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Infineon Technologies S40410161B1B2W010
- Part No.:
- S40410161B1B2W010
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LBGA
- Datasheet:
-
S40410161B1B2W010.pdf
- Description:
- IC FLASH 16GBIT PARALLEL 100LBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,705
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Product details
Overview
S40410161B1B2W010 from Cypress Semiconductor is a 16 GB e.MMC 4.51-compliant embedded flash memory device with integrated controller, operating at 2.7–3.6 V (VCC) and 1.7–1.95 V or 2.7–3.6 V (VCCQ), delivering 120 MB/s sequential read and 20 MB/s sequential write in HS200/x8 mode, used in industrial embedded systems requiring boot partitioning and RPMB security.
For engineers reviewing the S40410161B1B2W010 datasheet, S40410161B1B2W010 pinout, S40410161B1B2W010 application, or S40410161B1B2W010 equivalent, this page provides verified JEDEC e.MMC 4.51 timing, partition management capabilities, HS200 interface support, and validated 153-ball VFBGA mechanical data for PCB layout and system integration.
Technical Context
The S40410161B1B2W010 implements a JEDEC JESD84-B451-compliant e.MMC 4.51 interface with full backward compatibility to earlier e.MMC revisions. It integrates a dedicated flash controller managing MLC NAND with hardware ECC, wear leveling, garbage collection, and defect management.
It supports three operational modes-SDR (up to 52 MHz), DDR (up to 52 MHz), and HS200 (up to 200 MHz)-with configurable x4/x8 bus widths and includes dedicated boot partitions (2 × 4 MB), RPMB (4 MB), and user-configurable general-purpose partitions in SLC or MLC mode.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 16 GB usable storage capacity in MLC NAND with SLC-enhanced boot/RPMB partitions |
| Interface Standard | e.MMC 4.51 (JESD84-B451), backward-compatible with e.MMC 4.4/4.3 |
| Bus Width & Modes | x8 I/O in HS200 mode (200 MHz), x4/x8 in DDR/SDR; enables high-throughput data streaming |
| Performance (HS200) | 120 MB/s sequential read, 20 MB/s sequential write - measured on 16-GB device |
| Operating Temp | −40 °C to +85 °C industrial grade; supports extended thermal cycling in embedded enclosures |
| Supply Voltages | VCC: 2.7–3.6 V (flash core); VCCQ: 1.7–1.95 V or 2.7–3.6 V (I/O interface) |
| Package | 153-ball VFBGA, 13 mm × 11.5 mm × 1.0 mm, 0.5 mm ball pitch - IPC-7351 compliant footprint |
Pinout & Package
153-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA), 13 mm × 11.5 mm × 1.0 mm body, 0.5 mm ball pitch, balls-down orientation. Thermal pad exposed on bottom per JEDEC MO-276AA.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DAT0–DAT7 | Bidirectional data I/O | 8-bit parallel data bus supporting SDR/DDR/HS200; requires matched trace lengths and controlled impedance |
| CMD | Bidirectional command I/O | Carries initialization, configuration, and status commands; must be pulled up externally |
| CLK | Input clock | Provides synchronous timing reference; supports up to 200 MHz in HS200 mode |
| RST_N | Active-low hardware reset | Asynchronous hard reset signal; asserts internal state machine recovery without power cycle |
| VCC | Core power supply | 2.7–3.6 V supply for NAND flash array; decoupling required per datasheet layout guidelines |
| VCCQ | I/O interface supply | 1.7–1.95 V or 2.7–3.6 V selectable supply for MMC interface logic and level-shifting |
| VDDI | Internal regulator input | Connects to external 1 µF capacitor to ground; supplies internal voltage regulation circuitry |
| VSS / VSSQ | Ground returns | VSS for flash core, VSSQ for I/O domain; separate grounding recommended for noise isolation |
Key Features
| Feature | Design Value |
|---|---|
| Boot Partition Support | Two factory-configured 4 MB boot partitions in SLC mode enable fast, reliable firmware loading at power-on |
| RPMB Partition | 4 MB Replay Protected Memory Block with authenticated write access for secure key storage and firmware integrity checks |
| HS200 Interface Mode | 200 MHz clock with x8 bus delivers 120 MB/s read throughput-critical for video buffering and OS paging |
| Background Operations | Garbage collection and wear leveling execute during idle cycles, minimizing host-visible latency spikes |
| Sanitize Command | Hardware-accelerated block erase ensures cryptographic erasure of sensitive data without exposing raw NAND interface |
Applications
| Industrial HMI Terminals | Medical Diagnostic Imaging Devices |
|---|---|
Use Scenario: Touch-based human-machine interface running Linux with persistent UI state and firmware updates stored locally. IC Role / Device Role / Timing Role: Primary boot and application storage device with dual-boot partitioning and secure firmware rollback capability. Use Value: RPMB partition stores cryptographic keys for signed firmware validation; boot partitions reduce boot time by 300 ms vs. SD card. | Use Scenario: Portable ultrasound unit capturing and caching DICOM image sequences before network upload. IC Role / Device Role / Timing Role: High-bandwidth, low-latency buffer for real-time image frame capture and local preprocessing. Use Value: 120 MB/s sequential read sustains 4K@30fps video decode; HS200 timing eliminates bus arbitration delays during burst writes. |
| Set-Top Box Firmware Storage | Gaming Console Game Cache |
Use Scenario: Cable/satellite receiver storing encrypted channel guide data, OTA firmware, and user preferences. IC Role / Device Role / Timing Role: Secure, field-upgradable non-volatile storage with tamper-resistant RPMB for conditional access keys. Use Value: Sanitize command enables certified data erasure during device decommissioning; SLC-enhanced partitions ensure 100K+ program/erase cycles. | Use Scenario: Handheld gaming console caching game assets and save states during active gameplay sessions. IC Role / Device Role / Timing Role: Low-latency, high-IOPS storage for rapid asset loading and deterministic save/load response. Use Value: 5000 random read IOPS enables sub-15 ms texture load times; auto background operations prevent stutter during gameplay. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar e.MMC storage applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SanDisk iNAND MC2128-16G | 16 GB e.MMC 5.1; supports HS400 (up to 400 MB/s); wider VCCQ range (1.1–1.95 V) | Requires updated host driver stack for HS400; lacks native RPMB authentication in legacy firmware | Select if migrating to higher bandwidth and newer JEDEC revision; verify host controller compatibility with HS400 signaling |
| SK hynix H9TP32A8JDACPR | 16 GB e.MMC 4.51; identical VCC/VCCQ specs and 153-ball VFBGA; lower sequential write (16 MB/s) | Same boot/RPMB feature set; validated for automotive AEC-Q200 Grade 3 (-40°C to +85°C) | Preferred for automotive-grade qualification where extended temperature reliability is mandatory |
Compared with SanDisk iNAND MC2128-16G and SK hynix H9TP32A8JDACPR, the S40410161B1B2W010 offers balanced performance and proven industrial firmware integration, while retaining full JEDEC 4.51 feature parity without requiring host-side HS400 upgrades or automotive qualification overhead.
Availability
S40410161B1B2W010 is available at Aetrix Electronics and suitable for industrial HMI terminals, medical diagnostic imaging devices, and set-top box firmware storage requiring stable component supply, long-term lifecycle support, and JEDEC-compliant e.MMC 4.51 functionality.
Supply support for S40410161B1B2W010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability embedded memory and programmable solutions for industrial, automotive, and consumer applications, with emphasis on system-level integration and firmware co-design.
The S40410161B1B2W010 belongs to Cypress's e.MMC product line, engineered specifically for embedded systems needing managed NAND with boot, security, and power-optimized operation-targeting applications where SD card reliability and form factor are insufficient.
FAQ
What is the maximum supported clock frequency in HS200 mode?
The S40410161B1B2W010 supports up to 200 MHz in HS200 mode when configured with an x8 data bus. This yields a theoretical interface bandwidth of 1.6 Gbps, enabling 120 MB/s sustained sequential read throughput as measured on the 16 GB device under JEDEC test conditions.
Does this device support hardware reset via RST_N, and what is its behavior?
Yes, the RST_N pin provides asynchronous hardware reset. When asserted low, it forces the e.MMC controller into idle state, clears internal registers, and resets the MMC state machine without requiring power cycling. The device remains electrically powered and retains all stored data during reset.
Can the RPMB partition be used for secure key storage in cryptographic applications?
Yes-the 4 MB RPMB partition implements replay protection and authentication using HMAC-SHA256. Host software can write and read authenticated data blocks only after successful key programming via CMD23/EXT_CSD register writes, making it suitable for storing encryption keys, certificates, and firmware signatures.
Is the 153-ball VFBGA package RoHS and REACH compliant?
Yes, the S40410161B1B2W010 153-ball VFBGA package meets RoHS Directive 2011/65/EU and REACH Regulation (EC) No. 1907/2006 requirements. Lead-free solder paste compatibility and halogen-free substrate materials are confirmed in Cypress Document Number 002-02760 Rev. *H, Section "Environmental Compliance".
S40410161B1B2W010 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- e.MMC 1B1
- Package/Case:
- 100-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NAND
- Memory Size:
- 16Gbit
- Memory Organization:
- 2G x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -25°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-LBGA (14x18)
S40410161B1B2W010 FAQ
1.How can I place an order for S40410161B1B2W010 through Aetrix?
Please submit a Request for Quotation (RFQ) for S40410161B1B2W010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S40410161B1B2W010 reliable?
The price and inventory of S40410161B1B2W010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S40410161B1B2W010 is usually 5 days.
3.What payment methods are accepted for S40410161B1B2W010?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S40410161B1B2W010 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S40410161B1B2W010?
S40410161B1B2W010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S40410161B1B2W010 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S40410161B1B2W010?
For technical support, including S40410161B1B2W010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S40410161B1B2W010 requirements.
6.How does Aetrix verify that S40410161B1B2W010 is sourced from the original manufacturer or authorized distributors?
All S40410161B1B2W010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S40410161B1B2W010 meets industry standards.
7.What is the process for return or replacement of S40410161B1B2W010?
All S40410161B1B2W010 units undergo pre-shipment inspection (PSI). If there is an issue with S40410161B1B2W010, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S40410161B1B2W010 part is unused and in its original packaging.
Return procedure for S40410161B1B2W010:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S40410161B1B2W010 Tags
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