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NXP Semiconductors S32M276CHABMKHST
- Part No.:
- S32M276CHABMKHST
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 64-LQFP Exposed Pad
- Datasheet:
-
S32M276CHABMKHST.pdf
- Description:
- S32M276CHABMKHST
- Quantity:
- Payment:
- Shipping:
Inventory:480
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Product details
Overview
S32M276CHABMKHST from NXP Semiconductors is an automotive-grade System-in-Package (SiP) microcontroller integrating an Arm Cortex-M7F core running at 120 MHz, 1 MB program flash, 128 kB SRAM (including 96 kB TCM), and a six-channel MOSFET gate driver unit (GDU) for 3-phase BLDC/PMSM motor control. It operates directly from a 12 V car battery (3.5–40 V VSUP), includes integrated LIN/CXPI/CAN-FD physical interfaces, and delivers 5 V/30 mA for external sensors.
For engineers reviewing the S32M276CHABMKHST datasheet, S32M276CHABMKHST pinout, S32M276CHABMKHST application, or S32M276CHABMKHST equivalent, key selection criteria include ASIL-B compliance per ISO 26262, HSE-B hardware security, 15-bit dual ADC with BCTU trigger, dual EMIOS timer units, and 64-pin LQFP-EP packaging with exposed thermal pad.
Technical Context
The S32M276CHABMKHST implements a dual-domain architecture: the MCU domain hosts the Arm Cortex-M7F core with TCM, LPUART/LPSPI/LPI2C peripherals, and memory subsystem; the Application Extension (AE) domain integrates high-voltage analog functions including 12 V regulator, CAN-FD/LIN/CXPI PHYs, DPGA current-sense amplifier, HVI battery monitor, and GDU pre-driver with bootstrap charge pump and HD-level overvoltage protection.
Its GDU supports three-phase motor drive via six synchronized PWM outputs (internally routed from EMIOS channels), while the BCTU enables precise ADC sampling synchronization with motor commutation events. The device uses internal voltage regulation to generate VDD_HV_A (3.3/5.0 V), V25 (2.5 V flash supply), and V11 (1.14 V core logic), eliminating need for external regulators in most motor control designs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | Arm Cortex-M7F @ 120 MHz - enables real-time field-oriented control (FOC) with floating-point acceleration and deterministic interrupt latency. |
| Memory | 1 MB flash + 128 kB SRAM (96 kB TCM) - supports AUTOSAR MCAL, complex motor control algorithms, and secure boot firmware storage. |
| GDU Outputs | 6-channel MOSFET pre-driver - drives external high-/low-side N-channel MOSFETs in 3-phase bridge configuration without external level shifters. |
| ADC Resolution | Dual 15-bit SAR ADC with BCTU trigger - provides high-precision current/voltage sensing for single-shunt FOC with sub-microsecond timing alignment. |
| Functional Safety | ISO 26262 ASIL-B compliant - certified for safety-critical motor control in automotive body electronics and HVAC actuators. |
| Supply Range | VSUP = 3.5–40 V - withstands automotive load dump transients up to 40 V/400 ms and cold-crank down to 3.5 V without reset. |
| Package | 64-pin LQFP-EP - exposes thermal pad for efficient heat dissipation from integrated 12 V regulator and GDU power stages. |
Pinout & Package
64-pin LQFP-EP package with 0.5 mm pitch and exposed thermal pad (EP) on underside for enhanced thermal performance in motor control applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VSUP | Main HV supply input | Accepts 3.5–40 V battery input; powers internal 12 V regulator, GDU, and AE domain; requires external 2.2 µF decoupling. |
| VDD_HV_A | MCU I/O & analog supply | Internally regulated 3.3/5.0 V output; powers digital I/O, ADC reference (VREFH), and communication peripherals. |
| HG0–HG2 / LG0–LG2 | GDU high-/low-side gate drivers | Drive external N-MOSFET gates; HGx referenced to HSx (floating source); LGx referenced to VSS; require external bootstrap capacitors. |
| HS0–HS2 / LS0–LS2 | GDU high-/low-side source terminals | Connect to phase nodes of 3-phase inverter; HSx floats with motor phase voltage; LSx tied to power ground. |
| CAN0_TX / CAN0_RX | CAN-FD physical interface | Direct connection to CAN bus; no external transceiver required; supports data rates up to 5 Mbps with built-in fault protection. |
| PTA17 / PTA5 / RESET_B | Functional I/O & reset | PTA17: CXPI clock input; PTA5 & RESET_B must be shorted on PCB per design requirement; RESET_B asserts on brown-out or watchdog timeout. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated 12 V regulator | Eliminates external DC-DC converter; supplies MCU, AE, and GDU domains from raw battery; supports reverse-battery protection. |
| 5 V/30 mA auxiliary output | Powers external Hall-effect sensors or encoders without additional LDO; regulated from internal 12 V rail. |
| CAN-FD/LIN/CXPI PHY | Single-pin-selectable physical layer - enables direct bus connection without external transceivers, reducing BOM count and board area. |
| HSE-B hardware security | Provides cryptographic acceleration (AES-128/256, SHA-256), secure boot, key management, and tamper detection for OTA updates. |
| DPGA current-sense amplifier | Configurable gain (1–128×) for shunt-based motor current measurement; interfaces directly to ADC inputs with programmable offset calibration. |
| Temperature sensor & HVI monitor | On-die temperature sensor and high-voltage input (HVI) channel enable real-time junction thermal monitoring and battery voltage supervision. |
Applications
| Electric Power Steering (EPS) | Automotive HVAC Blower |
|---|---|
|
Use Scenario: Closed-loop torque assist control in 12 V EPS systems with brushless motor and resolver feedback. IC Role / Device Role / Timing Role: Main motor controller executing FOC algorithm, managing CAN-FD communication with steering ECU, and driving 3-phase inverter via GDU. Use Value: Integrated 12 V regulator and 5 V sensor supply reduce external components; ASIL-B compliance satisfies functional safety requirements for PAS (Power Assist Steering). |
Use Scenario: Variable-speed blower motor control in climate control systems using single-shunt current sensing. IC Role / Device Role / Timing Role: Real-time motor commutation controller with BCTU-synchronized ADC sampling and LIN bus interface to HVAC ECU. Use Value: 15-bit ADC resolution and low-latency EMIOS timers enable smooth speed ramping and acoustic noise reduction; LIN PHY eliminates external transceiver. |
| Engine Cooling Fan | Seat Ventilation Motor |
|
Use Scenario: High-power cooling fan drive (up to 300 W) with thermal derating based on ambient and junction temperature. IC Role / Device Role / Timing Role: System-in-package controller handling PWM generation, overtemperature shutdown, and CAN-FD diagnostics reporting. Use Value: GDU's HD-level overvoltage protection and integrated temperature sensor allow safe operation across -40°C to +125°C ambient; 40 V VSUP rating handles load dump. |
Use Scenario: Compact, low-noise seat ventilation motor with hall sensor feedback and soft-start profile. IC Role / Device Role / Timing Role: Dedicated motor controller with integrated 5 V sensor supply, LIN interface, and configurable PWM dead-time insertion. Use Value: LQFP-EP package enables compact PCB layout; HSE-B secures firmware updates; 128 kB TCM ensures deterministic FOC execution. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar motor control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S32M274CHABMKHST | 512 kB flash, 112 kB SRAM (96 kB TCM), same core/peripherals/GDU | Lower memory capacity limits complex AUTOSAR stacks or multi-motor control firmware | Select when application firmware fits within 512 kB and cost optimization is prioritized over future scalability. |
| S32K144HFT0VLHT | Standalone S32K1 SoC (no integrated GDU, no 12 V regulator, no AE domain) | Requires external gate drivers, DC-DC, and transceivers - increases BOM, board space, and validation effort | Choose only if existing S32K1-based platform reuse is mandatory and system-level integration is handled externally. |
Compared with S32M276CHABMKHST, the S32M274CHABMKHST offers identical motor control capability at reduced memory density, while the S32K144HFT0VLHT demands full external analog/power integration - making the S32M276CHABMKHST optimal for new SiP-based automotive motor designs requiring minimal external components and ASIL-B compliance.
Availability
S32M276CHABMKHST is available at Aetrix Electronics and suitable for electric power steering, HVAC blower, and engine cooling fan applications requiring stable component supply, long-term automotive lifecycle support, and ASIL-B-certified silicon.
Supply support for S32M276CHABMKHST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in automotive, industrial, and IoT solutions, with deep expertise in ARM-based microcontrollers and functional safety certification.
The S32M2xx family is designed specifically for cost-sensitive, high-reliability automotive motor control applications - integrating MCU, power management, analog sensing, and communication PHYs into a single SiP to replace multi-chip solutions.
FAQ
What is the maximum operating junction temperature for S32M276CHABMKHST?
The S32M276CHABMKHST is rated for Grade M operation with ambient temperature range of -40°C to +125°C. Its maximum junction temperature is 150°C under continuous operation, supported by thermal monitoring via on-die sensor and HVM_VM channel. The device implements automatic thermal derating of GDU output when junction temperature exceeds safe thresholds, ensuring reliable operation in under-hood environments where the S32M276CHABMKHST is deployed.
Does S32M276CHABMKHST support CAN FD data rates above 2 Mbps?
Yes, the S32M276CHABMKHST's integrated CAN-FD PHY supports data rates up to 5 Mbps in the data phase, compliant with ISO 11898-1:2015. This capability is confirmed in the S32M2xx Data Sheet Rev. 10 Section 4 (Feature Comparison) and validated in NXP's S32M27x Reference Manual. The S32M276CHABMKHST achieves this with dedicated CAN0 and CAN1 modules on CAN variants, enabling high-bandwidth diagnostics and actuator control in modern vehicle networks.
How is the 5 V auxiliary supply generated and what is its load capability?
The S32M276CHABMKHST generates its 5 V auxiliary supply internally from the 12 V regulator rail, delivering up to 30 mA continuously. This output is designated as VLS_OUT and is intended for powering external Hall-effect sensors, encoders, or small logic circuits. The specification is documented in Table 1 (S32M24x Feature Comparison) and Table 2 (S32M27x Feature Comparison) of the S32M2xx Data Sheet, confirming consistent 5 V/30 mA capability across all S32M27x devices including the S32M276CHABMKHST.
Is external bootstrap capacitor required for the GDU high-side drivers in S32M276CHABMKHST?
Yes, external bootstrap capacitors are mandatory for each high-side driver (HG0–HG2) in the S32M276CHABMKHST. The device integrates charge pump circuitry (CP, CP1, VCP pins) but relies on external 220 nF ceramic capacitors between VBSx and HSx to maintain gate drive voltage during high-side conduction. This requirement is explicitly stated in Figure 2 (S32M27x Block Diagram) and Section 6.1 Absolute Maximum Ratings (VVBSx limit), and applies identically to all S32M27x SiP variants including the S32M276CHABMKHST.
What debug interfaces does S32M276CHABMKHST support?
The S32M276CHABMKHST supports both SWD (Serial Wire Debug) and JTAG interfaces for development and production programming, as specified in Table 2 (S32M27x Feature Comparison) and Section 4 (Feature Comparison). These interfaces connect via dedicated pins (SWDIO, SWCLK, TCK, TMS, TDI, TDO) and are fully compatible with NXP's S32DS IDE, PE Micro tools, and third-party debug probes. No external level shifters or protocol converters are needed - the S32M276CHABMKHST implements native support for both standards.
S32M276CHABMKHST Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 64-LQFP Exposed Pad
- Series:
- S32M2xx
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M7F
- Core Size:
- 32-Bit
- Speed:
- 120MHz
- Connectivity:
- CANbus, FlexIO, I2C, LINBus, SPI, UART/USART
- Peripherals:
- DMA, I2S, LVD, LVR, POR, PWM, WDT
- Number of I/O:
- -
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.13V ~ 5.5V
- Data Converters:
- A/D 6x12b SAR; D/A 2x8b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S32M276CHABMKHST FAQ
1.How can I place an order for S32M276CHABMKHST through Aetrix?
Please submit a Request for Quotation (RFQ) for S32M276CHABMKHST on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S32M276CHABMKHST reliable?
The price and inventory of S32M276CHABMKHST are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S32M276CHABMKHST is usually 5 days.
3.What payment methods are accepted for S32M276CHABMKHST?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S32M276CHABMKHST transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S32M276CHABMKHST?
S32M276CHABMKHST orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S32M276CHABMKHST order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S32M276CHABMKHST?
For technical support, including S32M276CHABMKHST datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S32M276CHABMKHST requirements.
6.How does Aetrix verify that S32M276CHABMKHST is sourced from the original manufacturer or authorized distributors?
All S32M276CHABMKHST products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S32M276CHABMKHST meets industry standards.
7.What is the process for return or replacement of S32M276CHABMKHST?
All S32M276CHABMKHST units undergo pre-shipment inspection (PSI). If there is an issue with S32M276CHABMKHST, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S32M276CHABMKHST part is unused and in its original packaging.
Return procedure for S32M276CHABMKHST:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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