Texas Instruments S5LS20206ASGWTMEP

Overview

S5LS20206ASGWTMEP from Texas Instruments is a radiation-hardened, aerospace-grade 16/32-bit RISC Flash microcontroller based on the ARM® Cortex™-R4F dual-lockstep CPU, delivering 256 DMIPS at 160 MHz with 2 MB flash (ECC), 160 KB SRAM (ECC), and integrated safety features including CPU BIST, memory ECC, and Error Signaling Module (ESM). It targets high-integrity real-time control in flight computers, engine control units, and satellite power management systems.

For engineers reviewing the S5LS20206ASGWTMEP datasheet, S5LS20206ASGWTMEP pinout, S5LS20206ASGWTMEP application, or S5LS20206ASGWTMEP equivalent, this page delivers verified technical context, exact package mapping (337-pin NFBGA, GWT), confirmed peripheral counts (3 CAN, 3 MibSPI, 2 LIN/UART, 32 NHET channels, 24 ADC inputs), and validated alternative parts for defense and aerospace design continuity.

Technical Context

The S5LS20206ASGWTMEP implements dual ARM Cortex-R4F CPUs in lockstep with hardware-level fault detection, FMzPLL-based clock generation with oscillator and PLL monitoring, and dedicated safety modules including ESM, CRC (2 channels), and voltage monitor (VMON) with out-of-range reset assertion. Its memory subsystem enforces SECDED ECC on 2 MB flash and 160 KB SRAM, while parity protection extends to peripheral memories (MibSPI buffers, DCAN mailboxes, MibADC RAM).

Peripheral architecture includes three multi-buffered SPI interfaces (each with 128 parity-protected buffers and 4 chip selects), two LIN/UART controllers compliant with LIN 2.0, three DCAN controllers supporting CAN 2.0B at up to 1 Mbps, and a 32-channel High-End Timer (NHET) with 128-word parity-protected RAM and autonomous transfer unit (HTU) featuring built-in MPU. The device supports external memory via a 16-bit EMIF with 22-bit addressing and 4 chip selects.

Key Specifications

Pinout & Package

337-pin NFBGA (GWT) package, 16 mm × 16 mm body, 0.8 mm ball pitch, RoHS-compliant, designed for high-reliability aerospace PCB assembly with controlled impedance routing and thermal vias under die.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-integrity microcontroller applications.

Compared with TMS570LS20216-EP, S5LS20206ASGWTMEP removes FlexRay hardware to reduce cost and power while retaining identical CPU, memory, CAN, and ADC capabilities; versus SPC574K72E5, it offers superior real-time timer precision (NHET vs eDMA), aerospace qualification, and LIN/UART integration but requires ARM toolchain adoption.

Availability

S5LS20206ASGWTMEP is available at Aetrix Electronics and suitable for flight control computers, engine control units, and satellite power management systems requiring stable component supply across extended product lifecycles and extreme temperature operation.

Supply support for S5LS20206ASGWTMEP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and digital signal processing technologies, with deep expertise in high-reliability aerospace and defense ICs.

The TMS570LS series was designed specifically for safety-critical real-time control in aerospace and defense systems, emphasizing lockstep CPU redundancy, comprehensive memory protection, and qualification to GEIA-STD-00021-1 across –55°C to +125°C.

FAQ

What is the maximum operating frequency of the S5LS20206ASGWTMEP?

The S5LS20206ASGWTMEP operates at up to 160 MHz system clock frequency, enabling 256 DMIPS performance from its dual ARM Cortex-R4F lockstep CPUs. This frequency is validated across the full –55°C to +125°C temperature range and supported by the FMzPLL clock module with integrated monitoring. The S5LS20206ASGWTMEP maintains this rating under all specified supply conditions (VCC = 1.5 V, VCCIO = 3.3 V).

Does the S5LS20206ASGWTMEP include FlexRay controller support?

No, the S5LS20206ASGWTMEP does not include FlexRay controller hardware. While the TMS570LS20216-EP variant integrates a dual-channel FlexRay controller, the S5LS20206ASGWTMEP silicon omits this block to reduce cost and power consumption. All other peripherals-including three DCAN controllers, three MibSPI interfaces, and two LIN/UART modules-remain fully functional in the S5LS20206ASGWTMEP.

How many CAN controllers are integrated into the S5LS20206ASGWTMEP?

The S5LS20206ASGWTMEP integrates three DCAN controllers compliant with CAN 2.0B protocol, supporting data rates up to 1 Mbps. DCAN1 and DCAN2 each provide 64 mailboxes with parity-protected RAM, while DCAN3 provides 32 mailboxes. All three controllers operate independently and support bus-off recovery, automatic retransmission, and error frame generation as defined in ISO 11898-1.

What safety certifications apply to the S5LS20206ASGWTMEP?

The S5LS20206ASGWTMEP is certified to GEIA-STD-00021-1 for Aerospace Qualified Electronic Components and tested for operation over the military temperature range (–55°C to +125°C). It incorporates hardware safety mechanisms including dual-lockstep CPU execution, SECDED ECC on flash and SRAM, parity on peripheral memories, CPU and memory BIST, and an Error Signaling Module (ESM) with external error pin-enabling compliance with IEC 61508 SIL3 when implemented per TI's safety manual.

What package type and pin count does the S5LS20206ASGWTMEP use?

The S5LS20206ASGWTMEP uses a 337-pin NFBGA package designated GWT, with 16 mm × 16 mm body size and 0.8 mm ball pitch. This package supports 115 total peripheral I/O pins, including 16 dedicated GIO pins, and is optimized for high-reliability aerospace PCB assembly with thermal vias and controlled impedance routing requirements.