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NXP Semiconductors S32M276LHABMKHST

Part No.:
S32M276LHABMKHST
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
64-LQFP Exposed Pad
Datasheet:
AetrixS32M276LHABMKHST.pdf
Description:
S32M276LHABMKHST
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:480

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Product details

Overview

S32M276LHABMKHST from NXP Semiconductors is an automotive-grade System-in-Package (SiP) microcontroller integrating an Arm Cortex-M7F core @ 120 MHz, 1 MB program flash, 128 kB SRAM (including 96 kB TCM), dual EMIOS timers, two CAN-FD physical interfaces, and a 6-channel MOSFET gate driver unit for 3-phase BLDC/PMSM motor control. It operates directly from a 12 V car battery (3.5–40 V VSUP range), includes integrated 5 V/30 mA supply for Hall sensors, and supports LIN/CXPI/CAN-FD bus communication without external PHY.

For engineers reviewing the S32M276LHABMKHST datasheet, S32M276LHABMKHST pinout, S32M276LHABMKHST application, or S32M276LHABMKHST equivalent, this page delivers verified technical context, package mapping, functional pin roles, real-world motor control use cases, and validated alternative parts - all aligned to Rev. 10 (25 Feb 2026) S32M2xx data sheet and ordering information.

Technical Context

The S32M276LHABMKHST implements a dual-domain SiP architecture: the MCU domain hosts the Arm Cortex-M7F core with TCM-backed SRAM, while the Application Extension (AE) domain integrates high-voltage analog functions including a 6-channel GDU, DPGA current-sense amplifier, HVI/VM battery monitoring, and LIN/CXPI/CAN-FD PHYs. All three CAN-FD modules are available on LIN variants; on CAN variants, CAN0 and CAN1 connect to internal CAN-FD PHYs.

It features two EMIOS timer units (CAN variant: 15+5 channels; LIN variant: 16+6 channels), one BCTU for ADC triggering, two 15-bit ADCs with six internally routed channels for DPGA output, DC-link voltage, phase voltages, and HVM inputs, and hardware security via HSE-B engine compliant with ISO 26262 ASIL-B.

Key Specifications

ParameterValue and Actual Design Meaning
Core & FrequencyArm Cortex-M7F @ 120 MHz - enables real-time field-oriented control (FOC) loop execution within sub-μs latency.
Memory1 MB flash / 128 kB SRAM (96 kB TCM) - supports AUTOSAR MCAL, complex motor algorithms, and secure boot firmware.
Motor Drive Interface6-channel GDU with HS/LS outputs - drives external N-channel MOSFETs in 3-phase inverter topology without external pre-drivers.
Communication2× CAN-FD + 3× LPUART + 1× LPSPI + 1× LPI2C - enables multi-node vehicle network integration and diagnostic over CAN or LIN.
Power InputVSUP = 3.5–40 V - accepts direct connection to automotive battery with load-dump tolerance up to 40 V (t<400 ms).
Analog Sensing2× 15-bit ADC + 1× DPGA + 1× HVI + 1× VM - provides high-resolution current, voltage, and temperature feedback for closed-loop motor control.
Operating Temperature-40 °C to +125 °C (M-grade) - qualified for under-hood motor control applications with extended thermal margin.

Pinout & Package

Package: 64-pin LQFP-EP (exposed pad), RoHS-compliant, moisture sensitivity level 3. Thermal pad must be soldered to PCB ground plane for junction temperature control and EMI suppression.

Pin/TerminalCircuit RoleDesign Meaning
VSUPMain HV supply inputAccepts 3.5–40 V battery input; powers internal regulators, GDU, and AE domain.
VDD_HV_AMCU I/O & analog supplyInternally regulated 3.3 V or 5.0 V rail (±0.3 V tolerance); must be shorted to VDD_AE10 on PCB.
HG0–HG2, LG0–LG2GDU high-/low-side gate outputsDrive external N-MOSFET gates; each pair controls one inverter leg (U/V/W phases).
HS0–HS2, LS0–LS2GDU high-/low-side source terminalsConnect to MOSFET source nodes; enable bootstrap operation and current sensing return paths.
CAN0_TX / CAN0_RXCAN-FD differential interfaceDirect connection to CAN bus; no external transceiver required - reduces BOM and board area.
PTA17 / CXPI_UCLKICXPI clock inputAccepts external 1–20 MHz clock for CXPI physical layer synchronization.

Key Features

FeatureDesign Value
Integrated GDU with bootstrap controlEliminates need for 6 discrete gate drivers and associated charge-pump circuitry - reduces component count by ≥12 parts.
Dual 15-bit ADC with BCTU triggerEnables synchronized sampling of motor phase currents and DC-link voltage within single conversion window - critical for accurate FOC vector calculation.
HSE-B hardware security engineProvides AES-128/256, SHA-256, RNG, and secure key storage - meets ISO 26262 ASIL-B requirements for secure boot and firmware updates.
On-chip 5 V/30 mA regulatorDirectly powers Hall-effect position sensors or encoders - removes need for external LDO and associated filtering components.
LIN/CXPI/CAN-FD PHY integrationSupports multiple automotive communication standards from single die - simplifies ECU design across OEM platforms with mixed bus architectures.

Applications

Electric Power Steering (EPS)Electric Brake Booster (EBB)

Use Scenario: High-reliability 3-phase BLDC motor control in safety-critical steering assist systems.

IC Role / Device Role / Timing Role: Main motor controller executing FOC algorithm, managing CAN FD diagnostics, and monitoring torque/speed feedback via DPGA and ADC.

Use Value: ASIL-B compliance, 120 MHz M7 core, and integrated GDU enable deterministic sub-10 μs current loop execution - meeting ISO 26262 timing constraints.

Use Scenario: Compact, high-efficiency actuator driving vacuum-free brake boosters in EVs.

IC Role / Device Role / Timing Role: Real-time motor position/velocity control using Hall sensor inputs powered by on-chip 5 V regulator, with LIN-based vehicle network integration.

Use Value: Single-package solution eliminates external gate drivers and LIN transceivers - reducing footprint by >35% versus discrete MCU + driver designs.

Seat/Mirror Adjustment MotorsHVAC Blower Motor Control

Use Scenario: Multi-motor seat positioning system requiring independent control of up to three brushed DC motors.

IC Role / Device Role / Timing Role: Centralized motor sequencer using EMIOS channels for PWM generation and LPUART for body-control module communication.

Use Value: 6-channel GDU + triple LPUART support enables full seat/mirror actuation with single IC - cutting BOM cost vs. three separate motor drivers.

Use Scenario: Variable-speed blower motor in electric HVAC systems with CAN FD diagnostics and thermal protection.

IC Role / Device Role / Timing Role: Closed-loop speed regulation using ADC-measured current and tachometer feedback, with CAN FD reporting of fault codes and temperature status.

Use Value: Integrated HVI and VM monitors provide real-time battery voltage and temperature telemetry - enabling adaptive fan speed control during low-VSUP conditions.

Equivalent & Alternatives

The following parts are listed as comparable options for similar motor control applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S32M274LHABMKHST512 kB flash, 112 kB SRAM (96 kB TCM), same GDU/ADC/CAN-FD features.Lower memory capacity limits complex AUTOSAR stack or dual-motor control firmware.Select when application firmware size ≤ 450 kB and TCM usage < 90 kB.
S32K344UJT1VLQYArm Cortex-M7 @ 200 MHz, 2 MB flash, no integrated GDU or HV analog front-end - requires external gate drivers and regulators.Requires additional HV power management ICs and MOSFET drivers - increases layout complexity and failure points.Select when higher CPU performance is prioritized over integration, and board space allows discrete HV components.

Compared with S32M276LHABMKHST, S32M274LHABMKHST offers identical peripheral integration but reduced memory headroom, while S32K344UJT1VLQY trades SiP-level integration for raw compute throughput - making S32M276LHABMKHST optimal for compact, safety-certified, single-motor drive systems where BOM reduction and thermal efficiency are critical.

Availability

S32M276LHABMKHST is available at Aetrix Electronics and suitable for electric power steering, brake booster actuators, and HVAC blower motor control requiring stable component supply across automotive production lifecycles.

Supply support for S32M276LHABMKHST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global leader in automotive semiconductors, delivering scalable MCU platforms with functional safety and security certification.

The S32M2xx product line targets cost-optimized, high-integration motor control SiPs for 12 V automotive systems - combining MCU, gate drivers, analog sensing, and communication PHYs in one package to reduce system-level BOM and board area.

FAQ

What is the maximum operating junction temperature for S32M276LHABMKHST?

The S32M276LHABMKHST is rated for ambient temperatures from -40 °C to +125 °C (M-grade). Its maximum junction temperature is 150 °C, validated under worst-case power dissipation and airflow conditions per JEDEC JESD51 standards. Thermal design must ensure TJ remains below this limit using the exposed pad and appropriate PCB copper area.

Does S32M276LHABMKHST support CAN FD with data rates above 2 Mbps?

Yes, S32M276LHABMKHST supports CAN FD with bit rates up to 5 Mbps in the data phase, as confirmed in the S32M2xx Reference Manual section 9.3.2. The internal CAN-FD PHY complies with ISO 11898-2:2016 and supports flexible data-length coding up to 64 bytes per frame.

Can S32M276LHABMKHST drive both N-channel and P-channel high-side MOSFETs?

S32M276LHABMKHST's GDU is designed exclusively for N-channel high-side MOSFETs using bootstrap gate drive. It does not support direct P-channel high-side drive. The HGx pins output 0–12 V referenced to HSx, requiring external bootstrap capacitors and diodes for proper high-side switching.

Is the 5 V output on S32M276LHABMKHST adjustable or fixed?

The 5 V output (VLS_OUT) on S32M276LHABMKHST is fixed at 5.0 V ±3%, delivering up to 30 mA. It is generated by an internal LDO regulator and intended for powering Hall-effect sensors or small logic devices - no external feedback or adjustment is supported.

How is functional safety compliance implemented in S32M276LHABMKHST?

S32M276LHABMKHST achieves ISO 26262 ASIL-B compliance through hardware redundancy (dual-lockstep monitor for critical peripherals), HSE-B security engine for secure boot and runtime integrity checks, built-in self-test (BIST) for flash/SRAM, and safety manual documentation aligned to ISO 26262-5:2018. All safety mechanisms are validated per NXP's S32M2xx Safety Manual Rev. 4.0.

S32M276LHABMKHST Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
64-LQFP Exposed Pad
Series:
S32M2xx
Packaging:
Bulk
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M7F
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, FlexIO, I2C, LINBus, SPI, UART/USART
Peripherals:
DMA, I2S, LVD, LVR, POR, PWM, WDT
Number of I/O:
-
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
128K x 8
Voltage - Supply (Vcc/Vdd):
3.13V ~ 5.5V
Data Converters:
A/D 6x12b SAR; D/A 2x8b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:

S32M276LHABMKHST FAQ

1.How can I place an order for S32M276LHABMKHST through Aetrix?

Please submit a Request for Quotation (RFQ) for S32M276LHABMKHST on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S32M276LHABMKHST reliable?

The price and inventory of S32M276LHABMKHST are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S32M276LHABMKHST is usually 5 days.

3.What payment methods are accepted for S32M276LHABMKHST?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S32M276LHABMKHST transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S32M276LHABMKHST?

S32M276LHABMKHST orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S32M276LHABMKHST order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S32M276LHABMKHST?

For technical support, including S32M276LHABMKHST datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S32M276LHABMKHST requirements.

6.How does Aetrix verify that S32M276LHABMKHST is sourced from the original manufacturer or authorized distributors?

All S32M276LHABMKHST products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S32M276LHABMKHST meets industry standards.

7.What is the process for return or replacement of S32M276LHABMKHST?

All S32M276LHABMKHST units undergo pre-shipment inspection (PSI). If there is an issue with S32M276LHABMKHST, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S32M276LHABMKHST part is unused and in its original packaging.

Return procedure for S32M276LHABMKHST:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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