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Infineon Technologies S70FL01GSAGBAEC13
- Part No.:
- S70FL01GSAGBAEC13
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S70FL01GSAGBAEC13.pdf
- Description:
- IC FLASH 1GBIT SPI/QUAD 24BGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,918
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Product details
Overview
S70FL01GSAGBAEC13 from Infineon Technologies (formerly Cypress) is a military-grade 1 Gbit (128 Mbyte) dual-die SPI flash memory with 2.7–3.6 V core supply, −55 °C to +125 °C operation, and uniform 256-kbyte sector erase. It supports Quad I/O, DDR read modes, AutoBoot, and Common Flash Interface (CFI) for embedded boot code storage in avionics control units.
For engineers reviewing the S70FL01GSAGBAEC13 datasheet, S70FL01GSAGBAEC13 pinout, S70FL01GSAGBAEC13 application, or S70FL01GSAGBAEC13 equivalent, key selection criteria include dual-die addressing via CS1#/CS2#, 20-year data retention, OTP array size, sector protection granularity, and compatibility with S25FL-P family command sets.
Technical Context
The S70FL01GS is a stacked-die device comprising two independent S25FL512S dies sharing a common SPI interface but requiring separate chip select (CS1# and CS2#) activation. Each die maintains autonomous status, configuration, and security registers - no cross-die sequential reads or bulk erase commands are supported.
It implements Cypress's 65 nm MirrorBit® technology with Eclipse™ architecture, enabling Quad-Input Page Programming (QPP), DDR-capable read operations up to 80 MHz, and hardware/software block protection with Advanced Sector Protection (ASP) and password-controlled access to protected sectors.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Capacity | 1 Gbit (128 Mbyte), implemented as two independent 512 Mbit dies |
| Interface Protocol | SPI with Multi-I/O support: Normal/Fast/Dual/Quad/DDR read modes |
| Erase Granularity | Uniform 256-kbyte sectors; erase must be issued per die separately |
| Data Retention | Minimum 20 years at max operating temperature (−55 °C to +125 °C) |
| Endurance | Minimum 100 program-erase cycles per sector |
| OTP Array Size | 2048 bytes of one-time programmable memory for secure configuration storage |
| Supply Voltage | Core VCC = 2.7 V to 3.6 V; VIO not supported (RFU) |
Pinout & Package
Available in 16-lead SOIC (300 mil) and 24-ball BGA (8 × 6 mm, ZSA024 footprint). Pin functions are identical across packages; VIO (pin 14 / ball E4) is Reserved for Future Use and not connected internally.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS1# | Chip Select 1 | Selects first 512 Mbit die; required to access lower 128 Mbyte address space |
| CS2# | Chip Select 2 | Selects second 512 Mbit die; required to access upper 128 Mbyte address space |
| SI/IO0 | Serial Input / IO0 | Single-bit input or Quad I/O lane 0; supports command/address/data transfer |
| SO/IO1 | Serial Output / IO1 | Single-bit output or Quad I/O lane 1; used for read data and status feedback |
| WP#/IO2 | Write Protect / IO2 | Hardware write protection in single/dual mode; becomes IO2 in Quad mode |
| HOLD#/IO3 | Hold / IO3 | Pauses ongoing serial transfer; becomes IO3 in Quad-I/O mode |
| RESET# | Hardware Reset | Active-low reset signal with internal pull-up; resets both dies simultaneously |
| VCC | Core Power Supply | Supplies 2.7–3.6 V to both dies; decoupling required per JEDEC guidelines |
| VSS | Ground | Common reference for all signals and power domains |
Key Features
| Feature | Design Value |
|---|---|
| Dual-Die Architecture | Two independent S25FL512S dies enable scalable 1 Gbit density while maintaining S25FL-P command compatibility |
| AutoBoot Function | Executes preconfigured Normal or Quad read at power-up/reset, reducing boot firmware latency in safety-critical systems |
| Advanced Sector Protection | Password- and boot-code–controlled individual sector locking prevents unauthorized firmware modification |
| Quad DDR Read Support | Enables 80 MHz DDR read throughput (≈160 MB/s effective) for high-speed code execution from flash |
| CFI Compliance | Provides standardized geometry and parameter tables for automatic host system configuration without hard-coded offsets |
Applications
| Avionics Flight Control Unit | Tactical Radio Firmware Storage |
|---|---|
Use Scenario: Stores certified flight control software and calibration tables in DO-254-compliant hardware. IC Role / Device Role / Timing Role: Nonvolatile boot memory with deterministic read timing and AutoBoot-triggered startup sequence. Use Value: 20-year data retention and −55 °C to +125 °C operation ensure reliability across extended mission lifetimes and extreme environmental conditions. | Use Scenario: Holds encrypted radio stack firmware and cryptographic keys in handheld battlefield radios. IC Role / Device Role / Timing Role: Secure storage with OTP array and ASP-enabled sector locking for tamper-resistant updates. Use Value: 2048-byte OTP and password-controlled protection prevent runtime reprogramming of critical security parameters. |
| Military Vehicle Engine Control Module | Secure Bootloader for Radar DSP |
Use Scenario: Hosts engine management firmware with real-time diagnostics and fail-safe recovery routines. IC Role / Device Role / Timing Role: Dual-die SPI flash supporting fast Quad DDR reads for low-latency instruction fetch during transient load events. Use Value: 100-cycle endurance and uniform 256-kbyte sectors allow robust field updates without wear-leveling overhead. | Use Scenario: Stores signed bootloader image and public key certificates for radar subsystem authentication. IC Role / Device Role / Timing Role: CFI-compliant flash enabling automatic configuration of memory map and timing parameters by host processor. Use Value: CFI data at byte 27h (0x1B) confirms 2N byte geometry, simplifying BSP integration across multiple radar platforms. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SPI flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S25FL512SAGMFI000 | Single-die 512 Mbit; same 65 nm MirrorBit® process, identical command set, but half capacity | Limited to 64 Mbyte applications; no dual-die addressing complexity | Select when full 128 Mbyte is unnecessary and PCB layout favors smaller BGA or SOIC footprint |
| MX25L1G45GM2I-12G | 1 Gbit Macronix device; supports octal DTR mode, no dual-die architecture, different security register mapping | Higher bandwidth potential but lacks ASP and OTP; requires redesign of protection logic | Choose only if DDR read speed >80 MHz is mandatory and legacy S25FL-P compatibility is not required |
Compared with S25FL512SAGMFI000, the S70FL01GSAGBAEC13 doubles capacity via dual-die stacking but adds chip-select management overhead; versus MX25L1G45GM2I-12G, it trades octal bandwidth for mature military qualification, ASP, and seamless S25FL-P migration path.
Availability
S70FL01GSAGBAEC13 is available at Aetrix Electronics and suitable for avionics flight control units, tactical radio firmware storage, and military vehicle engine control modules requiring stable component supply under extended temperature and long-lifecycle commitments.
Supply support for S70FL01GSAGBAEC13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, sensor, and memory solutions for industrial, automotive, and aerospace markets.
The S70FL01GS belongs to Infineon's military-qualified SPI flash product line, designed specifically for high-reliability embedded systems where data integrity, long-term retention, and secure firmware update capability are mission-critical.
FAQ
Does S70FL01GSAGBAEC13 support true single-command 1 Gbit bulk erase?
No. Due to its dual-die construction, bulk erase must be executed separately on each 512 Mbit die using CS1# and CS2#. A single command cannot erase both dies simultaneously - this is a hardware limitation confirmed in the device operations section of the datasheet.
Can AutoBoot be configured to execute Quad read from any address within the 128 Mbyte range?
Yes. AutoBoot can be set to initiate either Normal or Quad read from any user-defined 24-bit or 32-bit address, including locations spanning both dies - though sequential reads across die boundaries require manual CS# switching as stated in the Sequential Reads section.
What is the functional status of the VIO pin on S70FL01GSAGBAEC13?
VIO (pin 14 in SOIC, ball E4 in BGA) is Reserved for Future Use (RFU) and unconnected internally. It must not be used for routing or voltage biasing; doing so may cause undefined behavior or violate JEDEC compliance requirements per the datasheet's physical diagram notes.
How does block protection behave when FREEZE bit is set on one die but not the other?
If the FREEZE bit is set to logic 1 on one die, that die's TBPROT and BPNV bits become locked until power-on-reset. The other die remains independently configurable. This asymmetry is documented in the Block Protection section and requires explicit per-die status register polling before issuing protection commands.
S70FL01GSAGBAEC13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 24-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR (SLC)
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 6.5 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -55°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (8x6)
S70FL01GSAGBAEC13 FAQ
1.How can I place an order for S70FL01GSAGBAEC13 through Aetrix?
Please submit a Request for Quotation (RFQ) for S70FL01GSAGBAEC13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S70FL01GSAGBAEC13 reliable?
The price and inventory of S70FL01GSAGBAEC13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70FL01GSAGBAEC13 is usually 5 days.
3.What payment methods are accepted for S70FL01GSAGBAEC13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70FL01GSAGBAEC13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S70FL01GSAGBAEC13?
S70FL01GSAGBAEC13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S70FL01GSAGBAEC13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S70FL01GSAGBAEC13?
For technical support, including S70FL01GSAGBAEC13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70FL01GSAGBAEC13 requirements.
6.How does Aetrix verify that S70FL01GSAGBAEC13 is sourced from the original manufacturer or authorized distributors?
All S70FL01GSAGBAEC13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70FL01GSAGBAEC13 meets industry standards.
7.What is the process for return or replacement of S70FL01GSAGBAEC13?
All S70FL01GSAGBAEC13 units undergo pre-shipment inspection (PSI). If there is an issue with S70FL01GSAGBAEC13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S70FL01GSAGBAEC13 part is unused and in its original packaging.
Return procedure for S70FL01GSAGBAEC13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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