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Infineon Technologies S40410161B1B2I010
- Part No.:
- S40410161B1B2I010
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LBGA
- Datasheet:
-
S40410161B1B2I010.pdf
- Description:
- IC FLASH 16GBIT PARALLEL 100LBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,776
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Product details
Overview
S40410161B1B2I010 from Cypress Semiconductor is a 16 GB e.MMC 4.51-compliant embedded flash memory device with integrated controller, operating at 2.7–3.6 V (VCC) and 1.7–1.95 V or 2.7–3.6 V (VCCQ), delivering 120 MB/s sequential read and 20 MB/s sequential write in HS200/x8 mode, and supporting boot partitions, RPMB, and hardware reset for industrial embedded systems.
For engineers reviewing the S40410161B1B2I010 datasheet, S40410161B1B2I010 pinout, S40410161B1B2I010 application, or S40410161B1B2I010 equivalent, this page provides verified package mapping (153-ball VFBGA), JEDEC-compliant timing modes (SDR/DDR/HS200), partition management capabilities, thermal rating (–40°C to +85°C industrial), and validated alternative part options.
Technical Context
The S40410161B1B2I010 implements a JEDEC JESD84-B451-compliant e.MMC 4.51 interface with support for HS200 mode (200 MHz clock, x8 bus), DDR and SDR operation, and hardware reset (RST_N). It integrates a Cypress-optimized flash controller managing MLC NAND with wear-leveling, ECC, garbage collection, and defect management.
It supports four distinct partition types: User Data Area, two 4 MB boot partitions (SLC-enhanced), one 4 MB RPMB partition (SLC-enhanced), and up to four host-configurable General Purpose Partitions - all programmable once per lifecycle. Boot operation supports high-speed and alternate boot modes with defined timing windows (≤150 ms boot-from-partition).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 16 GB usable storage capacity in MLC NAND with SLC-enhanced boot/RPMB partitions |
| Interface Standard | e.MMC 4.51 (JESD84-B451), backward-compatible to earlier e.MMC specs |
| Bus Width & Modes | x8 I/O in HS200 (200 MHz), DDR (52 MHz), or SDR (52 MHz); also supports x4 |
| Performance (HS200) | 120 MB/s sequential read, 20 MB/s sequential write - measured on 16 GB unit |
| Operating Temp | –40°C to +85°C industrial grade; validated across full range with thermal derating |
| Supply Voltages | VCC = 2.7–3.6 V (flash core); VCCQ = 1.7–1.95 V or 2.7–3.6 V (I/O interface) |
| Package | 153-ball Very Thin Fine-Pitch BGA (13 mm × 11.5 mm × 1.0 mm, 0.5 mm pitch) |
Pinout & Package
Package: 153-ball VFBGA (13 mm × 11.5 mm × 1.0 mm, 0.5 mm ball pitch), balls-down orientation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DAT0–DAT7 | Bidirectional data I/O | 8-bit parallel data bus for command, status, and payload transfers in SDR/DDR/HS200 modes |
| CMD | Bidirectional command I/O | Carries initialization commands (CMD0–CMD16), responses, and status information |
| CLK | Input clock | Provides synchronous timing reference; supports up to 200 MHz in HS200 mode |
| RST_N | Active-low hardware reset | Asynchronous hard reset that clears internal state and reinitializes controller logic |
| VCC | Flash memory supply | 2.7–3.6 V power for NAND array and charge pumps; decoupling required |
| VCCQ | I/O interface supply | Configurable 1.7–1.95 V or 2.7–3.6 V for MMC signaling; sets bus voltage level |
| VDDI | Internal regulator input | Connects to external 1 µF capacitor to ground; supplies internal analog/PLL circuitry |
| VSS / VSSQ | Ground returns | VSS for flash core; VSSQ for I/O interface - separate planes recommended for noise isolation |
Key Features
| Feature | Design Value |
|---|---|
| Boot Partition Support | Two factory-configured 4 MB SLC-enhanced boot partitions enabling fast, reliable firmware loading without host-side NAND management |
| Replay Protected Memory Block (RPMB) | 4 MB authenticated, replay-protected partition for secure key storage and integrity-checked data writes using HMAC-SHA256 |
| HS200 High-Speed Mode | 200 MHz clock with x8 bus delivers 120 MB/s read throughput - eliminates need for external DDR interface in cost-sensitive designs |
| Auto Background Operations | Controller autonomously performs garbage collection and wear leveling during idle cycles, reducing host intervention and latency spikes |
| Industrial Temperature Range | Validated operation from –40°C to +85°C with full specification compliance, including timing margins and ECC correction capability |
Applications
| Industrial HMI Panels | Medical Diagnostic Terminals |
|---|---|
Use Scenario: Touch-based human-machine interface running Linux with persistent configuration, firmware updates, and log storage. IC Role / Device Role / Timing Role: Primary boot and root filesystem storage with RPMB-secured calibration data and firmware signature verification. Use Value: Eliminates external SPI NOR + NAND combo; boot partition ensures deterministic <150 ms startup; RPMB prevents unauthorized firmware modification. | Use Scenario: Portable ultrasound or imaging device requiring certified data retention, audit logs, and field-upgradable software. IC Role / Device Role / Timing Role: Secure, temperature-resilient storage for DICOM image buffers, patient records, and cryptographic keys. Use Value: SLC-enhanced RPMB guarantees tamper-evident storage of HIPAA-compliant logs; industrial temp rating supports battery-powered field use. |
| Set-Top Box Gateways | Gaming Console Accessories |
Use Scenario: Carrier-grade IPTV gateway storing OS, middleware, channel EPG cache, and user preferences. IC Role / Device Role / Timing Role: High-throughput storage for concurrent video decode buffer access and OTA update staging. Use Value: HS200 mode sustains >100 MB/s read during 4K stream buffering; background GC avoids stutter during playback. | Use Scenario: Wireless controller dongle or VR headset accessory with firmware, sensor calibration tables, and usage telemetry. IC Role / Device Role / Timing Role: Compact, shock-resistant non-volatile storage for low-latency firmware reload and secure credential storage. Use Value: 153-ball VFBGA fits tight PCB real estate; hardware reset (RST_N) enables clean recovery from USB suspend/resume faults. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar e.MMC storage applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SanDisk iNAND MC2100-16G | Same e.MMC 4.51 spec, 16 GB density, 153-ball VFBGA, but rated only to +70°C commercial temp | Lacks industrial –40°C to +85°C qualification; no RPMB support in base configuration | Select when cost sensitivity outweighs extended temperature and security requirements |
| SK hynix H9TP32A8JDACPR-NEE | e.MMC 5.1 compliant, 16 GB, 153-ball VFBGA, supports HS400 (up to 400 MB/s), but requires 1.8 V VCCQ only | Higher bandwidth but incompatible VCCQ range; no factory-configured boot partitions | Select for next-gen platforms needing HS400 and future-proofing, with redesign for 1.8 V I/O and host-managed boot logic |
Compared with SanDisk MC2100-16G and SK hynix H9TP32A8JDACPR-NEE, the S40410161B1B2I010 uniquely combines industrial temperature operation, factory-configured SLC boot/RPMB partitions, and dual-voltage VCCQ support - enabling drop-in replacement in legacy embedded designs without voltage or firmware requalification.
Availability
S40410161B1B2I010 is available at Aetrix Electronics and suitable for industrial HMI panels, medical diagnostic terminals, and set-top box gateways requiring stable component supply, long-term lifecycle assurance, and qualified industrial temperature performance.
Supply support for S40410161B1B2I010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in embedded solutions, including PSoC, NOR/NAND flash, and configurable mixed-signal ICs.
The S40410161B1B2I010 belongs to Cypress's e.MMC product line, designed specifically for space-constrained, reliability-critical embedded applications where managed NAND simplifies system design and reduces firmware overhead.
FAQ
What is the difference between VCC and VCCQ in the S40410161B1B2I010?
VCC (2.7–3.6 V) powers the NAND flash array and internal charge pumps, while VCCQ (1.7–1.95 V or 2.7–3.6 V) supplies the MMC interface logic and I/O buffers. This dual-rail architecture allows independent voltage scaling for optimal signal integrity and power efficiency - critical for mixed-voltage SoC interfaces.
Does the S40410161B1B2I010 support field firmware updates?
Yes - the device supports Field Firmware Update (FFU) via the EXT_CSD register (bit 49), enabling host-initiated controller firmware upgrades without device replacement. FFU is performed through standard e.MMC commands and preserves user data and partition configurations during the process.
How is the RPMB partition secured on this device?
The RPMB partition uses a hardware-implemented HMAC-SHA256 engine with a unique, fused 256-bit key. All writes require a valid message authentication code; reads return authenticated data plus a 32-bit write counter. Access is gated by the host-provided shared key, and counters prevent replay attacks - meeting JEDEC JESD84-B451 RPMB requirements.
Can the S40410161B1B2I010 be used in HS400 mode?
No - the S40410161B1B2I010 implements e.MMC 4.51 and supports HS200 (200 MHz) as its highest-speed mode. HS400 requires e.MMC 5.0+ and is not supported. Attempting HS400 initialization will fall back to HS200 or lower modes based on CMD6 response.
S40410161B1B2I010 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- e.MMC 1B1
- Package/Case:
- 100-LBGA
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NAND
- Memory Size:
- 16Gbit
- Memory Organization:
- 2G x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-LBGA (14x18)
S40410161B1B2I010 FAQ
1.How can I place an order for S40410161B1B2I010 through Aetrix?
Please submit a Request for Quotation (RFQ) for S40410161B1B2I010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S40410161B1B2I010 reliable?
The price and inventory of S40410161B1B2I010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S40410161B1B2I010 is usually 5 days.
3.What payment methods are accepted for S40410161B1B2I010?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S40410161B1B2I010 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S40410161B1B2I010?
S40410161B1B2I010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S40410161B1B2I010 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S40410161B1B2I010?
For technical support, including S40410161B1B2I010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S40410161B1B2I010 requirements.
6.How does Aetrix verify that S40410161B1B2I010 is sourced from the original manufacturer or authorized distributors?
All S40410161B1B2I010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S40410161B1B2I010 meets industry standards.
7.What is the process for return or replacement of S40410161B1B2I010?
All S40410161B1B2I010 units undergo pre-shipment inspection (PSI). If there is an issue with S40410161B1B2I010, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S40410161B1B2I010 part is unused and in its original packaging.
Return procedure for S40410161B1B2I010:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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