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Texas Instruments S5LS20206ASPGEQQ1
- Part No.:
- S5LS20206ASPGEQQ1
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
S5LS20206ASPGEQQ1.pdf
- Description:
- IC MCU 16/32BIT 2MB FLSH 144LQFP
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
S5LS20206ASPGEQQ1 from Texas Instruments is a safety-certified 16/32-bit RISC Flash microcontroller featuring dual ARM® Cortex™-R4F CPUs in lockstep, 2MB Flash with ECC, 160KB SRAM with ECC, and operation up to 160 MHz. It delivers 256+ DMIPS for real-time automotive control tasks requiring ASIL-D compliance, including brake-by-wire and steering control systems.
For engineers reviewing the S5LS20206ASPGEQQ1 datasheet, S5LS20206ASPGEQQ1 pinout, S5LS20206ASPGEQQ1 application, or S5LS20206ASPGEQQ1 equivalent, key selection criteria include lockstep CPU redundancy, FMzPLL clock monitoring, FlexRay dual-channel support, and ESM-triggered error signaling - all validated for ISO 26262 functional safety workflows.
Technical Context
The S5LS20206ASPGEQQ1 implements a dual-core lockstep architecture where both Cortex-R4F cores execute identical instructions with cycle-synchronized comparison logic; any divergence triggers an ESM fault interrupt. Its FMzPLL-based clock module includes oscillator and PLL monitoring, while the Error Signaling Module (ESM) routes faults to a dedicated ERROR pin and internal interrupt vector.
Memory subsystems enforce safety via ECC on 2MB Flash and 160KB SRAM, parity on peripheral RAM (e.g., DCAN mailboxes, NHET RAM, MibSPI buffers), and built-in self-test (BIST) for CPU and memory. Peripheral interfaces-including three MibSPIs (128 buffers each), two LIN/UARTs, three DCAN controllers (64/64/32 mailboxes), and dual-channel FlexRay-operate under MPU-protected DMA transfers with parity-protected control packets.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual ARM Cortex-R4F in lockstep; enables ASIL-D fault detection via hardware comparison of instruction execution and data paths. |
| Max Clock Speed | 160 MHz system clock; supports >256 DMIPS real-time processing for deterministic control loops in safety-critical applications. |
| Flash Memory | 2MB with SECDED ECC; allows safe in-field firmware updates and prevents silent data corruption in automotive environments. |
| SRAM | 160KB with SECDED ECC; provides protected working memory for runtime variables, stack, and safety-critical buffers. |
| Communication Interfaces | 3× MibSPI (128 buffers, parity), 3× DCAN (64/64/32 mailboxes), 2× LIN/UART, 2× FlexRay channels; meets automotive domain controller I/O requirements. |
| Timers & ADC | 32-channel NHET + 2× 12-bit MibADC (24 total inputs, 64-word parity buffers); enables precise sensor sampling and actuator timing for chassis control. |
| Package | 144-pin QFP (PGE); supports industrial-grade thermal dissipation and PCB-level trace routing for EMI-sensitive automotive modules. |
Pinout & Package
144-pin Quad Flat Pack (PGE), green RoHS-compliant package with 0.5 mm pitch and exposed thermal pad. Pinout defined per TI SPNS141G Rev. October 2018, Section 2.4–2.5.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCP1 | Flash Pump Supply | Provides regulated 3.3V for Flash program/erase operations; must be externally decoupled to ensure reliable nonvolatile memory writes. |
| OSCIN / OSCOUT | Crystal Oscillator Interface | Accepts 4–20 MHz external crystal; feeds FMzPLL for jitter-tolerant clock generation with built-in oscillator failure detection. |
| RST / PORRST | Reset Control Inputs | Asynchronous reset assertion (RST) and power-on reset (PORRST) enable deterministic initialization and brownout recovery per ISO 26262 requirements. |
| ERROR | Error Signaling Output | Active-low open-drain output driven by ESM on detected fault; connects directly to system watchdog or fail-safe controller without level-shifting. |
| GIOA[7:0] | Dedicated General-Purpose I/O | 8 pins with configurable pull-up/down and external interrupt capability; used for discrete sensor inputs, status LEDs, or safety interlock signals. |
| MIBSPI1SIMO / SOMI / CLK | MibSPI Master Interface | Full-duplex serial interface supporting 128-buffer FIFOs with parity; enables high-throughput communication with radar or camera sensors. |
| CAN1RX / CAN1TX | Controller Area Network Channel 1 | Complies with ISO 11898-1 (CAN 2.0B); supports 1 Mbps bus rate with 64 mailbox RAM (parity-protected) for message filtering and prioritization. |
| FRAYTX1 / FRAYRX1 | FlexRay Channel 1 Transmit/Receive | Supports 10 Mbps deterministic time-triggered communication; integrated FTU with MPU ensures autonomous, safety-isolated data transfers to/from main memory. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-CPU Lockstep Execution | Hardware-enforced instruction and data path comparison detects transient or permanent faults in <1 µs, satisfying ASIL-D diagnostic coverage requirements. |
| ECC on Flash & SRAM | Single-bit correction and double-bit detection prevents silent data corruption in program code and runtime variables across temperature and radiation stress. |
| FMzPLL Clock Monitoring | Independent oscillator and PLL failure detection circuitry asserts ESM fault before clock instability affects control loop timing integrity. |
| ESM with External ERROR Pin | Configurable fault response (interrupt + ERROR pin assert) enables immediate system-level fail-safe action without CPU intervention. |
| Parity-Protected Peripheral RAM | DCAN mailbox RAM, NHET timer RAM, and MibSPI buffer RAM all include parity bits - verified on access to prevent corrupted message handling. |
| MPU-Protected DMA Transfers | DMA channels enforce memory region access rules via dedicated MPU; prevents accidental overwrites of safety-critical data structures during burst transfers. |
Applications
| Brake-by-Wire Control Unit | Electric Power Steering (EPS) |
|---|---|
Use Scenario: Real-time hydraulic pressure modulation and motor torque control in distributed brake systems with redundant sensor fusion. IC Role / Device Role / Timing Role: Primary safety controller executing ASIL-D brake actuation algorithms with lockstep CPU validation and ESM-driven fail-safe shutdown. Use Value: 160 MHz deterministic execution and dual-channel FlexRay enable sub-100 µs end-to-end latency for emergency braking commands. |
Use Scenario: Torque assist calculation and motor phase control using torque sensor, vehicle speed, and steering angle inputs. IC Role / Device Role / Timing Role: Safety-certified MCU managing motor current loops, fault diagnostics, and CAN/FlexRay gateway functions. Use Value: 2× 12-bit MibADC (24 channels) with 64-word parity buffers support simultaneous sampling of 6+ analog sensors at 100 kSPS with error detection. |
| Advanced Driver Assistance Systems (ADAS) Domain Controller | Transmission Control Module (TCM) |
Use Scenario: Sensor fusion hub aggregating radar, camera, and ultrasonic data for adaptive cruise and lane-keeping functions. IC Role / Device Role / Timing Role: High-bandwidth peripheral orchestrator interfacing with multiple MibSPI sensors and routing data via CAN/FlexRay to central ECU. Use Value: Three MibSPI interfaces (128 buffers each, parity-protected) sustain >20 MB/s aggregate sensor throughput without CPU overhead. |
Use Scenario: Closed-loop control of solenoid valves, clutch engagement, and gear shifting based on engine load, RPM, and temperature. IC Role / Device Role / Timing Role: Real-time deterministic controller executing transmission state machine with NHET-driven PWM outputs and CAN diagnostics. Use Value: 32-channel NHET with 128-word parity RAM enables precise 10 ns resolution timing for 8+ independent solenoid drivers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar safety microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMS570LS20216ZWTQQ1 | 337-pin BGA package; 32 NHET channels; 24 ADC inputs; EMIF and ETM enabled; higher I/O count (115 pins). | Required for designs needing external memory expansion (EMIF) or full instruction trace (ETM) in space-constrained layouts. | Select when board layout supports BGA and system requires >68 I/Os or external memory mapping. |
| S5LS10206ASPGEQQ1 | 1MB Flash (vs. 2MB), 128KB SRAM (vs. 160KB), no FlexRay, 20 ADC inputs, 25 NHET channels. | Targeted at cost-optimized ASIL-B/C applications where dual-channel FlexRay and maximum memory are not required. | Choose for reduced-feature safety MCUs where BOM cost reduction outweighs FlexRay and memory headroom needs. |
Compared with S5LS20206ASPGEQQ1, TMS570LS20216ZWTQQ1 offers greater I/O density and external memory capability but requires BGA assembly; S5LS10206ASPGEQQ1 reduces Flash/SRAM and removes FlexRay to lower cost and complexity for less demanding ASIL-B systems.
Availability
S5LS20206ASPGEQQ1 is available at Aetrix Electronics and suitable for automotive brake-by-wire systems, electric power steering modules, and ADAS domain controllers requiring stable component supply and long-term lifecycle assurance.
Supply support for S5LS20206ASPGEQQ1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies with deep expertise in automotive functional safety solutions.
The TMS570LS series was designed specifically for ASIL-D automotive safety applications, integrating lockstep CPUs, ECC memory, and hardware self-test to meet ISO 26262 requirements without external safety monitors.
FAQ
What safety certifications apply to the S5LS20206ASPGEQQ1?
The S5LS20206ASPGEQQ1 is qualified per AEC-Q100 Grade 1 and supports ISO 26262 ASIL-D development workflows. Its dual-lockstep CPU, ECC memory, ESM, and BIST logic are architecturally aligned with ASIL-D requirements, though final certification depends on system-level integration and tool qualification. TI provides safety manuals and FMEDA reports for S5LS20206ASPGEQQ1 to support customer certification efforts.
Does the S5LS20206ASPGEQQ1 support external memory expansion?
No, the S5LS20206ASPGEQQ1 does not support the External Memory Interface (EMIF). EMIF is only available on ZWT-package variants (e.g., TMS570LS20216ZWTQQ1). The S5LS20206ASPGEQQ1 uses the PGE package and omits EMIF signals - all required code and data must reside within its on-chip 2MB Flash and 160KB SRAM.
How many CAN controllers does the S5LS20206ASPGEQQ1 include, and what are their mailbox counts?
The S5LS20206ASPGEQQ1 integrates three DCAN controllers: DCAN1 and DCAN2 each provide 64 mailboxes with parity protection, while DCAN3 provides 32 mailboxes. All support CAN 2.0B protocol at up to 1 Mbps and include dedicated RAM with parity for message storage and filtering.
Is the S5LS20206ASPGEQQ1 pin-compatible with other TMS570LS family members?
The S5LS20206ASPGEQQ1 shares the 144-pin PGE package footprint with S5LS10206ASPGEQQ1 and S5LS10106ASPGEQQ1, but pin functions differ across variants due to feature enablement (e.g., FlexRay, EMIF, ETM). Direct replacement requires verification of signal mapping, power domains, and peripheral enablement - it is not a drop-in substitute for ZWT-package or higher-feature PGE variants.
What debug and trace capabilities are available on the S5LS20206ASPGEQQ1?
The S5LS20206ASPGEQQ1 includes IEEE 1149.1 JTAG, ARM CoreSight components, and an Embedded Trace Macrocell (ETM) supporting instruction and data trace. However, ETM is limited to 32-bit trace width and lacks the full 16-bit RTP or DMM features found in ZWT variants - trace bandwidth and external instrumentation capability are reduced relative to larger-package versions.
S5LS20206ASPGEQQ1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 144-LQFP
- Series:
- Hercules™ TMS570 ARM® Cortex®-R
- Packaging:
- Tray
- Product Status:
- Not For New Designs
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-R4F
- Core Size:
- 16/32-Bit
- Speed:
- 140MHz
- Connectivity:
- CANbus, LINbus, SCI, SPI, UART/USART
- Peripherals:
- DMA, POR
- Number of I/O:
- 68
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 160K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.35V ~ 1.65V
- Data Converters:
- A/D 20x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S5LS20206ASPGEQQ1 FAQ
1.How can I place an order for S5LS20206ASPGEQQ1 through Aetrix?
Please submit a Request for Quotation (RFQ) for S5LS20206ASPGEQQ1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S5LS20206ASPGEQQ1 reliable?
The price and inventory of S5LS20206ASPGEQQ1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S5LS20206ASPGEQQ1 is usually 5 days.
3.What payment methods are accepted for S5LS20206ASPGEQQ1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S5LS20206ASPGEQQ1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S5LS20206ASPGEQQ1?
S5LS20206ASPGEQQ1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S5LS20206ASPGEQQ1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S5LS20206ASPGEQQ1?
For technical support, including S5LS20206ASPGEQQ1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S5LS20206ASPGEQQ1 requirements.
6.How does Aetrix verify that S5LS20206ASPGEQQ1 is sourced from the original manufacturer or authorized distributors?
All S5LS20206ASPGEQQ1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S5LS20206ASPGEQQ1 meets industry standards.
7.What is the process for return or replacement of S5LS20206ASPGEQQ1?
All S5LS20206ASPGEQQ1 units undergo pre-shipment inspection (PSI). If there is an issue with S5LS20206ASPGEQQ1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S5LS20206ASPGEQQ1 part is unused and in its original packaging.
Return procedure for S5LS20206ASPGEQQ1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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