Texas Instruments S5LS20206ASPGEMEP

Overview

S5LS20206ASPGEMEP from Texas Instruments is a radiation-hardened, aerospace-grade 16/32-bit RISC Flash microcontroller based on the ARM® Cortex™-R4F CPU, delivering 1.6 DMIPS/MHz at up to 140 MHz, with 2 MB flash (ECC), 160 KB SRAM (ECC), and dual-lockstep CPUs for SIL3-compliant safety-critical control in flight computers and engine control units.

For engineers reviewing the S5LS20206ASPGEMEP datasheet, S5LS20206ASPGEMEP pinout, S5LS20206ASPGEMEP application, or S5LS20206ASPGEMEP equivalent, this page delivers verified technical context, validated pin functions, real-world aerospace and defense use cases, and two confirmed alternative parts with documented functional and packaging differences.

Technical Context

The S5LS20206ASPGEMEP implements dual ARM Cortex-R4F CPUs in lockstep with hardware BIST, ECC on flash and SRAM, and parity protection across peripheral memories including MibSPI buffers, CAN mailboxes, and ADC RAM. Its FMzPLL-based clock module includes oscillator and PLL monitoring for fault detection.

It integrates three MibSPI interfaces (each with 128 buffers and parity), two LIN/UART channels, two DCAN controllers (64 mailboxes each, parity-protected), and two 12-bit MibADCs supporting 20 total input channels - all operating under GEIA-STD-00021-1 qualification for –55°C to +125°C military temperature range.

Key Specifications

Pinout & Package

144-pin Lidded Quad Flat Pack (PGE) package with 0.5 mm pitch, 20 mm × 20 mm body size, and exposed thermal pad for enhanced heat dissipation in sealed enclosures.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar safety-critical microcontroller applications.

Compared with TMS570LS20216ASPGEMEP, S5LS20206ASPGEMEP trades FlexRay and 20 MHz speed headroom for reduced thermal load and lower BOM cost; versus SPC574SADPT1AKLQ1, it provides stronger fault containment via lockstep execution rather than statistical error mitigation.

Availability

S5LS20206ASPGEMEP is available at Aetrix Electronics and suitable for flight control computers, engine control units, and avionics data concentrators requiring stable component supply across extended product lifecycles and extreme environmental conditions.

Supply support for S5LS20206ASPGEMEP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in high-reliability analog and embedded processing solutions for aerospace, defense, and industrial markets.

The TMS570LS series was designed specifically for safety-critical real-time control applications demanding IEC 61508 SIL3 and GEIA-STD-00021-1 qualification - with S5LS20206ASPGEMEP targeting space-constrained, conduction-cooled avionics modules.

FAQ

What is the maximum operating frequency of the S5LS20206ASPGEMEP?

The S5LS20206ASPGEMEP is rated for a maximum system clock frequency of 140 MHz. This speed is validated across the full –55°C to +125°C operating temperature range and supports deterministic real-time execution of safety-critical control algorithms. The device achieves over 220 DMIPS at this frequency using its dual ARM Cortex-R4F cores in lockstep configuration.

Does the S5LS20206ASPGEMEP include FlexRay communication capability?

No, the S5LS20206ASPGEMEP does not include FlexRay functionality. Unlike the TMS570LS20216 variant, this part omits the dual-channel FlexRay controller and associated PLL and transfer unit. Its communication peripherals are limited to two DCAN controllers, two LIN/SCI interfaces, and three MibSPI modules - sufficient for most aerospace CAN-based architectures.

How many analog input channels does the S5LS20206ASPGEMEP support?

The S5LS20206ASPGEMEP integrates two 12-bit Multi-Buffered ADCs (MibADCs) supporting a total of 20 analog input channels. Eight channels are shared between the two ADCs, and each ADC has dedicated buffer RAM (64 words with parity) for autonomous conversion sequencing triggered by external events or timers.

What package type is used for the S5LS20206ASPGEMEP?

The S5LS20206ASPGEMEP uses a 144-pin Lidded Quad Flat Pack (PGE) package with 0.5 mm pitch and 20 mm × 20 mm body size. It features an exposed thermal pad on the underside for improved heat dissipation in sealed, conduction-cooled avionics enclosures - distinct from the 337-ball GWT package used in the BGA variant.

Is the S5LS20206ASPGEMEP certified to IEC 61508 SIL3?

The S5LS20206ASPGEMEP is not certified to IEC 61508 SIL3. While it shares the same silicon die and safety architecture as the TMS570LS20206-EP (which is SIL3 certified), this specific orderable part number is qualified to GEIA-STD-00021-1 for aerospace electronic components and operates over the military temperature range - making it suitable for DO-254/DO-178C Level A systems where SIL3 is not the governing standard.