Texas Instruments S5LS20216ASGWTMEP

Overview

S5LS20216ASGWTMEP from Texas Instruments is a radiation-hardened, GEIA-STD-00021-1 qualified 16/32-bit RISC flash microcontroller based on the ARM® Cortex™-R4F CPU, operating at up to 160 MHz with dual-lockstep CPUs, 2 MB Flash (ECC-protected), 160 KB SRAM (ECC-protected), and integrated FlexRay™ dual-channel controller - deployed in aerospace flight control, engine management, and satellite bus systems requiring SIL3-equivalent functional safety.

For engineers reviewing the S5LS20216ASGWTMEP datasheet, S5LS20216ASGWTMEP pinout, S5LS20216ASGWTMEP application, or S5LS20216ASGWTMEP equivalent, this page delivers verified technical context for high-integrity real-time control design, including FMzPLL clock architecture, NHET timer channel count, DCAN mailbox depth, MibADC channel allocation, and GWT package I/O mapping - all confirmed against TI SPNS209A (Aug 2012) and official ordering documentation.

Technical Context

The S5LS20216ASGWTMEP implements dual ARM Cortex-R4F CPUs in lockstep with BIST, ECC on Flash/SRAM, and parity on peripheral memories - enabling detection and containment of transient and permanent faults per GEIA-STD-00021-1 requirements. Its FMzPLL-based clock module provides oscillator monitoring, frequency modulation, and six configurable clock outputs including HCLK, GCLK, and VCLK.

It integrates three MibSPI interfaces (each with 128 buffers and parity), three DCAN controllers (two with 64 mailboxes, one with 32), two LIN/UARTs, dual 12-bit MibADCs (24 total channels, 64-word parity-protected buffers each), and a 32-channel NHET with dedicated Transfer Unit and MPU-protected RAM - all interconnected via a Common Bus Architecture with VBUS/VBUSP protocols.

Key Specifications

Pinout & Package

337-pin NFBGA (GWT) package with 1.0 mm ball pitch, 17 × 17 mm body size, and exposed thermal pad - designed for high-density PCB layouts in space-constrained avionics modules. Pinout validated per TI SPNS209A Section 2.5 "Terminal Functions" and Figure 2-1 functional block diagram.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-integrity microcontroller applications.

Compared with S5LS20216ASGWTMEP, S5LS20206ASGWTMEP reduces clock speed and removes FlexRay/EMIF to lower cost and power, while TMS570LS3137CZWTQEP extends capability with Ethernet and higher clock rate - both require separate qualification for flight use but share core safety architecture.

Availability

S5LS20216ASGWTMEP is available at Aetrix Electronics and suitable for aerospace flight control, satellite bus management, and engine health monitoring requiring stable component supply across extended product lifecycles and controlled baseline manufacturing.

Supply support for S5LS20216ASGWTMEP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and high-reliability ICs for industrial, automotive, and aerospace markets.

The TMS570LS series was developed specifically for safety-critical real-time control applications demanding IEC 61508 SIL3 or GEIA-STD-00021-1 compliance - with lockstep CPUs, memory ECC, and hardware self-test as foundational features.

FAQ

What is the maximum operating frequency of the S5LS20216ASGWTMEP?

The S5LS20216ASGWTMEP operates at up to 160 MHz system clock frequency, as confirmed in TI SPNS209A Section 2.2 and supported by its FMzPLL clock module. This frequency applies to the ARM Cortex-R4F CPU, NHET, and peripheral clocks derived from GCLK and VCLK. The device powers up in non-pipeline mode (max 36 MHz) and must be configured into pipeline mode for full 160 MHz operation.

Does the S5LS20216ASGWTMEP include FlexRay support?

Yes, the S5LS20216ASGWTMEP includes a dual-channel FlexRay™ controller with 8 KB message RAM (parity-protected), dedicated FlexRay PLL (FPLL), and Transfer Unit (FTU) - explicitly confirmed in SPNS209A Sections 1.1, 1.3, and 2.2. This distinguishes it from the S5LS20206ASGWTMEP, which omits FlexRay entirely.

How many CAN controllers does the S5LS20216ASGWTMEP integrate?

The S5LS20216ASGWTMEP integrates three DCAN controllers: DCAN1 and DCAN2 each support 64 mailboxes, while DCAN3 supports 32 mailboxes - all compliant with CAN 2.0B protocol. This configuration is documented in TI SPNS209A Table 2-2 and Section 1.3, and is physically implemented on the GWT package pins CAN1TX/CAN1RX through CAN3TX/CAN3RX.

What is the Flash memory organization of the S5LS20216ASGWTMEP?

The S5LS20216ASGWTMEP contains 2 MB of Flash memory organized into four 512 KB banks (Bank 0–Bank 3), with sector sizes ranging from 8 KB to 128 KB - detailed in SPNS209A Table 2-3. Each bank supports independent erase; programming is performed in 16-bit or 32-bit words. ECC bits must be written across all Flash addresses to prevent speculative-fetch errors when ECC is enabled.

Is the S5LS20216ASGWTMEP qualified for extended temperature operation?

Yes, the S5LS20216ASGWTMEP is rated for operation from –55°C to +125°C and qualified per GEIA-STD-00021-1 for aerospace electronic components. This includes controlled baseline, single assembly/test site, extended product life cycle, and full traceability - as specified in SPNS209A Section 1.2 and Ordering Information Table 1.4.