Infineon Technologies S40410081B1B2I000
- Part No.:
- S40410081B1B2I000
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LBGA
- Datasheet:
-
S40410081B1B2I000.pdf
- Description:
- IC FLASH 8GBIT PARALLEL 100LBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,816
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S40410081B1B2I000 from Cypress Semiconductor is an 8 GB e.MMC 4.51-compliant embedded flash memory device with integrated controller, operating at 2.7–3.6 V (VCC) and 1.7–1.95 V or 2.7–3.6 V (VCCQ), housed in a 153-ball VFBGA (13 mm × 11.5 mm × 1.0 mm). It delivers 120 MB/s sequential read and 20 MB/s sequential write in HS200/x8 mode, supports boot partitions, RPMB, and hardware reset, and is rated for industrial temperature (−40 °C to +85 °C).
For engineers reviewing the S40410081B1B2I000 datasheet, S40410081B1B2I000 pinout, S40410081B1B2I000 application, or S40410081B1B2I000 equivalent, key selection criteria include HS200 timing compliance, RPMB partition support, boot operation capability, industrial temperature rating, and 153-ball VFBGA mechanical compatibility.
Technical Context
This e.MMC device implements JEDEC JESD84-B451 architecture with dedicated boot partitions (4 MB each), a 4 MB Replay Protected Memory Block (RPMB), and configurable General Purpose Partitions. Its controller integrates wear-leveling, ECC, garbage collection, and defect management over MLC NAND flash.
It supports three operational modes: SDR (up to 52 MHz), DDR (up to 52 MHz), and HS200 (up to 200 MHz) on x4 or x8 data buses, with hardware reset (RST_N), high-priority interrupt (HPI), and background operations enabled via EXT_CSD register configuration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 8 GB usable storage in factory-configured SLC-enhanced partitions and MLC user area |
| Interface Standard | e.MMC 4.51 (JESD84-B451), backward-compatible with earlier e.MMC specs |
| Max Sequential Read | 120 MB/s - achieved in HS200 mode with x8 bus, enabling fast firmware load in boot scenarios |
| Max Sequential Write | 20 MB/s - measured under HS200/x8 conditions, suitable for logging and system updates |
| Operating Temp | −40 °C to +85 °C - qualified for industrial embedded applications without derating |
| Supply Voltages | VCC: 2.7–3.6 V (flash core); VCCQ: 1.7–1.95 V or 2.7–3.6 V (I/O interface) |
| Data Bus Width | x1/x4/x8 in SDR; x4/x8 in DDR and HS200 - enables scalable bandwidth matching host SoC capability |
Pinout & Package
Package: 153-ball Very Thin Fine-Pitch BGA (VFBGA), 13.0 mm × 11.5 mm × 1.0 mm, 0.5 mm ball pitch. Ball grid arranged in 11 rows × 14 columns with corner balls omitted per JEDEC MO-270DA.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DAT0–DAT7 | Bidirectional data I/O | 8-bit parallel data path supporting SDR/DDR/HS200; must be terminated per JEDEC AC timing |
| CMD | Bidirectional command I/O | Carries initialization, status, and control commands; requires pull-up per spec |
| CLK | Input clock | Provides synchronous timing reference up to 200 MHz in HS200 mode |
| RST_N | Active-low hardware reset | Asynchronous hard reset that clears internal state and reinitializes controller logic |
| VCC | Flash memory core supply | 2.7–3.6 V power for NAND array; decoupling required per layout guidelines |
| VCCQ | I/O interface supply | Configurable 1.8 V or 3.0 V domain for MMC signaling; sets voltage level for DAT/CMD/CLK |
| VDDI | Internal regulator input | Connects to external 1 µF capacitor to ground; supplies internal analog/PLL circuitry |
| VSS / VSSQ | Ground returns | VSS for flash core, VSSQ for I/O-separate planes recommended to minimize noise coupling |
Key Features
| Feature | Design Value |
|---|---|
| Boot Partition Support | Two factory-configured 4 MB SLC boot partitions enable reliable cold-start execution without host-side NAND management |
| RPMB Partition | 4 MB authenticated, replay-protected memory block for secure key storage and firmware integrity verification |
| HS200 Mode | 200 MHz clock with x8 bus yields 120 MB/s read throughput-critical for fast boot and OTA update latency reduction |
| Auto Background Operations | Controller autonomously performs garbage collection and wear leveling during idle cycles, preserving sustained write performance |
| Industrial Temp Range | −40 °C to +85 °C operation validated across full voltage and timing margins, eliminating thermal derating in harsh environments |
Applications
| Industrial HMI Panel | Medical Diagnostic Device |
|---|---|
Use Scenario: Touchscreen-based human-machine interface requiring fast boot, secure firmware storage, and long-term data logging in factory automation settings. IC Role / Device Role / Timing Role: Primary embedded storage executing boot code from SLC boot partitions and storing calibration logs in RPMB-secured sectors. Use Value: −40 °C to +85 °C rating ensures reliability in uncontrolled cabinet environments; HS200 reduces boot time by >35% vs. legacy e.MMC. | Use Scenario: Portable ultrasound unit needing tamper-proof storage of patient records and FDA-mandated audit trails. IC Role / Device Role / Timing Role: Secure non-volatile storage with RPMB-enforced cryptographic signing of diagnostic metadata before write commit. Use Value: RPMB partition provides hardware-rooted authentication, meeting IEC 62304 data integrity requirements without external security IC. |
| Gaming Console Set-Top Module | Automotive Infotainment Head Unit |
Use Scenario: Compact gaming accessory module requiring rapid game asset loading and persistent save-state storage. IC Role / Device Role / Timing Role: High-bandwidth storage subsystem using x8 HS200 mode to stream texture assets directly to GPU memory. Use Value: 120 MB/s sequential read sustains real-time asset streaming; General Purpose Partitions allow dynamic allocation for title-specific cache zones. | Use Scenario: In-vehicle infotainment system requiring robust firmware resilience against power interruption during engine start-stop cycles. IC Role / Device Role / Timing Role: Embedded storage with hardware reset (RST_N) and power-off notification support to ensure atomic firmware writes during brownout events. Use Value: Hardware reset guarantees deterministic recovery from supply glitches; SLC-enhanced partitions prevent corruption during frequent partial rewrites. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar e.MMC storage applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SanDisk iNAND MC EU316 (SDIN8DE2-8G) | Same 8 GB density, 153-ball VFBGA, e.MMC 5.1 compliant; adds HS400 mode (up to 400 MB/s) and deeper sleep states | Supports automotive AEC-Q200 qualification; lacks factory-configured RPMB size guarantee | Select when HS400 bandwidth or automotive qualification is mandatory; verify RPMB provisioning workflow compatibility |
| SK hynix H9TP32A8GDMCPR | 8 GB e.MMC 5.0, 153-ball VFBGA; higher random write IOPS (2,100 vs. 1,400), but no factory boot partition configuration | Targeted for mobile handsets; industrial temp grade requires special ordering (H9TP32A8GDMCPR-EL) | Choose for improved random write latency in logging-heavy applications; confirm industrial-grade availability and boot partition setup effort |
Compared with SanDisk EU316 and SK hynix H9TP32A8GDMCPR, the S40410081B1B2I000 offers guaranteed factory-configured boot/RPMB partitions and validated industrial temperature operation out-of-box-reducing bring-up time for medical and industrial designs where partition consistency and thermal margin are critical.
Availability
S40410081B1B2I000 is available at Aetrix Electronics and suitable for industrial HMI panels, medical diagnostic devices, and automotive infotainment head units requiring stable component supply, long-lifecycle support, and guaranteed factory partition configuration.
Supply support for S40410081B1B2I000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and consumer markets.
The S4041 e.MMC product line was designed specifically for embedded systems demanding JEDEC-compliant managed NAND with industrial temperature resilience, secure boot, and simplified firmware integration-eliminating the need for host-side flash translation layer development.
FAQ
What is the factory default configuration of boot and RPMB partitions?
The S40410081B1B2I000 ships with two 4 MB boot partitions and one 4 MB RPMB partition, all pre-configured in Enhanced (SLC) mode for maximum reliability. These sizes and modes are fixed at factory and cannot be altered post-shipment.
Does this device support power-loss protection during write operations?
Yes-it implements hardware-assisted power-off notification (via CMD12 with specific arguments) and uses SLC-enhanced partitions for critical firmware areas. The controller guarantees atomic sector writes and maintains internal state integrity during abrupt VCC dropout within specified timing windows.
Can the General Purpose Partitions be resized after initial programming?
No. Partition sizes and enhancement modes (SLC/MLC) for General Purpose Partitions are one-time programmable via EXT_CSD register writes. Once configured, these attributes are locked permanently and cannot be modified in the field.
Is HS200 mode compatible with standard e.MMC 4.51 host controllers?
Yes-HS200 is defined in JEDEC JESD84-B451 and supported by all compliant host controllers. The S40410081B1B2I000 enters HS200 mode via standardized CMD6 command sequence and requires host-side tuning of signal integrity parameters per AC timing tables.
S40410081B1B2I000 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- e.MMC 1B1
- Package/Case:
- 100-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NAND
- Memory Size:
- 8Gbit
- Memory Organization:
- 1G x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-LBGA (14x18)
S40410081B1B2I000 FAQ
1.How can I place an order for S40410081B1B2I000 through Aetrix?
Please submit a Request for Quotation (RFQ) for S40410081B1B2I000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S40410081B1B2I000 reliable?
The price and inventory of S40410081B1B2I000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S40410081B1B2I000 is usually 5 days.
3.What payment methods are accepted for S40410081B1B2I000?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S40410081B1B2I000 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S40410081B1B2I000?
S40410081B1B2I000 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S40410081B1B2I000 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S40410081B1B2I000?
For technical support, including S40410081B1B2I000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S40410081B1B2I000 requirements.
6.How does Aetrix verify that S40410081B1B2I000 is sourced from the original manufacturer or authorized distributors?
All S40410081B1B2I000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S40410081B1B2I000 meets industry standards.
7.What is the process for return or replacement of S40410081B1B2I000?
All S40410081B1B2I000 units undergo pre-shipment inspection (PSI). If there is an issue with S40410081B1B2I000, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S40410081B1B2I000 part is unused and in its original packaging.
Return procedure for S40410081B1B2I000:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S40410081B1B2I000 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

