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NXP Semiconductors S32M276CHABMKHSR
- Part No.:
- S32M276CHABMKHSR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 64-LQFP Exposed Pad
- Datasheet:
-
S32M276CHABMKHSR.pdf
- Description:
- S32M276CHABMKHSR
- Quantity:
- Payment:
- Shipping:
Inventory:2,805
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Product details
Overview
S32M276CHABMKHSR from NXP Semiconductors is an automotive-grade System-in-Package (SiP) microcontroller integrating an Arm Cortex-M7F core @ 120 MHz, 1 MB program flash, 128 kB SRAM (including 96 kB TCM), dual CAN-FD physical interfaces, and a 6-channel MOSFET gate driver unit for 3-phase BLDC/PMSM motor control. It operates directly from a 12 V car battery (3.5–40 V VSUP), delivers regulated 5 V/30 mA for external sensors, and supports ASIL-B functional safety per ISO 26262.
For engineers reviewing the S32M276CHABMKHSR datasheet, S32M276CHABMKHSR pinout, S32M276CHABMKHSR application, or S32M276CHABMKHSR equivalent, key selection criteria include its integrated high-voltage analog subsystem (HVI, DPGA, GDU), dual CAN-FD PHYs, 15-bit ADC pair with BCTU trigger, HSE-B hardware security engine, and 64-pin LQFP-EP package with exposed thermal pad.
Technical Context
The S32M276CHABMKHSR implements a dual-domain SiP architecture: the MCU domain hosts the Cortex-M7F core, memory subsystem, and standard peripherals (LPUART, LPSPI, LPI2C, EMIOS, LCU), while the Application Extension (AE) domain integrates high-voltage analog functions including LIN/CXPI/CAN-FD PHYs, voltage regulators, and the 6-channel MOSFET pre-driver with bootstrap charge pump and HD-level overvoltage protection.
Its GDU is hardwired to six LCU outputs for PWM generation, supporting three-phase motor drive with single-shunt current sensing via the integrated DPGA and internal ADC channels. The device uses two independent ADC modules (15-bit resolution), each with dedicated BCTU for precise timing of current sampling relative to PWM edges - critical for field-oriented control in automotive motor applications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core & Frequency | Arm Cortex-M7F @ 120 MHz - enables real-time FOC computation and dual CAN-FD stack execution without performance bottleneck. |
| Program Memory | 1 MB flash - accommodates AUTOSAR MCAL, complex motor control algorithms, and secure boot firmware with room for OTA updates. |
| SRAM | 128 kB (96 kB TCM + 32 kB data) - provides low-latency access for control loops and sufficient buffer space for CAN-FD message queues. |
| Motor Drive Interface | 6-channel GDU with integrated bootstrap charge pump and HD pin monitoring - drives external high-side/low-side MOSFETs for 3-phase inverter without external gate drivers or discrete charge pumps. |
| Analog Subsystem | 2× 15-bit ADCs + BCTU + DPGA - supports high-precision current sensing (shunt-based), DC-link voltage monitoring, and phase voltage measurement within same conversion window. |
| Communication | Dual CAN-FD PHYs (CAN0/CAN1) - enables concurrent communication with vehicle network (CAN0) and inverter control loop feedback (CAN1), both at up to 5 Mbps. |
| Functional Safety | ISO 26262 ASIL-B compliant with HSE-B security engine - provides hardware-accelerated crypto, secure key storage, and runtime integrity checking for motor control software. |
Pinout & Package
Package: 64-pin LQFP-EP (exposed thermal pad), RoHS-compliant, moisture sensitivity level 3. Thermal pad must be soldered to PCB ground plane for junction temperature management under full GDU load.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VSUP | Main HV supply input | Accepts 3.5–40 V automotive battery input; powers internal regulators, GDU, and AE domain; HD pin monitors overvoltage condition. |
| VLS_OUT | GDU low-side supply output | Internally generated ~10 V rail for low-side gate drive; requires external 4.7 µF decoupling capacitor near pin. |
| HG0–HG2 / LG0–LG2 | GDU high-/low-side gate outputs | Drive external N-channel MOSFET gates; HGx pins tolerate up to VHSx + 12 V; LSx pins support -7 V transient pulses (100 ns). |
| HS0–HS2 / LS0–LS2 | GDU high-/low-side source terminals | Connect directly to MOSFET source nodes; HSx pins withstand up to 42 V; LSx pins rated for -7 V negative pulse (100 ns). |
| CP / CP1 / VCP | Bootstrap charge pump interface | CP drives external bootstrap capacitor; CP1 is charge/discharge node; VCP output supplies high-side gate drive voltage (up to 55 V). |
| CAN0_H / CAN0_L / CAN1_H / CAN1_L | Dual CAN-FD differential pairs | Direct connection to vehicle bus (CAN0) and inverter feedback loop (CAN1); no external transceiver required; supports 5 Mbps bit rate. |
| ADC0_SE0–ADC0_SE7 / ADC1_SE0–ADC1_SE7 | Analog input channels | 14 total external ADC inputs; 2× 15-bit SAR converters share BCTU for synchronized sampling across phases and current sensors. |
| PTA0–PTD15 (selected) | Multiplexed GPIO / peripheral signals | Configurable as UART, SPI, I2C, FlexIO, or timer outputs; specific mapping defined in IOMUX file; supports LIN/CXPI via LPUART1. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated 12 V regulator | Supplies entire MCU domain (VDD_HV_A, V11, V25) from VSUP - eliminates need for external buck converter and reduces BOM count by ≥3 components. |
| 5 V / 30 mA auxiliary output | Powers external Hall-effect or resolver sensors directly - avoids separate LDO and simplifies sensor interface design in motor position feedback systems. |
| Dual CAN-FD PHYs | Enables simultaneous high-speed diagnostics (CAN0) and real-time torque/current loop closure (CAN1) - eliminates external CAN transceivers and associated layout complexity. |
| HSE-B hardware security | Provides AES-128/256, SHA-256, RSA-2048 acceleration, secure key vault, and secure boot - meets OEM requirements for firmware authenticity and anti-tampering in EV powertrain ECUs. |
| ASIL-B compliance | Includes lockstep CPU cores, ECC on flash/SRAM, memory BIST, and fault collection unit - satisfies ISO 26262 Part 6 requirements for motor control without external safety monitor. |
Applications
| Electric Power Steering (EPS) | Electric Brake Booster (EBB) |
|---|---|
Use Scenario: Closed-loop control of 3-phase BLDC motor driving steering column assist mechanism under varying road loads and temperature extremes (-40°C to 125°C). IC Role / Device Role / Timing Role: S32M276CHABMKHSR serves as primary motor controller IC, executing FOC algorithm, managing dual CAN-FD links (vehicle CAN and EPS-specific CAN), and driving external MOSFET half-bridges via integrated GDU. Use Value: Integrated GDU and 15-bit ADCs enable <1 µs current-sampling-to-PWM-update latency, meeting EPS torque response time <10 ms; ASIL-B compliance eliminates need for external safety MCU. |
Use Scenario: High-reliability actuation of vacuum-assist replacement system using brushed DC or BLDC motor, requiring fail-operational behavior during partial faults. IC Role / Device Role / Timing Role: S32M276CHABMKHSR acts as standalone brake actuator controller, performing motor commutation, pressure feedback processing (via DPGA and ADC), and communicating status via CAN-FD to central ADAS domain controller. Use Value: Dual CAN-FD interfaces allow segregated safety-critical (brake command) and non-critical (diagnostics) traffic; HSE-B enables secure OTA updates for regulatory compliance without physical reflash. |
| Automotive HVAC Blower | Onboard Charger (OBC) Auxiliary Control |
Use Scenario: Variable-speed control of high-power centrifugal blower motor (up to 1 kW) in cabin climate system, operating continuously at ambient temperatures up to 125°C. IC Role / Device Role / Timing Role: S32M276CHABMKHSR functions as dedicated blower motor driver, handling PWM generation, thermal monitoring (integrated TMON_PHY), and LIN/CXPI communication with HVAC ECU. Use Value: Integrated 12 V regulator and 5 V sensor supply reduce external component count by 4; GDU's HD pin monitoring prevents MOSFET failure during load dump transients (40 V/400 ms). |
Use Scenario: Secondary control unit in bidirectional OBC managing cooling fan, contactor sequencing, and isolation monitoring - coexisting with main OBC MCU but requiring independent safety domain. IC Role / Device Role / Timing Role: S32M276CHABMKHSR operates as isolated auxiliary controller, running independent firmware, monitoring high-voltage isolation barriers via HVI input, and reporting faults over CAN-FD to primary OBC controller. Use Value: HVI input supports direct battery voltage sensing up to 42 V with ±0.5% accuracy; ASIL-B certification allows use in safety-related subsystems without additional hardware redundancy. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar motor control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S32M274CHABMKHSR | Same package and pinout; 512 kB flash, 112 kB SRAM (96 kB TCM); identical GDU, ADC, CAN-FD, and safety features. | Targeted at cost-optimized EPS or EBB designs where firmware footprint <512 kB and RAM usage <112 kB. | Select when application firmware fits within 512 kB flash and does not require >112 kB SRAM - reduces cost without sacrificing motor control capability or safety compliance. |
| MC9S12ZVML128 | Legacy 16-bit S12Z core @ 50 MHz; single CAN; no integrated GDU or high-voltage analog; requires external gate drivers and regulators. | Used in legacy HVAC or seat motor modules where upgrade path exists but full SiP integration is not required. | Choose only for brownfield redesigns with existing S12Z toolchain and minimal new feature requirements; lacks ASIL-B certification and modern motor control peripherals. |
Compared with S32M274CHABMKHSR, the S32M276CHABMKHSR provides double flash and 16 kB more SRAM for complex AUTOSAR stacks and future-proofing; versus MC9S12ZVML128, it delivers complete SiP integration, ASIL-B compliance, and dual CAN-FD - eliminating ≥7 external components and enabling next-generation functional safety architectures.
Availability
S32M276CHABMKHSR is available at Aetrix Electronics and suitable for electric power steering (EPS), electric brake booster (EBB), automotive HVAC blower, and onboard charger auxiliary control applications requiring stable component supply, long-term automotive lifecycle support, and ASIL-B certified silicon.
Supply support for S32M276CHABMKHSR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in automotive, industrial, and IoT solutions, with deep expertise in functional safety, secure connectivity, and high-voltage analog integration.
The S32M2xx family is designed specifically for automotive 12 V motor control applications - integrating MCU, high-voltage analog, and gate drivers into a single SiP to replace multi-chip solutions in EPS, EBB, and HVAC systems.
FAQ
What is the maximum operating ambient temperature for the S32M276CHABMKHSR?
The S32M276CHABMKHSR is rated for Grade M operation, supporting continuous ambient temperatures from -40°C to +125°C. This rating is validated across all integrated functions - including the Cortex-M7F core, dual CAN-FD PHYs, GDU, and 15-bit ADCs - making it suitable for under-hood automotive applications such as EPS and EBB where thermal margins are critical.
Does the S32M276CHABMKHSR require external gate drivers for BLDC motor control?
No, the S32M276CHABMKHSR includes a fully integrated 6-channel MOSFET gate driver unit (GDU) with bootstrap charge pump, HD overvoltage monitoring, and direct high-side/low-side gate outputs. It drives external N-channel MOSFETs for 3-phase inverters without external gate drivers, reducing bill-of-materials and PCB area while maintaining robust shoot-through protection.
How many CAN-FD interfaces does the S32M276CHABMKHSR support, and are they physically independent?
The S32M276CHABMKHSR supports two fully independent CAN-FD physical interfaces (CAN0 and CAN1), each with dedicated differential transceiver circuitry, registers, and message buffers. Both operate concurrently at up to 5 Mbps, enabling segregated communication paths - for example, vehicle network diagnostics on CAN0 and real-time motor control feedback on CAN1 - without arbitration or bandwidth contention.
What safety certifications apply to the S32M276CHABMKHSR?
The S32M276CHABMKHSR is certified to ISO 26262 ASIL-B at the device level, covering the MCU core, memory subsystem, GDU, ADCs, timers, and communication peripherals. It includes hardware safety mechanisms such as lockstep CPU cores, ECC on flash and SRAM, memory BIST, and a fault collection unit - enabling compliance with ASIL-B requirements for motor control without external safety monitors.
Can the S32M276CHABMKHSR operate directly from a 12 V automotive battery without external regulators?
Yes, the S32M276CHABMKHSR accepts 3.5–40 V on its VSUP pin and integrates a 12 V regulator that generates all internal supply rails: VDD_HV_A (3.3/5 V I/O), V11 (1.14 V core), and V25 (2.5 V flash). It also provides a dedicated 5 V/30 mA output for external sensors - eliminating the need for external DC-DC converters or LDOs in most automotive motor control designs.
S32M276CHABMKHSR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 64-LQFP Exposed Pad
- Series:
- S32M2xx
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M7F
- Core Size:
- 32-Bit
- Speed:
- 120MHz
- Connectivity:
- CANbus, FlexIO, I2C, LINBus, SPI, UART/USART
- Peripherals:
- DMA, I2S, LVD, LVR, POR, PWM, WDT
- Number of I/O:
- -
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.13V ~ 5.5V
- Data Converters:
- A/D 6x12b SAR; D/A 2x8b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S32M276CHABMKHSR FAQ
1.How can I place an order for S32M276CHABMKHSR through Aetrix?
Please submit a Request for Quotation (RFQ) for S32M276CHABMKHSR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S32M276CHABMKHSR reliable?
The price and inventory of S32M276CHABMKHSR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S32M276CHABMKHSR is usually 5 days.
3.What payment methods are accepted for S32M276CHABMKHSR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S32M276CHABMKHSR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S32M276CHABMKHSR?
S32M276CHABMKHSR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S32M276CHABMKHSR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S32M276CHABMKHSR?
For technical support, including S32M276CHABMKHSR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S32M276CHABMKHSR requirements.
6.How does Aetrix verify that S32M276CHABMKHSR is sourced from the original manufacturer or authorized distributors?
All S32M276CHABMKHSR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S32M276CHABMKHSR meets industry standards.
7.What is the process for return or replacement of S32M276CHABMKHSR?
All S32M276CHABMKHSR units undergo pre-shipment inspection (PSI). If there is an issue with S32M276CHABMKHSR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S32M276CHABMKHSR part is unused and in its original packaging.
Return procedure for S32M276CHABMKHSR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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