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Texas Instruments S5LS20216ASPGEMEP
- Part No.:
- S5LS20216ASPGEMEP
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
S5LS20216ASPGEMEP.pdf
- Description:
- IC MCU 16/32BIT 2MB FLSH 144LQFP
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
S5LS20216ASPGEMEP from Texas Instruments is a radiation-tolerant, GEIA-STD-00021-1 qualified 16/32-bit RISC Flash microcontroller based on the ARM® Cortex™-R4F CPU, operating at up to 140 MHz with 2 MB flash (ECC), 160 KB SRAM (ECC), and dual-lockstep CPUs for safety-critical aerospace control systems.
For engineers reviewing the S5LS20216ASPGEMEP datasheet, S5LS20216ASPGEMEP pinout, S5LS20216ASPGEMEP application, or S5LS20216ASPGEMEP equivalent, this device delivers deterministic real-time control with integrated FlexRay, dual CAN, LIN/UART, NHET timer, and dual 12-bit MibADCs - all validated for operation from –55°C to 125°C in military-grade LQFP-144 packaging.
Technical Context
The S5LS20216ASPGEMEP implements dual ARM Cortex-R4F CPUs in lockstep with BIST, ECC on flash/SRAM, parity on peripheral memories, and an Error Signaling Module (ESM) with external error pin - forming a hardware-level fault-detection architecture compliant with GEIA-STD-00021-1 for aerospace electronics. Its FMzPLL clock module provides frequency-modulated phase-locked loop operation with oscillator and PLL monitoring.
It integrates three MibSPI interfaces (each with 128 buffers and parity), two LIN/SCI UARTs supporting LIN 2.0, two DCAN controllers (64 mailboxes each, CAN 2.0B), and a 25-channel High-End Timer (NHET) with dedicated transfer unit and parity-protected 128-word RAM - all accessible via a 16-bit External Memory Interface (EMIF) and managed by a Vectored Interrupt Module (VIM).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-R4F dual-core in lockstep, 1.6 DMIPS/MHz, up to 140 MHz - enables SIL3-aligned functional safety without software redundancy overhead. |
| Memory | 2 MB flash with SECDED ECC + 160 KB SRAM with SECDED ECC - ensures data integrity across full temperature range without external scrubbing. |
| Peripherals | 2 × DCAN (CAN 2.0B, 64 mailboxes each), 2 × LIN/SCI, 3 × MibSPI (128 buffers/parity), 25-channel NHET, dual 12-bit MibADC (20 total channels, 64-word parity buffers each). |
| Package & Temp | LQFP-144 (PGE), –55°C to 125°C operating range, GEIA-STD-00021-1 qualified - certified for extended-life aerospace deployment with traceable lot control. |
| Power Supply | VCC = 1.5 V (core), VCCIO = 3.3 V (I/O) - separates noise-sensitive core logic from high-drive I/O domains for stable mixed-signal operation. |
| Debug & Trace | Embedded Trace Module (ETMR4), RAM Trace Port (RTP), Data Modification Module (DMM), Parameter Overlay Module (POM) - supports non-intrusive runtime instrumentation and field parameter updates without flash reprogramming. |
Pinout & Package
144-pin Lidded Quad Flat Pack (PGE) package with 8 dedicated GIO pins, 68 total peripheral I/Os, and thermal pad exposed on underside for enhanced heat dissipation in conduction-cooled aerospace modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RST / PORRST | Reset Input / Power-On Reset Output | Asynchronous active-low reset input; PORRST asserts during power-up sequencing to synchronize internal voltage monitors and BIST initialization. |
| OSCIN / OSCOUT | Crystal Oscillator Input / Output | Supports external crystal (1–20 MHz) or CMOS clock source; drives FMzPLL reference for system clock generation with built-in oscillator monitor. |
| ECLK | Programmable External Clock Output | User-configurable output derived from VCLK via ECP module - enables synchronous clocking of external ADCs or FPGAs without additional oscillators. |
| GIOA[7:0] / INT[7:0] | Dedicated General-Purpose I/O with Interrupt | 8 pins support GPIO, external interrupt triggering, and configurable pull-up/down - used for critical status signaling (e.g., watchdog timeout, sensor fault flags). |
| CAN1RX / CAN1TX | Controller Area Network Transceiver Interface | Differential bus interface compliant with ISO 11898-2; supports up to 1 Mbps with built-in message RAM parity and mailbox arbitration logic. |
| AD1IN[7:0] | Analog Input Channel Group 1 | 8-channel analog front-end for first 12-bit MibADC; supports simultaneous sampling with programmable trigger sources including NHET events and external pins. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-lockstep Cortex-R4F CPUs | Hardware-enforced instruction-level redundancy with automatic fault detection and error signaling - eliminates need for software-based voting schemes in DO-254/DO-178C workflows. |
| FMzPLL clock monitoring | Real-time oscillator and PLL clock failure detection with independent error reporting path - meets GEIA-STD-00021-1 requirement for autonomous clock health verification. |
| Parity-protected peripheral RAM | All MibSPI buffer RAM, NHET RAM, DCAN mailbox RAM, and MibADC buffer RAM include parity bits - prevents silent data corruption in high-radiation environments. |
| External Memory Interface (EMIF) | 16-bit data bus, 22-bit address, 4 chip selects - enables direct connection to external PROM, SRAM, or FPGA configuration memory without glue logic. |
| Parameter Overlay Module (POM) | Redirects flash accesses to EMIF CS0 space - allows runtime parameter updates (e.g., calibration tables, flight profiles) without flash erase cycles or system interruption. |
Applications
| Aerospace Flight Control Unit | Satellite Onboard Computer |
|---|---|
Use Scenario: Real-time actuator command generation and sensor fusion in triple-redundant fly-by-wire systems. IC Role / Device Role / Timing Role: Primary safety controller executing deterministic control loops with lockstep CPU validation and NHET-driven PWM outputs. Use Value: Dual-lockstep execution and ECC memory ensure continuous operation under single-point faults; 140 MHz performance sustains 10 kHz control loop rates with margin. |
Use Scenario: Autonomous attitude determination and telemetry processing in LEO smallsats with radiation-hardened requirements. IC Role / Device Role / Timing Role: Central mission computer managing CAN bus payloads, FlexRay inter-module comms, and radiation-tolerant ADC acquisition. Use Value: GEIA-STD-00021-1 qualification guarantees extended life-cycle support; POM enables in-orbit firmware parameter tuning without reflash operations. |
| Defense Vehicle Engine Management | Military Avionics Display Processor |
Use Scenario: High-integrity diesel engine control in tracked armored vehicles operating across extreme ambient temperatures. IC Role / Device Role / Timing Role: Safety-certified ECU coordinating fuel injection timing, exhaust gas recirculation, and turbocharger actuation via NHET and DCAN. Use Value: –55°C to 125°C rating ensures reliability in desert/arctic deployments; dual CAN interfaces support redundant communication with transmission and braking subsystems. |
Use Scenario: Integrated display controller for multi-function cockpit displays requiring deterministic video overlay and sensor alert prioritization. IC Role / Device Role / Timing Role: Graphics-adjacent processor handling LIN-connected sensor inputs, CAN-based vehicle bus data, and real-time interrupt-driven display updates. Use Value: RTI OS timer and VIM enable sub-50 µs interrupt latency for critical warning overlays; 2 MB flash stores multiple display firmware variants with ECC protection. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar safety-critical microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMS570LS20206ASPGEMEP | Same die, lower speed grade (140 MHz vs. 140 MHz), identical peripherals but no FlexRay controller - confirmed in TMS570LS20206-EP datasheet Table 2-2. | Targeted at cost-optimized aerospace ECUs where FlexRay is unused; retains same CAN/LIN/NHET/ADC feature set. | Select when FlexRay is unnecessary and BOM cost reduction is prioritized without sacrificing safety architecture or temperature rating. |
| TMS570LS20216ASGWTMEP | Identical functionality and speed grade, but in 337-pin NFBGA (GWT) package - offers higher I/O count (115 pins vs. 68) and improved thermal performance. | Preferred for space-constrained avionics boards requiring maximum peripheral routing flexibility and enhanced thermal dissipation. | Choose when board layout requires more I/Os or thermal management demands BGA packaging; same firmware compatibility applies. |
Compared with TMS570LS20206ASPGEMEP, S5LS20216ASPGEMEP adds FlexRay support for time-triggered networking; compared with S5LS20216ASGWTMEP, it trades I/O count and thermal headroom for simplified assembly and legacy QFP compatibility - enabling drop-in replacement in existing PGE-footprint designs.
Availability
S5LS20216ASPGEMEP is available at Aetrix Electronics and suitable for aerospace flight control units, satellite onboard computers, defense vehicle engine management systems, and military avionics display processors requiring stable component supply across extended product lifecycles.
Supply support for S5LS20216ASPGEMEP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies with over 50 years of aerospace and defense component experience.
The TMS570LS series was designed specifically for high-reliability, safety-critical real-time control in aerospace, defense, and industrial applications - emphasizing lockstep CPU redundancy, memory ECC, and GEIA-STD-00021-1 qualification.
FAQ
What is the maximum operating frequency of the S5LS20216ASPGEMEP?
The S5LS20216ASPGEMEP operates at up to 140 MHz, as specified in the TMS570LS20216-EP datasheet Table 2-2 for the PGE (LQFP-144) package variant. This speed grade is validated across the full –55°C to 125°C temperature range and supports deterministic real-time control loops with sub-microsecond interrupt latency.
Does the S5LS20216ASPGEMEP include FlexRay capability?
Yes, the S5LS20216ASPGEMEP includes a dual-channel FlexRay™ controller with dedicated PLL and Transfer Unit (FTU), as confirmed in the device description section and functional block diagram of the SPNS209A datasheet. This distinguishes it from the TMS570LS20206 variant, which omits FlexRay.
What package type and pin count does the S5LS20216ASPGEMEP use?
The S5LS20216ASPGEMEP uses a 144-pin Lidded Quad Flat Pack (PGE) package, as documented in the ordering information table (Section 1.4) and package support section of the SPNS209A datasheet. It provides 68 total peripheral I/O pins and 8 dedicated GIO pins with external interrupt capability.
How does the S5LS20216ASPGEMEP support functional safety compliance?
The S5LS20216ASPGEMEP supports functional safety through dual-lockstep Cortex-R4F CPUs, ECC on flash and SRAM, parity on all peripheral memories (MibSPI, NHET, DCAN, MibADC), BIST for CPU and memory, and an Error Signaling Module (ESM) with external error pin - all aligned with GEIA-STD-00021-1 for aerospace qualification.
Is external memory supported by the S5LS20216ASPGEMEP?
Yes, the S5LS20216ASPGEMEP includes a 16-bit External Memory Interface (EMIF) with 22-bit addressing and four chip selects, enabling direct connection to asynchronous SRAM, PROM, or FPGA configuration memory - as detailed in Section 1.3 and Figure 2-1 of the SPNS209A datasheet.
S5LS20216ASPGEMEP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 144-LQFP
- Series:
- Hercules™ TMS570 ARM® Cortex®-R
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-R4F
- Core Size:
- 16/32-Bit
- Speed:
- 140MHz
- Connectivity:
- CANbus, LINbus, SCI, SPI, UART/USART
- Peripherals:
- DMA, POR
- Number of I/O:
- 68
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 160K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.35V ~ 1.65V
- Data Converters:
- A/D 20x12b
- Oscillator Type:
- External
- Operating Temperature:
- -55°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S5LS20216ASPGEMEP FAQ
1.How can I place an order for S5LS20216ASPGEMEP through Aetrix?
Please submit a Request for Quotation (RFQ) for S5LS20216ASPGEMEP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S5LS20216ASPGEMEP reliable?
The price and inventory of S5LS20216ASPGEMEP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S5LS20216ASPGEMEP is usually 5 days.
3.What payment methods are accepted for S5LS20216ASPGEMEP?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S5LS20216ASPGEMEP transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S5LS20216ASPGEMEP?
S5LS20216ASPGEMEP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S5LS20216ASPGEMEP order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S5LS20216ASPGEMEP?
For technical support, including S5LS20216ASPGEMEP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S5LS20216ASPGEMEP requirements.
6.How does Aetrix verify that S5LS20216ASPGEMEP is sourced from the original manufacturer or authorized distributors?
All S5LS20216ASPGEMEP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S5LS20216ASPGEMEP meets industry standards.
7.What is the process for return or replacement of S5LS20216ASPGEMEP?
All S5LS20216ASPGEMEP units undergo pre-shipment inspection (PSI). If there is an issue with S5LS20216ASPGEMEP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S5LS20216ASPGEMEP part is unused and in its original packaging.
Return procedure for S5LS20216ASPGEMEP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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