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Infineon Technologies S70FL01GSAGBHAC10
- Part No.:
- S70FL01GSAGBHAC10
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S70FL01GSAGBHAC10.pdf
- Description:
- IC FLASH 1GBIT SPI/QUAD 24BGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,593
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Product details
Overview
S70FL01GSAGBHAC10 from Infineon is a 1 Gbit (128 Mbyte) dual-die SPI flash memory with Multi-I/O interface, 3.0 V core supply, and uniform 256-kbyte sector erase. It supports Quad DDR read up to 133 MHz, 100,000 program-erase cycles, and 20-year data retention. Used in industrial embedded systems requiring high-density nonvolatile storage with AEC-Q100 Grade 2 qualification (−40°C to +105°C).
For engineers reviewing the S70FL01GSAGBHAC10 datasheet, S70FL01GSAGBHAC10 pinout, S70FL01GSAGBHAC10 application, or S70FL01GSAGBHAC10 equivalent, key selection factors include dual-die addressing via CS1#/CS2#, Quad I/O command compatibility with S25FL-P family, OTP security array, and absence of VIO support in this variant.
Technical Context
The S70FL01GSAGBHAC10 implements a dual-die stack of two S25FL512S dies sharing a common SOIC-16 or BGA-24 package. Each die operates independently with dedicated CS1# and CS2# signals, separate status/configuration registers, and isolated block protection logic.
It supports SPI modes 0 and 3, DDR read/write, extended 32-bit addressing, AutoBoot from preselected address, and Common Flash Interface (CFI) for runtime configuration discovery. VIO pin is RFU - only VCC (2.7–3.6 V) powers both core and I/O circuits.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 1 Gbit (128 Mbyte), implemented as two independent 512 Mbit dies |
| Interface | SPI Multi-I/O with Normal/Fast/Dual/Quad/DDR read modes; no VIO support |
| Erase granularity | Uniform 256-kbyte sectors; bulk erase requires separate commands per die |
| Endurance & retention | ≥100,000 program-erase cycles; ≥20 years data retention at +85°C |
| Security | 2048-byte OTP array; hardware/software block protection; ASP with password control |
| Operating temperature | Industrial Plus (−40°C to +105°C); AEC-Q100 Grade 2 qualified |
| Supply voltage | VCC = 2.7 V to 3.6 V; no separate VIO rail - I/O levels track VCC |
Pinout & Package
Package: 16-lead SOIC (300 mil), Pb-free, with dual-die internal architecture and dedicated chip select lines for each die.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS1# | Chip Select 1 | Activates first 512 Mbit die; required for all operations on Die #1 |
| CS2# | Chip Select 2 | Activates second 512 Mbit die; required for all operations on Die #2 |
| SI/IO0 | Serial Input / IO0 | Single-bit input or Quad I/O line 0; no internal pull-down |
| SO/IO1 | Serial Output / IO1 | Single-bit output or Quad I/O line 1; no internal pull-down |
| WP#/IO2 | Write Protect / IO2 | Hardware write protection in standard mode; IO2 in Quad mode; internal pull-up |
| HOLD#/IO3 | Hold / IO3 | Pauses ongoing transfer in single/dual mode; IO3 in Quad mode; internal pull-up |
| SCK | Serial Clock | Drives all SPI transactions; supports up to 133 MHz in DDR mode |
| RESET# | Hardware Reset | Asynchronous reset with internal pull-up; returns device to standby state |
| VCC | Core & I/O Supply | Single 2.7–3.6 V rail powers core logic and all I/O buffers |
| VSS | Ground | Common reference for VCC and all signal pins |
| NC | No Connect | Unbonded pin; safe for PCB routing but must not exceed VCC voltage |
| DNU | Do Not Use | Test-only pin; internal pull-down; must remain unconnected in host design |
Key Features
| Feature | Design Value |
|---|---|
| Dual-die independent operation | Each 512 Mbit die has dedicated CS#, status/config registers, and erase control - enables flexible partitioning |
| Quad DDR read performance | Up to 133 MHz clock with double-data-rate transfers yields >266 MB/s effective throughput |
| AutoBoot execution | Automatically executes Normal or Quad Read at power-up/reset from user-configurable address - reduces boot firmware latency |
| OTP security array | 2048-byte one-time-programmable region for keys, calibration data, or secure boot code storage |
| ASP with password control | Individual sector protection enforced by boot code or 32-bit password - prevents unauthorized firmware overwrite |
Applications
| Industrial HMI Boot Storage | Automotive ADAS Firmware Image |
|---|---|
Use Scenario: Storing boot loader and OS kernel for ruggedized human-machine interface panels operating in factory environments. IC Role / Device Role / Timing Role: Nonvolatile code storage with AutoBoot capability and sector-level protection against field update corruption. Use Value: Dual-die architecture allows parallel firmware staging (e.g., active/inactive bank), while 20-year retention ensures lifetime reliability without refresh. | Use Scenario: Holding calibrated sensor fusion firmware and safety-critical perception algorithms in automotive ADAS ECUs. IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 qualified SPI flash providing secure, high-integrity storage for ASIL-B software components. Use Value: OTP array stores cryptographic keys; ASP enforces write-protection on safety-critical sectors during vehicle operation. |
| Medical Imaging Data Buffer | Energy Meter Firmware Vault |
Use Scenario: Caching DICOM image metadata and calibration tables in portable ultrasound devices with limited board space. IC Role / Device Role / Timing Role: High-density (128 Mbyte), low-pin-count SPI flash enabling compact PCB layout and deterministic read latency via Quad DDR mode. Use Value: Uniform 256-kbyte sectors simplify wear leveling across large datasets; 100K-cycle endurance supports frequent calibration updates. | Use Scenario: Securing firmware and tariff configuration data in smart electricity meters deployed in harsh outdoor substations. IC Role / Device Role / Timing Role: Industrial Plus grade (−40°C to +105°C) flash with hardware block protection preventing tampering during grid-side firmware updates. Use Value: TBPROT/BPNV bits enable selective locking of tariff tables; FREEZE bit prevents accidental unlock until power cycle. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SPI flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S25FL128SAGMFI000 | Single-die 128 Mbit; no CS2#; no dual-die addressing; identical SOIC-16 footprint | Lacks die-switching flexibility; unsuitable for applications requiring independent die management or staged firmware updates | Select when only single-die simplicity and lower cost are needed, and dual-die features are unused |
| S70FL01GSAGBHAC00 | Same dual-die architecture and pinout; differs only in temperature grade (Industrial −40°C to +85°C vs. Industrial Plus +105°C) | Not rated for extended thermal cycling in high-ambient environments like under-hood automotive or sealed industrial enclosures | Select when full Industrial Plus thermal range is not required, reducing cost without functional compromise |
Compared with S25FL128SAGMFI000 and S70FL01GSAGBHAC00, the S70FL01GSAGBHAC10 uniquely delivers dual-die independence with AEC-Q100 Grade 2 qualification - essential for safety-critical, thermally demanding, or firmware-staging applications where die isolation and extended temperature operation are mandatory.
Availability
S70FL01GSAGBHAC10 is available at Aetrix Electronics and suitable for industrial HMI boot storage, automotive ADAS firmware image hosting, and medical imaging data buffering requiring stable component supply across long-lifecycle programs.
Supply support for S70FL01GSAGBHAC10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global manufacturing and quality certification to ISO/TS 16949 and IATF 16949.
The FL-S flash product line targets high-reliability embedded systems needing SPI-compatible, high-density nonvolatile memory with advanced security, extended temperature operation, and automotive qualification - built on MirrorBit® and Eclipse™ architectures.
FAQ
Does S70FL01GSAGBHAC10 support simultaneous read from both dies?
No. The device requires sequential access: CS1# selects the first die and CS2# selects the second. Simultaneous read is not supported due to shared SPI bus and internal arbitration limitations. Reads spanning die boundaries must be split into two discrete transactions with explicit chip select toggling.
Is VIO pin functional in this part number?
No. The VIO pin is marked RFU (Reserved for Future Use) in the S70FL01GSAGBHAC10 datasheet and has no internal connection. All I/O buffers operate from the VCC supply (2.7–3.6 V). Designers must tie VIO to VCC or leave it floating per Infineon's recommendation - it does not accept an independent voltage.
How is the 1 Gbit capacity physically organized?
The device contains two independent 512 Mbit (64 Mbyte) S25FL512S dies stacked in a single package. Each die has its own 256-kbyte uniform sectors, status register, configuration register, and block protection logic. Total address space is 2 × 227 bytes, accessed via separate CS1# and CS2# signals.
Can the OTP array be reprogrammed after initial write?
No. The 2048-byte OTP (One-Time Programmable) array is permanently programmed using high-voltage pulses. Once a bit is set to '0', it cannot be changed back to '1'. It is intended for immutable data such as cryptographic keys, device serial numbers, or calibration constants that must survive field updates and power cycles.
S70FL01GSAGBHAC10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 24-TBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (8x6)
S70FL01GSAGBHAC10 FAQ
1.How can I place an order for S70FL01GSAGBHAC10 through Aetrix?
Please submit a Request for Quotation (RFQ) for S70FL01GSAGBHAC10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S70FL01GSAGBHAC10 reliable?
The price and inventory of S70FL01GSAGBHAC10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70FL01GSAGBHAC10 is usually 5 days.
3.What payment methods are accepted for S70FL01GSAGBHAC10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70FL01GSAGBHAC10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S70FL01GSAGBHAC10?
S70FL01GSAGBHAC10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S70FL01GSAGBHAC10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S70FL01GSAGBHAC10?
For technical support, including S70FL01GSAGBHAC10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70FL01GSAGBHAC10 requirements.
6.How does Aetrix verify that S70FL01GSAGBHAC10 is sourced from the original manufacturer or authorized distributors?
All S70FL01GSAGBHAC10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70FL01GSAGBHAC10 meets industry standards.
7.What is the process for return or replacement of S70FL01GSAGBHAC10?
All S70FL01GSAGBHAC10 units undergo pre-shipment inspection (PSI). If there is an issue with S70FL01GSAGBHAC10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S70FL01GSAGBHAC10 part is unused and in its original packaging.
Return procedure for S70FL01GSAGBHAC10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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