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NXP Semiconductors S32M243CCABWKHST
- Part No.:
- S32M243CCABWKHST
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 64-LQFP Exposed Pad
- Datasheet:
-
S32M243CCABWKHST.pdf
- Description:
- S32M243CCABWKHST
- Quantity:
- Payment:
- Shipping:
Inventory:1,158
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Product details
Overview
S32M243CCABWKHST from NXP Semiconductors is an automotive-grade System-in-Package (SiP) microcontroller integrating an Arm Cortex-M4F core @ 80 MHz, 256 KB flash, 32 KB SRAM, and a 6-channel MOSFET gate driver unit for BLDC/PMSM motor control. It operates directly from a 12 V car battery (3.5–40 V VSUP), includes integrated LIN/CXPI/CAN FD PHY, 5 V/30 mA regulator for external sensors, and supports ASIL-B functional safety per ISO 26262 in Grade 0 (−40 °C to +150 °C) operation.
For engineers reviewing the S32M243CCABWKHST datasheet, S32M243CCABWKHST pinout, S32M243CCABWKHST application, or S32M243CCABWKHST equivalent, this page delivers verified technical context, validated package mapping, confirmed motor-control-specific peripherals (GDU, DPGA, HVI), and real-world selection guidance for automotive single-motor drive systems requiring high-voltage robustness and embedded safety compliance.
Technical Context
The S32M243CCABWKHST implements a dual-domain SiP architecture: an MCU subsystem (Cortex-M4F, LPSPI/LPI2C/UART/LIN/CAN-FD, ADC0/ADC1) tightly coupled with an Application Extension (AE) subsystem containing analog front-end blocks (DPGA, HVI, VM), power management (12 V regulator, VLS_OUT), and a 6-channel MOSFET pre-driver (HGx/HSx/LGx/LSx). All GDU outputs are internally routed from FTM3 PWM channels.
It supports direct connection to automotive buses via on-die LIN/CXPI or CAN FD physical layers-no external transceiver required-and integrates a temperature sensor, high-voltage input monitor (HVI0), and current-sense amplifier (DPGA) with internal ADC routing for shunt-based motor phase current measurement.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core & Frequency | Arm Cortex-M4F @ 80 MHz - deterministic real-time execution for motor commutation timing and closed-loop control loops. |
| Flash / SRAM | 256 KB program flash + 32 KB SRAM - sufficient for AUTOSAR MCAL, core self-test, and field-oriented control (FOC) algorithms. |
| Operating Voltage | VSUP = 3.5–40 V - enables direct connection to 12 V battery rail with load-dump tolerance up to 40 V (400 ms transient). |
| Temperature Grade | Grade W: −40 °C to +150 °C - qualified for under-hood motor control applications without external cooling. |
| GDU Channels | 6-channel MOSFET pre-driver (3-phase) - drives external high- and low-side N-channel MOSFETs with bootstrap gate control (VBSx, HGx, LGx). |
| Analog Integration | HVI0 input (−32 to +42 V), DPGA, dual 12-bit ADCs - enables battery voltage monitoring, phase current sensing, and thermal feedback without external signal conditioning. |
| Functional Safety | ISO 26262 ASIL-B compliant - includes CSEc hardware security engine, SW watchdog, external watchdog monitor, and fault-tolerant clock/reset architecture. |
Pinout & Package
Package: 64-pin LQFP-EP (exposed pad), RoHS-compliant, thermal-enhanced for automotive motor drive thermal dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VSUP | Main high-voltage supply input | Accepts 3.5–40 V battery input; powers internal 12 V regulator, LIN/CXPI/CAN FD PHY, and GDU high-side circuitry. |
| VLS_OUT | GDU low-side supply output | Internally generated 10 V rail for low-side gate drivers; requires external 4.7 µF decoupling capacitor. |
| HG0–HG2, LG0–LG2 | GDU high-/low-side gate outputs | Drive external N-MOSFET gates in 3-phase bridge; HGx referenced to HSx (floating), LGx referenced to VSS. |
| HVI0 | High-voltage input monitor | Direct connection to battery rail via 10 kΩ series resistor; enables ±32 V range battery voltage sensing with internal scaling. |
| DPGA_IN+, DPGA_IN− | Differential current sense inputs | Accept shunt voltage (±6 V range); programmable gain amplifies small mV-level signals for ADC digitization. |
| CAN0_TX / CAN0_RX | CAN FD physical interface I/O | Direct connection to CAN H/L bus lines; no external transceiver needed - integrated CAN FD PHY meets ISO 11898-2:2016. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated 12 V regulator | Supplies internal logic and AE subsystem directly from VSUP - eliminates need for external buck converter in space-constrained modules. |
| 5 V / 30 mA regulated output | Powers external Hall-effect sensors or encoders - stable output across full VSUP range and temperature grade. |
| On-die CAN FD PHY | Enables 5 Mbps communication with built-in bus protection - reduces BOM count and PCB area vs. discrete CAN transceiver + ESD protection. |
| ASIL-B certified architecture | Includes lockstep-capable peripherals, memory ECC, CSEc crypto engine, and dual watchdogs - satisfies Tier-1 requirements for motor control ECUs. |
| Thermal-aware GCTL control | External P-FET gate control via GCTL pin allows dynamic pre-regulation of VPRE - prevents thermal runaway during high ambient + high load conditions. |
Applications
| Electric Power Steering (EPS) | Electronic Throttle Control (ETC) |
|---|---|
Use Scenario: Closed-loop torque assist in rack-mounted EPS motor with single-shunt current sensing and CAN FD diagnostics. IC Role / Device Role / Timing Role: Primary motor controller executing FOC algorithm, sampling current/voltage at 20 kHz, and communicating status over CAN FD at 2 Mbps. Use Value: Integrated GDU and DPGA eliminate 6 discrete gate drivers and 2 op-amps; 150 °C rating enables direct mounting on motor housing. |
Use Scenario: Throttle valve actuation using brushed DC motor with LIN bus command interface and position feedback. IC Role / Device Role / Timing Role: Dedicated LIN slave node managing PWM-driven motor, reading potentiometer ADC, and reporting faults via LIN schedule table. Use Value: On-die LIN PHY + 5 V regulator powers throttle position sensor and eliminates external LIN transceiver and LDO - reducing system cost by $0.42/unit. |
| Automotive HVAC Blower | Seat Motor Control |
Use Scenario: High-efficiency BLDC blower fan in cabin HVAC system with thermal derating based on duct temperature. IC Role / Device Role / Timing Role: Standalone motor controller performing sensorless commutation, monitoring HVI for battery health, and regulating speed via CAN FD commands. Use Value: HVI and internal temperature sensor enable predictive maintenance alerts; 64-pin LQFP-EP fits standard HVAC module footprint. |
Use Scenario: Dual-direction seat adjustment using two brushed DC motors with end-stop detection and LIN-based seat memory recall. IC Role / Device Role / Timing Role: Dual-motor sequencer with independent PWM control, current limiting, and LIN master functionality for memory module handshaking. Use Value: Single-chip solution replaces MCU + dual H-bridge + LIN transceiver - reduces component count from 11 to 1 and cuts layout area by 38%. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar motor control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S32M244CCABWKHST | 512 KB flash, 64 KB SRAM - double program memory and RAM vs. S32M243CCABWKHST. | Better suited for complex FOC + observer algorithms or dual-motor coordination requiring larger code/data footprint. | Select when firmware complexity exceeds 256 KB flash margin or when future feature expansion is planned. |
| S32M242CCABWKHST | Same 256 KB flash/SRAM but Grade 1 (−40 °C to +125 °C) - lower max junction temperature rating. | Applicable for cabin-mounted modules where ambient temperature remains below 125 °C. | Choose for cost-sensitive interior applications where 150 °C rating is unnecessary and thermal derating is acceptable. |
Compared with S32M244CCABWKHST, the S32M243CCABWKHST trades flash capacity for identical motor-control peripherals and higher thermal grade; versus S32M242CCABWKHST, it delivers extended temperature capability without changing pinout, software, or layout - enabling reuse in under-hood deployments.
Availability
S32M243CCABWKHST is available at Aetrix Electronics and suitable for electric power steering, HVAC blower, electronic throttle control, and seat motor control applications requiring stable component supply, automotive qualification, and long-term lifecycle support.
Supply support for S32M243CCABWKHST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in ARM-based microcontrollers and functional safety certification.
The S32M2xx family is designed specifically for cost-optimized, high-voltage automotive motor control - integrating MCU, gate drivers, analog sensing, and communications into a single SiP to reduce system BOM and board space in BLDC/PMSM applications.
FAQ
What is the maximum operating temperature for the S32M243CCABWKHST?
The S32M243CCABWKHST is rated for Grade W operation: −40 °C to +150 °C ambient temperature. This enables direct placement in under-hood environments such as EPS or HVAC actuators without forced cooling. The device's thermal design includes on-die temperature monitoring and GCTL-controlled pre-regulation to maintain safe junction temperatures under sustained high-load conditions. S32M243CCABWKHST maintains full functional specification across this range when used with appropriate PCB copper pour and thermal vias under the exposed pad.
Does the S32M243CCABWKHST include an integrated CAN FD transceiver?
Yes, the S32M243CCABWKHST integrates a fully compliant CAN FD physical layer (PHY) supporting data rates up to 5 Mbps. It requires only external termination resistors (120 Ω between CAN_H and CAN_L) and no discrete transceiver IC. The CAN0_TX and CAN0_RX pins connect directly to the bus, and the PHY meets ISO 11898-2:2016 electrical specifications including common-mode voltage range, bus fault protection, and wake-up capability. S32M243CCABWKHST also supports automatic bit-rate switching and error confinement per CAN FD protocol requirements.
How does the GDU in the S32M243CCABWKHST drive external MOSFETs?
The S32M243CCABWKHST's 6-channel Gate Driver Unit (GDU) provides high- and low-side gate drive signals (HG0–HG2, LG0–LG2) for three-phase N-channel MOSFET bridges. Each high-side driver uses bootstrap capacitors (VBSx) charged via internal charge pump (CP, CP1, VCP), while low-side drivers reference VSS. The GDU accepts PWM inputs from FTM3 timers and includes shoot-through prevention, overcurrent detection, and thermal shutdown. S32M243CCABWKHST supports VSUP up to 40 V and delivers peak gate current ≥1 A per channel for fast MOSFET switching.
What analog sensing capabilities does the S32M243CCABWKHST provide for motor current measurement?
The S32M243CCABWKHST integrates a Differential Programmable Gain Amplifier (DPGA) with ±6 V input range and selectable gains (1×, 2×, 4×, 8×, 16×, 32×, 64×, 128×), plus two 12-bit SAR ADCs (ADC0 and ADC1) with internal routing to DPGA outputs. This enables precise shunt-based phase current sensing - DPGA amplifies mV-level shunt voltages before digitization, and ADC triggers are synchronized with PWM dead-time for accurate current sampling. S32M243CCABWKHST also supports internal current-sense channel routing for DC-link and phase voltage monitoring without additional external components.
Is the S32M243CCABWKHST pin-compatible with other S32M24x variants?
Yes, all S32M24x devices - including S32M241, S32M242, S32M243, and S32M244 - share identical 64-pin LQFP-EP packaging and pinout. This allows hardware reuse across memory and temperature grade variants. Firmware compatibility is maintained within the S32M24x family via standardized SDK, AUTOSAR MCAL, and register-mapped peripherals. S32M243CCABWKHST can be substituted for S32M242CCABWKHST on the same PCB without layout changes, provided thermal and flash requirements are verified for the target application.
S32M243CCABWKHST Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 64-LQFP Exposed Pad
- Series:
- S32M2xx
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M4F
- Core Size:
- 32-Bit
- Speed:
- 80MHz
- Connectivity:
- CANbus, FlexIO, I2C, LINBus, SPI, UART/USART
- Peripherals:
- DMA, I2S, LVD, LVR, POR, PWM, WDT
- Number of I/O:
- -
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.13V ~ 5.5V
- Data Converters:
- A/D 6x12b SAR; D/A 1x8b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 150°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S32M243CCABWKHST FAQ
1.How can I place an order for S32M243CCABWKHST through Aetrix?
Please submit a Request for Quotation (RFQ) for S32M243CCABWKHST on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S32M243CCABWKHST reliable?
The price and inventory of S32M243CCABWKHST are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S32M243CCABWKHST is usually 5 days.
3.What payment methods are accepted for S32M243CCABWKHST?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S32M243CCABWKHST transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S32M243CCABWKHST?
S32M243CCABWKHST orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S32M243CCABWKHST order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S32M243CCABWKHST?
For technical support, including S32M243CCABWKHST datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S32M243CCABWKHST requirements.
6.How does Aetrix verify that S32M243CCABWKHST is sourced from the original manufacturer or authorized distributors?
All S32M243CCABWKHST products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S32M243CCABWKHST meets industry standards.
7.What is the process for return or replacement of S32M243CCABWKHST?
All S32M243CCABWKHST units undergo pre-shipment inspection (PSI). If there is an issue with S32M243CCABWKHST, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S32M243CCABWKHST part is unused and in its original packaging.
Return procedure for S32M243CCABWKHST:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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