Texas Instruments S5LS10106ASPGEQQ1
- Part No.:
- S5LS10106ASPGEQQ1
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
S5LS10106ASPGEQQ1.pdf
- Description:
- IC MCU 16/32BIT 1MB FLSH 144LQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
S5LS10106ASPGEQQ1 from Texas Instruments is a safety-certified 16/32-bit RISC Flash microcontroller featuring dual ARM® Cortex™-R4F CPUs in lockstep, 1-MB flash with ECC, 128-KB SRAM with ECC, and operation up to 140 MHz. It delivers >220 DMIPS for real-time control in automotive safety-critical systems such as electronic power steering and brake control units.
For engineers reviewing the S5LS10106ASPGEQQ1 datasheet, S5LS10106ASPGEQQ1 pinout, S5LS10106ASPGEQQ1 application, or S5LS10106ASPGEQQ1 equivalent, key selection considerations include ASIL-D compliance support, FlexRay/CAN/LIN interface count, NHET timer channel availability, and PGE package pin compatibility with legacy TMS570 designs.
Technical Context
The S5LS10106ASPGEQQ1 implements a lockstep dual-core architecture with CPU and memory BIST, ECC on flash and SRAM, and parity on peripheral memories - all coordinated by an Error Signaling Module (ESM) with dedicated error pin. Its FMzPLL-based clock system supports frequency modulation and includes oscillator/PLL monitoring for fail-safe timing integrity.
It integrates three MibSPI interfaces (128 buffers each, parity protected), two LIN/UART controllers, three DCAN controllers (two with 64 mailboxes, one with 32), and a dual-channel FlexRay controller with 8-KB message RAM. The 32-channel NHET and dual 12-bit MibADCs (24 total inputs, 64-word parity buffers each) are managed via dedicated transfer units with MPU protection.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-R4F dual-core in lockstep, enabling ASIL-D compliance per ISO 26262. |
| Max Clock Speed | 140 MHz system clock - enables deterministic real-time execution with >220 DMIPS performance. |
| Flash Memory | 1-MB on-chip flash with SECDED ECC - supports safe program storage and field updates without corruption risk. |
| RAM | 128-KB SRAM with SECDED ECC - provides fault-tolerant data workspace for safety-critical variables. |
| Communication Interfaces | 3× DCAN (CAN 2.0B), 2× LIN/UART, 3× MibSPI, 2× FlexRay channels - meets automotive domain controller I/O requirements. |
| Analog Peripherals | Two 12-bit MibADCs with 24 total input channels and 64-word parity-protected buffers - supports sensor fusion in chassis control. |
| Package | 144-pin QFP (PGE) - provides 68 peripheral I/O pins including 8 dedicated GIO with interrupt capability. |
Pinout & Package
144-pin Quad Flat Pack (PGE), green RoHS-compliant package with 0.5-mm pitch; thermal pad exposed on underside for enhanced heat dissipation in automotive under-hood environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCIO | I/O Supply Voltage | 3.3-V supply for all digital I/O banks - ensures compatibility with automotive 3.3-V logic domains and CAN transceivers. |
| VCC | Core Supply Voltage | 1.5-V core supply - powers Cortex-R4F CPU and internal logic at optimal voltage for 140-MHz operation. |
| RST / PORRST | Reset Input / Power-On Reset | Dual-reset architecture enables both external asynchronous reset and internal brown-out detection for robust startup sequencing. |
| OSCIN / OSCOUT | Crystal Oscillator Interface | Supports external crystal (typically 20 MHz) for precise clock source - feeds FMzPLL for jitter-controlled system timing. |
| GIOA[7:0] | Dedicated General-Purpose I/O | 8-pin bank with configurable pull-up/down and external interrupt capability - used for critical status signaling or switch inputs. |
| MIBSPI1SIMO / SOMI / CLK | MibSPI Master Data Out/In, Clock | Full-duplex synchronous serial interface supporting daisy-chain sensor communication with hardware CRC and parity. |
| CAN1TX / CAN1RX | CAN Controller Transceiver Interface | Direct connection to external CAN transceiver - supports 1-Mbps automotive CAN FD-ready physical layer integration. |
| FRAYTX1 / FRAYRX1 | FlexRay Channel 1 Transmit/Receive | High-speed deterministic bus interface - enables time-triggered communication for x-by-wire applications. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-lockstep Cortex-R4F CPU | Hardware-level redundancy with continuous comparison - eliminates single-point failures in safety-critical control loops. |
| SECDED ECC on Flash & SRAM | Corrects single-bit errors and detects double-bit errors in real time - prevents silent data corruption during runtime. |
| 32-channel NHET with Transfer Unit | Programmable high-resolution timing engine with MPU-protected DMA transfers - enables precise PWM generation for motor drives. |
| Two 12-bit MibADCs (24 ch) | Simultaneous sampling with shared channel arbitration - supports multi-sensor acquisition for vehicle dynamics estimation. |
| Error Signaling Module (ESM) | Configurable fault response (interrupt + ERROR pin assertion) - enables immediate system-level failure containment per ASIL-D requirements. |
Applications
| Electronic Power Steering (EPS) | Brake Control Unit (BCU) |
|---|---|
Use Scenario: Real-time torque assist calculation and motor current control under varying road loads and temperature conditions. IC Role / Device Role / Timing Role: Primary safety controller executing ASIL-D software with lockstep CPU verification and ESM-monitored fault handling. Use Value: Dual-core lockstep and ECC memory ensure uninterrupted motor actuation even during transient radiation events in engine compartments. |
Use Scenario: Coordinating hydraulic pressure modulation across four wheel circuits during ABS and ESC interventions. IC Role / Device Role / Timing Role: Central domain controller managing CAN/FlexRay comms, ADC sampling of pressure sensors, and NHET-driven solenoid timing. Use Value: 32-channel NHET delivers sub-microsecond solenoid pulse accuracy; dual MibADCs enable synchronized pressure feedback from all four corners. |
| Transmission Control Module (TCM) | Advanced Driver Assistance Systems (ADAS) Sensor Fusion Hub |
Use Scenario: Closed-loop shift scheduling using engine torque, turbine speed, and gear position feedback with fail-operational behavior. IC Role / Device Role / Timing Role: Safety-certified MCU running transmission control algorithms with EMIF-connected external NVM for adaptive learning parameters. Use Value: Parameter Overlay Module (POM) allows runtime parameter updates via EMIF without flash reprogramming - reducing calibration cycle time. |
Use Scenario: Aggregating radar, camera, and ultrasonic sensor data for object tracking and path prediction in L2+ systems. IC Role / Device Role / Timing Role: Real-time sensor preprocessor with MibSPI-linked radar MMICs and LIN-connected ultrasonic transducers. Use Value: Three MibSPI interfaces (128 buffers each) handle concurrent high-bandwidth radar frame streaming while maintaining LIN diagnostics bandwidth. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar safety microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMS570LS10206APZQQ1 | 337-pin BGA (ZWT) package; 160-MHz max clock; 2-MB flash; 160-KB RAM; 32 NHET channels. | Higher memory and performance margin; requires PCB redesign due to BGA footprint and thermal management. | Select when additional flash/RAM headroom or higher clock speed is required for future software expansion. |
| S5LS10116ASPGEQQ1 | Same PGE package; identical 1-MB flash/128-KB RAM; but includes EMIF and ETM trace support. | Enables external memory expansion and full instruction trace - critical for complex AUTOSAR OS debugging. | Choose when external memory interfacing or deep debug visibility is mandatory for certification evidence. |
Compared with S5LS10106ASPGEQQ1, the TMS570LS10206APZQQ1 offers higher performance and memory in BGA form, while the S5LS10116ASPGEQQ1 adds EMIF and ETM for trace-enabled development - both require design validation but provide distinct scalability paths for ASIL-D systems.
Availability
S5LS10106ASPGEQQ1 is available at Aetrix Electronics and suitable for automotive chassis control, brake-by-wire systems, and electronic power steering requiring stable component supply across extended production lifecycles.
Supply support for S5LS10106ASPGEQQ1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies for automotive, industrial, and communications markets.
The TMS570LS series was engineered specifically for ISO 26262 ASIL-D automotive safety applications, integrating lockstep cores, memory ECC, and diagnostic peripherals into a unified safety platform.
FAQ
Is S5LS10106ASPGEQQ1 qualified for automotive safety applications?
Yes, S5LS10106ASPGEQQ1 is designed to meet ISO 26262 ASIL-D requirements. It features dual lockstep Cortex-R4F CPUs, ECC on flash and SRAM, CPU and memory BIST, and an Error Signaling Module with external error pin - all documented in TI's functional safety documentation package for the TMS570LS family. S5LS10106ASPGEQQ1 implements these features at silicon level to support systematic and random hardware fault mitigation.
What is the maximum operating frequency of S5LS10106ASPGEQQ1?
The S5LS10106ASPGEQQ1 operates at up to 140 MHz system clock frequency. This is confirmed in Table 2-2 of the SPNS141G datasheet, which lists "140MHz" under the Speed column for the TMS570LS10106 variant in PGE package. The device achieves >220 DMIPS at this speed using the ARM Cortex-R4F core's 1.6 DMIPS/MHz efficiency.
Does S5LS10106ASPGEQQ1 support FlexRay communication?
Yes, S5LS10106ASPGEQQ1 includes a dual-channel FlexRay controller with 8-KB message RAM and dedicated FlexRay Transfer Unit (FTU). The functional block diagram and Table 2-2 confirm FlexRay support for all TMS570LS101xx variants, including S5LS10106ASPGEQQ1. Both FRAYTX1/FRAYRX1 and FRAYTX2/FRAYRX2 pins are assigned in the PGE package pinout.
How many CAN controllers does S5LS10106ASPGEQQ1 integrate?
S5LS10106ASPGEQQ1 integrates three DCAN controllers compliant with CAN 2.0B protocol. As specified in Table 2-2 and Section 1.1, two controllers support 64 mailboxes each and one supports 32 mailboxes - all with parity-protected mailbox RAM. This configuration enables simultaneous communication with powertrain, chassis, and body networks.
What package type is used for S5LS10106ASPGEQQ1?
S5LS10106ASPGEQQ1 uses a 144-pin Quad Flat Pack (PGE) package, as indicated by the "PGE" suffix in the part number and confirmed in Table 2-2 of the datasheet. This RoHS-compliant green QFP has 0.5-mm pitch and exposes a thermal pad on the underside for thermal management in automotive under-hood applications.
S5LS10106ASPGEQQ1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 144-LQFP
- Series:
- Hercules™ TMS570 ARM® Cortex®-R
- Packaging:
- Tray
- Product Status:
- Not For New Designs
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-R4F
- Core Size:
- 16/32-Bit
- Speed:
- 140MHz
- Connectivity:
- CANbus, LINbus, SCI, SPI, UART/USART
- Peripherals:
- DMA, POR
- Number of I/O:
- 68
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.35V ~ 1.65V
- Data Converters:
- A/D 20x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S5LS10106ASPGEQQ1 FAQ
1.How can I place an order for S5LS10106ASPGEQQ1 through Aetrix?
Please submit a Request for Quotation (RFQ) for S5LS10106ASPGEQQ1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S5LS10106ASPGEQQ1 reliable?
The price and inventory of S5LS10106ASPGEQQ1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S5LS10106ASPGEQQ1 is usually 5 days.
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Once your S5LS10106ASPGEQQ1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S5LS10106ASPGEQQ1?
For technical support, including S5LS10106ASPGEQQ1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S5LS10106ASPGEQQ1 requirements.
6.How does Aetrix verify that S5LS10106ASPGEQQ1 is sourced from the original manufacturer or authorized distributors?
All S5LS10106ASPGEQQ1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S5LS10106ASPGEQQ1 meets industry standards.
7.What is the process for return or replacement of S5LS10106ASPGEQQ1?
All S5LS10106ASPGEQQ1 units undergo pre-shipment inspection (PSI). If there is an issue with S5LS10106ASPGEQQ1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S5LS10106ASPGEQQ1 part is unused and in its original packaging.
Return procedure for S5LS10106ASPGEQQ1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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