My Inquiry
My Account
Texas Instruments S4MF06607BSPZQQ1
- Part No.:
- S4MF06607BSPZQQ1
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
S4MF06607BSPZQQ1.pdf
- Description:
- IC MCU 16/32B 640KB FLSH 100LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:150
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S4MF06607BSPZQQ1 from Texas Instruments is an automotive-grade 32-bit ARM Cortex-M3 RISC microcontroller with 640KB flash (ECC-protected), 64KB SRAM (ECC-protected), dual CAN controllers (16/32 mailboxes), and integrated safety features including CPU/SRAM BIST, ECC, and error signaling module (ESM). It operates at up to 80MHz system clock on a single 3.3V supply and targets engine control units, battery management systems, and chassis domain controllers.
For engineers reviewing the S4MF06607BSPZQQ1 datasheet, S4MF06607BSPZQQ1 pinout, S4MF06607BSPZQQ1 application, or S4MF06607BSPZQQ1 equivalent, this page delivers verified technical context, validated pin functions, real-world automotive use cases, and two confirmed alternative parts with documented functional and application-level differences - all grounded in TI's SPNS157C datasheet and PZ-package specifications.
Technical Context
The S4MF06607BSPZQQ1 implements the TMS470M platform architecture with a hardened ARM Cortex-M3 core featuring Memory Protection Unit (MPU), Thumb2 instruction set, and 1.2 DMIPS/MHz efficiency. Its FMzPLL-based clock module supports frequency modulation without external loop filter components and feeds HCLK, GCLK, VCLK, and AVCLK domains for deterministic timing across peripherals.
Peripheral integration includes two MibSPI interfaces (one with 8 chip selects and 64-word parity-protected buffer; second with 4 chip selects and enable pin), two LIN/SCI UARTs supporting LIN 2.1 master mode, and a 16-channel 10-bit MibADC with 64-word FIFO and calibration support. All critical RAM blocks - SRAM, HET, MibSPI, DCAN, and ADC - include parity or SECDED ECC protection.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M3 with MPU, 1.2 DMIPS/MHz, Thumb2 instruction set - enables compact, deterministic real-time code execution. |
| Flash Memory | 640KB total (512KB program + 128KB EEPROM emulation), SECDED ECC - ensures bit-error resilience during over-the-air updates and long-term storage. |
| SRAM | 64KB with SECDED ECC - supports safe data logging and fault-tolerant state retention in ASIL-B applications. |
| CAN Interfaces | Dual DCAN: DCAN1 (16 mailboxes), DCAN2 (32 mailboxes), 1 Mbps max rate - meets automotive distributed control requirements with mailbox-level parity and dedicated error handling. |
| ADC | 10-bit MibADC, 16 input channels, 64-word FIFO with parity, 1.55 µs conversion time - suitable for fast-sampling sensor fusion in motor control loops. |
| Package | 100-pin PZ (plastic quad flatpack), green/lead-free - compatible with standard automotive PCB assembly processes and thermal profiles. |
| Operating Temp | –40°C to 125°C ambient - certified for under-hood automotive environments per AEC-Q100 Grade 1. |
| Safety Features | CPU LBIST, SRAM MBIST, ESM, CRC module, oscillator/PLL monitoring - fulfills diagnostic coverage requirements for ISO 26262 ASIL-B compliance. |
Pinout & Package
Package: 100-pin PZ (plastic quad flatpack), 0.5 mm pitch, RoHS-compliant, green/lead-free finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| HET[0]–HET[15] | High-End Timer I/O | 18 programmable high-resolution channels for PWM generation, capture, or GPIO; supports XOR-share for sub-cycle pulse resolution. |
| CAN1STX / CAN1SRX | DCAN1 Transceiver Interface | Dedicated differential pair for CAN 2.0B communication at up to 1 Mbps; internal pullup on RX, configurable drive strength. |
| CAN2STX / CAN2SRX | DCAN2 Transceiver Interface | Second CAN interface with 32 mailboxes; independent timing and error counters for redundant bus architectures. |
| MIBSPI1CLK / MIBSPI1SOMI / MIBSPI1SIMO | MibSPI1 Serial Interface | Full-duplex synchronous interface with 64-word parity-protected buffer; supports up to 8 chip selects for daisy-chained sensors or actuators. |
| LIN1/SCI1TX / LIN1/SCI1RX | LIN 2.1 Master Interface | Hardware-supported LIN physical layer with automatic sync-break detection and checksum generation - eliminates software overhead in body electronics. |
| ADIN[0]–ADIN[15] | Analog Input Channels | 16 dedicated 10-bit ADC inputs with sample-and-hold; grouped into three configurable sequences triggered by timer, external event, or software. |
| GIOA[4]/INT[4]–GIOA[7]/INT[7] | Dedicated GIO with Interrupt | Four 3.3V-tolerant general-purpose I/O pins with configurable pullup/pulldown and edge-triggered interrupt capability - used for wake-up, fault signaling, or discrete control. |
Key Features
| Feature | Design Value |
|---|---|
| FMzPLL Clock Module | Zero-pin phase-locked loop with built-in clock monitor eliminates external loop filter components and enables robust frequency synthesis in noisy automotive environments. |
| Memory Protection Unit (MPU) | Configurable memory regions with access permission controls - enforces software partitioning for ASIL-B separation of safety-critical and non-safety tasks. |
| Real-Time Interrupt Timer (RTI) | Dedicated timer driven by oscillator clock - provides precise, jitter-free periodic interrupts independent of CPU load for time-triggered scheduling. |
| Digital Watchdog (DWD) | 25-bit resettable decrementing counter with windowed timeout - detects both stuck and runaway firmware states in safety-critical boot and runtime phases. |
| HET XOR-Share Capability | Adjacent high-resolution HET channels can be logically XORed - enables generation of pulses narrower than native HET resolution for advanced motor commutation or lighting control. |
| On-Chip Scan-Based Emulation | IEEE 1149.1 JTAG interface with ICEPick TAP controller - supports boundary scan, flash programming, and real-time debugging without halting CPU operation. |
Applications
| Engine Control Unit (ECU) | Electric Power Steering (EPS) |
|---|---|
|
Use Scenario: Real-time combustion timing, fuel injection sequencing, and knock detection using crank/cam sensor inputs and wideband O2 feedback. IC Role / Device Role / Timing Role: Primary controller executing ASIL-B safety-critical algorithms with dual CAN for communication to transmission and body modules. Use Value: 80MHz deterministic execution, 10-bit MibADC with 1.55 µs conversion, and HET-driven PWM ensure sub-millisecond actuator response and closed-loop control stability. |
Use Scenario: Torque assist calculation, motor position sensing via resolver interface, and fault diagnostics for steering column-mounted EPS motors. IC Role / Device Role / Timing Role: Safety-certified MCU managing torque vectoring, motor current control, and fail-safe torque reduction via CAN FD gateway. Use Value: Dual DCAN with 32-mailbox DCAN2 handles high-bandwidth motor feedback; ECC-protected SRAM retains fault logs across power cycles. |
| Battery Management System (BMS) | Chassis Domain Controller |
|
Use Scenario: Cell voltage monitoring, temperature acquisition, state-of-charge estimation, and contactor control in 48V mild-hybrid battery packs. IC Role / Device Role / Timing Role: Central BMS controller interfacing with analog front-end ICs via MibSPI and communicating pack status via isolated CAN. Use Value: 16-channel MibADC with hardware-calibrated gain/offset supports simultaneous cell monitoring; CRC module validates firmware integrity during OTA updates. |
Use Scenario: Integration of brake-by-wire, suspension damping, and active roll control functions requiring synchronized sensor fusion and actuator coordination. IC Role / Device Role / Timing Role: High-integrity domain controller with RTI-driven time-triggered scheduling and ESM-managed error propagation across subsystems. Use Value: LBIST/MBIST self-tests validate CPU and memory before each safety routine; FMzPLL ensures stable clocking despite engine vibration-induced power noise. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMS570LS0432PZQQ1 | ARM Cortex-R4F core, 1.66 DMIPS/MHz, 384KB flash, 64KB RAM, single DCAN, no HET - higher CPU performance but reduced peripheral count and no high-end timer. | Targeted at ASIL-D applications with lockstep cores; lacks HET for complex PWM generation and has fewer CAN mailboxes for multi-bus architectures. | Select when highest CPU throughput and lockstep redundancy are required over flexible timer/peripheral scalability. |
| TC1797FP-192F150HR | Infineon TriCore™ TC1797, 192MHz, 4MB flash, 256KB RAM, 6x CAN, 2x SENT - different architecture, larger memory, more CAN channels, no integrated LIN master. | Used in high-end powertrain ECUs requiring >100 MIPS and extensive CAN routing; lacks native LIN 2.1 master support and HET-equivalent timing flexibility. | Select for legacy TriCore toolchain compatibility or when >4 CAN channels and >2MB flash are mandatory for feature-rich ECU consolidation. |
Compared with TMS570LS0432PZQQ1 and TC1797FP-192F150HR, the S4MF06607BSPZQQ1 offers optimal balance of ARM Cortex-M3 determinism, HET-based timing precision, dual-CAN mailbox depth, and LIN 2.1 hardware acceleration - making it uniquely suited for mid-tier ASIL-B chassis and electrification controllers where peripheral flexibility outweighs raw MIPS or lockstep requirements.
Availability
S4MF06607BSPZQQ1 is available at Aetrix Electronics and suitable for engine control units, battery management systems, and electric power steering modules requiring stable component supply, long-term automotive lifecycle support, and traceable sourcing.
Supply support for S4MF06607BSPZQQ1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and automotive ICs, with decades of experience delivering high-reliability solutions for mission-critical systems.
The S4MF06607BSPZQQ1 belongs to TI's TMS470M automotive microcontroller family, designed specifically for ASIL-B real-time control applications in powertrain, chassis, and body electronics - emphasizing safety, deterministic timing, and peripheral integration.
FAQ
What is the maximum operating frequency of the S4MF06607BSPZQQ1?
The S4MF06607BSPZQQ1 supports a maximum system clock frequency of 80 MHz when Flash is configured in pipeline mode. This requires enabling the FRDCNTL register bits per the TMS470M Technical Reference Manual. In non-pipeline mode, the maximum clock is 28 MHz. The ARM Cortex-M3 core delivers 1.2 DMIPS/MHz at this speed, enabling deterministic real-time execution for automotive control loops. S4MF06607BSPZQQ1 maintains full functionality across its –40°C to 125°C operating range at 80 MHz.
Does the S4MF06607BSPZQQ1 support LIN 2.1 communication natively?
Yes, the S4MF06607BSPZQQ1 integrates two LIN/SCI modules (LIN1/SCI1 and LIN2/SCI2) with full hardware support for LIN 2.1 master mode, including automatic sync-break generation, checksum calculation, and identifier handling. Each module operates independently and can be configured for either LIN or SCI (UART) mode. This eliminates software overhead for LIN protocol stack implementation and ensures timing accuracy for body electronics networks. S4MF06607BSPZQQ1 does not require external transceivers for basic LIN communication.
How is flash memory protected against bit errors in the S4MF06607BSPZQQ1?
The S4MF06607BSPZQQ1 implements SECDED (Single Error Correction, Double Error Detection) ECC on its entire 640KB Flash array - covering both the 512KB program bank and 128KB EEPROM emulation bank. ECC is applied at the 144-bit word level (128 data + 16 ECC bits), correcting any single-bit error and detecting all double-bit errors in real time during read operations. This protection is active during normal execution, boot, and firmware updates, ensuring data integrity for ASIL-B applications. S4MF06607BSPZQQ1 also supports flash EEPROM emulation with wear leveling managed in firmware.
What safety mechanisms are included in the S4MF06607BSPZQQ1 for ISO 26262 compliance?
The S4MF06607BSPZQQ1 includes LBIST (Logic BIST) for CPU self-test, MBIST (Memory BIST) for SRAM, ESM (Error Signaling Module) for centralized fault reporting, CRC module for data integrity checks, oscillator and PLL clock monitors, and digital watchdog (DWD) with windowed timeout. These mechanisms collectively support diagnostic coverage for ASIL-B applications per ISO 26262. S4MF06607BSPZQQ1 documentation confirms these features are implemented in silicon and validated per TI's automotive qualification process.
Is the S4MF06607BSPZQQ1 pin-compatible with other TMS470M family members?
No, the S4MF06607BSPZQQ1 is not fully pin-compatible with other TMS470M devices due to variant-specific peripheral mappings and pin multiplexing. While it shares the 100-pin PZ package footprint with several family members (e.g., TMS470MF03107), pin functions differ - for example, HET[24]/HET[25] are muxed with TDO/TDI on S4MF06607BSPZQQ1 but assigned differently on other variants. Migration requires board-level verification of signal routing, power domains, and peripheral enable configurations. S4MF06607BSPZQQ1 pinout is defined exclusively in SPNS157C Section 2.2.
S4MF06607BSPZQQ1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 100-LQFP
- Series:
- Hercules™ TMS470M ARM® Cortex®-M3
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 16/32-Bit
- Speed:
- 80MHz
- Connectivity:
- CANbus, LINbus, MibSPI, SCI, UART/USART
- Peripherals:
- POR, WDT
- Number of I/O:
- 49
- Program Memory Size:
- 640KB (640K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.4V ~ 3.6V
- Data Converters:
- A/D 16x10b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S4MF06607BSPZQQ1 FAQ
1.How can I place an order for S4MF06607BSPZQQ1 through Aetrix?
Please submit a Request for Quotation (RFQ) for S4MF06607BSPZQQ1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S4MF06607BSPZQQ1 reliable?
The price and inventory of S4MF06607BSPZQQ1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S4MF06607BSPZQQ1 is usually 5 days.
3.What payment methods are accepted for S4MF06607BSPZQQ1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S4MF06607BSPZQQ1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S4MF06607BSPZQQ1?
S4MF06607BSPZQQ1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S4MF06607BSPZQQ1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S4MF06607BSPZQQ1?
For technical support, including S4MF06607BSPZQQ1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S4MF06607BSPZQQ1 requirements.
6.How does Aetrix verify that S4MF06607BSPZQQ1 is sourced from the original manufacturer or authorized distributors?
All S4MF06607BSPZQQ1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S4MF06607BSPZQQ1 meets industry standards.
7.What is the process for return or replacement of S4MF06607BSPZQQ1?
All S4MF06607BSPZQQ1 units undergo pre-shipment inspection (PSI). If there is an issue with S4MF06607BSPZQQ1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S4MF06607BSPZQQ1 part is unused and in its original packaging.
Return procedure for S4MF06607BSPZQQ1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S4MF06607BSPZQQ1 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
