWM pairs for GDU control; support dead-time insertion and fault blanking. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated 12 V regulator | Eliminates need for external buck converter; powers MCU core, peripherals, and AE subsystem from VSUP. |
| 5 V/30 mA auxiliary supply | Directly powers Hall-effect position sensors or small logic ICs - no external LDO required. |
| Single-shunt current sensing | DPGA + dual 12-bit ADCs enable precise phase current reconstruction using one shunt resistor. |
| ASIL-B compliance | Hardware and software safety mechanisms (lockstep timers, memory ECC, voltage monitors) certified per ISO 26262. |
| Thermal monitoring | On-die temperature sensor (TMON_PHY) and junction temperature reporting via PMC register for thermal derating. |
Applications
| Electric Power Steering (EPS) | Automotive HVAC Blower |
|---|---|
Use Scenario: Closed-loop torque assist control of rack-and-pinion steering motor under varying road loads and battery conditions. IC Role / Device Role / Timing Role: Main motor controller executing FOC algorithm, sampling current/voltage/position, managing CAN FD diagnostics, and driving 3-phase inverter. Use Value: Enables compact, thermally robust EPS module with integrated HV regulation, eliminating discrete DC/DC and transceiver components. | Use Scenario: Variable-speed control of centrifugal blower motor in climate control system, responding to cabin temperature setpoints. IC Role / Device Role / Timing Role: Real-time motor commutation controller with LIN interface for HVAC ECU command reception and status reporting. Use Value: Reduces BOM count by integrating gate drivers, 5 V sensor supply, and LIN PHY - simplifying layout and improving EMC robustness. |
| Engine Cooling Fan | Seat Ventilation Motor |
Use Scenario: PWM-controlled brushless fan for engine coolant radiator, operating across wide ambient temperatures including under-hood hot soak. IC Role / Device Role / Timing Role: High-voltage motor controller with overtemperature shutdown, load dump tolerance, and CAN FD telemetry to powertrain ECU. Use Value: Supports Grade W operation (−40 °C to +150 °C) without derating - critical for sustained high-speed fan duty cycles near exhaust manifolds. | Use Scenario: Low-noise, variable-speed ventilation motor embedded in automotive seat cushion, requiring quiet commutation and compact packaging. IC Role / Device Role / Timing Role: Compact motor driver with integrated GDU, current sensing, and LIN interface for body control module integration. Use Value: Minimizes footprint and EMI emissions via integrated gate drivers and on-chip current measurement - essential for space-constrained seat modules. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar motor control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S32M244CCABWKHSR | 512 KB flash, 64 KB SRAM - double program memory and RAM vs. S32M243CCABWKHSR. | Preferred for complex FOC + diagnostics stacks requiring larger code/data footprint. | Select when AUTOSAR OS, crypto libraries, and OTA update buffers exceed 256 KB flash capacity. |
| S32K144MHT0VLHT | Standalone SoC (no GDU, no HV regulator); requires external gate drivers and DC/DC; 512 KB flash, ASIL-B. | Used where modular design separates MCU and power stage; higher layout complexity but greater flexibility. | Choose when system architecture mandates separation of control and power domains or requires different voltage rails. |
Compared with S32M244CCABWKHSR, the S32M243CCABWKHSR offers identical peripheral set and thermal rating but reduced memory - ideal for cost-optimized EPS or HVAC designs. Against S32K144MHT0VLHT, it delivers significant BOM reduction and simplified thermal design via integrated GDU and HV regulation, at the expense of modularity.
Availability
S32M243CCABWKHSR is available at Aetrix Electronics and suitable for electric power steering, HVAC blower, and engine cooling fan applications requiring stable component supply, long-term automotive lifecycle support, and ASIL-B compliant motor control silicon.
Supply support for S32M243CCABWKHSR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in automotive, industrial, and IoT solutions, with deep expertise in functional safety, secure processing, and high-voltage analog integration.
The S32M2xx product line targets cost-sensitive, high-reliability automotive motor control - integrating MCU, gate drivers, HV analog, and communications PHY into a single SiP to reduce system size, bill-of-materials, and validation effort.
FAQ
What is the maximum junction temperature specification for the S32M243CCABWKHSR?
The S32M243CCABWKHSR is rated for Grade W operation with maximum ambient temperature of +150 °C. Its maximum junction temperature (TJ) is 175 °C, validated under worst-case power dissipation and thermal resistance conditions. This rating enables deployment in under-hood locations such as EPS modules and radiator fans without active cooling, provided PCB thermal design meets NXP's recommended copper area and via guidelines for the exposed pad.
Does the S32M243CCABWKHSR support LIN communication natively?
Yes, the S32M243CCABWKHSR supports LIN communication natively through its integrated LIN/CXPI/CAN FD PHY. When configured for LIN mode (via software and pin strapping), LPUART1 connects directly to the LIN transceiver block, enabling full LIN 2.2A compliance without external components. The same physical pins (LIN_TX_IN/LIN_RX_OUT) serve all three protocols - configuration is determined at boot time and runtime via register settings.
How does the GDU in the S32M243CCABWKHSR handle shoot-through protection?
The GDU in the S32M243CCABWKHSR implements hardware-enforced dead-time insertion between complementary high-side and low-side gate outputs. It monitors HSx/LSx voltage levels and disables gate drive if both are simultaneously asserted, preventing shoot-through. Fault detection triggers immediate GDU shutdown and asserts INTERRUPT_OUT, while logging fault cause (overcurrent, overtemperature, or undervoltage) in the GDU status register - all without CPU intervention.
Can the S32M243CCABWKHSR operate without an external crystal oscillator?
Yes, the S32M243CCABWKHSR can operate without an external crystal oscillator. It includes an internal 48 MHz RC oscillator (IRC48M) qualified for CAN FD timing accuracy, and a 128 kHz low-power oscillator (LPO) for RTC and wake-up. For applications requiring tighter timing stability (e.g., LIN baud rate accuracy), an external crystal (1–20 MHz) may be used, but it is not mandatory for basic motor control or CAN FD operation.
What debug interfaces are supported by the S32M243CCABWKHSR?
The S32M243CCABWKHSR supports both SWD (Serial Wire Debug) and JTAG interfaces for development and production programming. SWD is the recommended interface for most use cases due to its 2-pin footprint and full debug capability. Both interfaces provide full memory access, breakpoint setting, real-time variable inspection, and flash programming - compatible with standard ARM-compliant tools including NXP S32DS, Keil MDK, and IAR Embedded Workbench.
S32M243CCABWKHSR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 64-LQFP Exposed Pad
- Series:
- S32M2xx
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M4F
- Core Size:
- 32-Bit
- Speed:
- 80MHz
- Connectivity:
- CANbus, FlexIO, I2C, LINBus, SPI, UART/USART
- Peripherals:
- DMA, I2S, LVD, LVR, POR, PWM, WDT
- Number of I/O:
- -
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.13V ~ 5.5V
- Data Converters:
- A/D 6x12b SAR; D/A 1x8b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 150°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S32M243CCABWKHSR FAQ
1.How can I place an order for S32M243CCABWKHSR through Aetrix?
Please submit a Request for Quotation (RFQ) for S32M243CCABWKHSR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S32M243CCABWKHSR reliable?
The price and inventory of S32M243CCABWKHSR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S32M243CCABWKHSR is usually 5 days.
3.What payment methods are accepted for S32M243CCABWKHSR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S32M243CCABWKHSR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S32M243CCABWKHSR?
S32M243CCABWKHSR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S32M243CCABWKHSR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S32M243CCABWKHSR?
For technical support, including S32M243CCABWKHSR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S32M243CCABWKHSR requirements.
6.How does Aetrix verify that S32M243CCABWKHSR is sourced from the original manufacturer or authorized distributors?
All S32M243CCABWKHSR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S32M243CCABWKHSR meets industry standards.
7.What is the process for return or replacement of S32M243CCABWKHSR?
All S32M243CCABWKHSR units undergo pre-shipment inspection (PSI). If there is an issue with S32M243CCABWKHSR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S32M243CCABWKHSR part is unused and in its original packaging.
Return procedure for S32M243CCABWKHSR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S32M243CCABWKHSR Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

