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Infineon Technologies S70FL01GSAGBHAC13
- Part No.:
- S70FL01GSAGBHAC13
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S70FL01GSAGBHAC13.pdf
- Description:
- IC FLASH 1GBIT SPI/QUAD 24BGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,113
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Product details
Overview
S70FL01GSAGBHAC13 from Infineon is a 1 Gbit (128 Mbyte) dual-die SPI Multi-I/O flash memory with 3.0 V core supply, uniform 256-kbyte sectors, 100,000 program-erase cycles, and AEC-Q100 Grade 2 automotive qualification (−40°C to +105°C). It implements two stacked S25FL512S dies in a single BGA-24 package for high-density embedded code storage in automotive ADAS ECUs.
For engineers reviewing the S70FL01GSAGBHAC13 datasheet, S70FL01GSAGBHAC13 pinout, S70FL01GSAGBHAC13 application, or S70FL01GSAGBHAC13 equivalent, key selection criteria include dual-die addressing via CS1#/CS2#, Quad DDR read support up to 133 MHz, OTP security array (2048 bytes), and independent status/configuration register management per die.
Technical Context
The S70FL01GSAGBHAC13 integrates two identical S25FL512S dies in a monolithic BGA-24 package, each with independent CS#, status registers, configuration registers, and block protection logic. Access requires explicit chip select routing: CS1# for Die 1 (0x00000000–0x07FFFFFF), CS2# for Die 2 (0x08000000–0x0FFFFFFF).
It supports SPI modes 0/3, DDR read/write, AutoBoot from preselected address, and CFI-compliant configuration. VIO is RFU - I/O voltage is fixed to VCC (2.7–3.6 V), eliminating level-shifting complexity in 3.3 V systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Capacity | 1 Gbit (128 Mbyte) total, split as two independent 512 Mbit dies |
| Interface | SPI Multi-I/O with Quad/DDR support; no VIO pin - simplifies PCB routing |
| Erase granularity | Uniform 256-kbyte sectors; bulk erase requires separate commands per die |
| Endurance & retention | 100,000 program-erase cycles; 20-year data retention at +85°C |
| Security | 2048-byte OTP array; ASP with password-protected sector lock/unlock |
| Temperature grade | AEC-Q100 Grade 2 (−40°C to +105°C); qualified for automotive powertrain and ADAS |
| Read speed | Quad DDR read up to 133 MHz (266 MB/s effective bandwidth) |
Pinout & Package
Package: 24-ball BGA, 8 × 6 mm, ZSA024 footprint (5 × 5 ball array), Pb-free, RoHS compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS1# | Chip Select 1 | Selects Die 1 (lower 512 Mbit); active-low, internal pull-down |
| CS2# | Chip Select 2 | Selects Die 2 (upper 512 Mbit); active-low, internal pull-down |
| SCK | Serial Clock | Drives SPI timing; supports up to 133 MHz in DDR mode |
| SI/IO0 | Serial Input / IO0 | Single-bit input or Quad I/O lane 0; no external pull-up required |
| SO/IO1 | Serial Output / IO1 | Single-bit output or Quad I/O lane 1; supports fast read command flow |
| WP#/IO2 | Write Protect / IO2 | Hardware write lock for sectors; functions as IO2 in Quad mode |
| HOLD#/IO3 | Hold / IO3 | Pauses ongoing transfer; acts as IO3 in Quad-I/O mode |
| VCC | Core Supply | 2.7–3.6 V; powers both dies and internal logic |
| VSS | Ground | Common reference for all signals and core; must be low-impedance |
| RESET# | Hardware Reset | Active-low reset with internal pull-up; resets both dies synchronously |
| DNU pins (A1, A2, B1, B2, C1, D1, E1, E2) | Do Not Use | Reserved for test; must not connect to host signals or PCB traces |
Key Features
| Feature | Design Value |
|---|---|
| Dual-die architecture | Two independent 512 Mbit FL-S dies in one BGA; enables scalable code storage without board redesign |
| AutoBoot execution | Automatically executes Normal or Quad Read at power-up/reset from user-defined address - reduces boot firmware latency |
| Independent register control | Status, Configuration, Bank Address, and Security registers managed separately per die - ensures deterministic multi-die operation |
| Quad DDR interface | 266 MB/s effective read bandwidth with single-ended signaling - eliminates need for parallel NOR flash in space-constrained designs |
| AEC-Q100 Grade 2 compliance | Validated for −40°C to +105°C operation with full parametric testing - meets automotive powertrain and ADAS reliability requirements |
Applications
| Automotive ADAS Camera Module | Industrial PLC Firmware Storage |
|---|---|
|
Use Scenario: Stores boot code, calibration data, and firmware updates for front-facing camera ECU in Level 2+ ADAS systems. IC Role / Device Role / Timing Role: Primary nonvolatile code storage with AutoBoot execution and secure OTA update support via OTP and ASP. Use Value: Dual-die addressing enables seamless firmware partitioning (Die 1 = boot image, Die 2 = application + patch), while Grade 2 thermal rating ensures stable operation under hood temperature cycling. |
Use Scenario: Holds real-time control firmware and configuration tables for DIN-rail mounted programmable logic controllers in factory automation. IC Role / Device Role / Timing Role: High-reliability flash memory supporting frequent field updates and long-term data logging without wear-out concerns. Use Value: 100,000-cycle endurance and 20-year retention guarantee firmware integrity over 15+ year product lifecycles in unattended industrial deployments. |
| Medical Imaging System Boot Memory | Avionics Display Unit Code Storage |
|
Use Scenario: Stores certified boot loader and diagnostic firmware for portable ultrasound devices requiring FDA Class II compliance. IC Role / Device Role / Timing Role: Secure, tamper-resistant code storage with OTP-based signature verification and sector-level write protection. Use Value: ASP with password-controlled lock/unlock prevents unauthorized firmware modification during service, satisfying IEC 62304 traceability requirements. |
Use Scenario: Provides certified flight-critical boot code and display rendering firmware for cockpit multifunction displays (MFDs). IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 qualified flash used in DO-254-compliant avionics hardware with deterministic boot timing. Use Value: Quad DDR read at 133 MHz delivers sub-100 ms boot time from cold start, meeting RTCA DO-178C Level A timing constraints. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SPI flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY15B104QN-PSOC | 4 Mbit FRAM; unlimited endurance; no erase latency; 3.3 V only; SOIC-8 | Best for ultra-frequent write logging (e.g., black box event capture), not high-capacity code storage | Select when write cycle count dominates over density; avoid for >128 Mbyte firmware images |
| S25FL128SAGMFI001 | 128 Mbit single-die FL-S flash; same pinout as S70FL01GS but half capacity; BGA-24 ZSA024 | Drop-in replacement if system design uses only one die's address space and does not require dual-die addressing | Choose for cost-sensitive industrial designs where 128 Mbit suffices and AEC-Q100 Grade 2 is not required |
Compared with CY15B104QN-PSOC and S25FL128SAGMFI001, the S70FL01GSAGBHAC13 uniquely delivers 1 Gbit density in automotive-grade BGA-24 with dual-die isolation - enabling fault-tolerant partitioning of boot and application code across physically independent memory arrays.
Availability
S70FL01GSAGBHAC13 is available at Aetrix Electronics and suitable for automotive ADAS ECUs, industrial PLCs, medical imaging boot systems, and avionics display units requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for S70FL01GSAGBHAC13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and manufacturing infrastructure.
The S70FL01GS belongs to Infineon's FL-S SPI flash product line, engineered specifically for automotive and industrial applications demanding high reliability, AEC-Q100 qualification, and advanced security features in compact packages.
FAQ
What is the physical structure of the S70FL01GSAGBHAC13?
The S70FL01GSAGBHAC13 contains two identical S25FL512S flash dies stacked vertically in a single BGA-24 package. Each die operates independently with its own CS#, status registers, and protection logic. There is no internal inter-die bus - communication occurs exclusively via external CS1# and CS2# signals routed from the host controller.
Can the S70FL01GSAGBHAC13 be used as a drop-in replacement for a single-die 1 Gbit SPI flash?
No - it is not a drop-in replacement. The dual-die architecture requires explicit chip-select management: CS1# accesses the lower 512 Mbit (0x00000000–0x07FFFFFF), CS2# accesses the upper 512 Mbit (0x08000000–0x0FFFFFFF). Legacy single-die drivers expecting contiguous 1 Gbit addressing will fail without firmware modification to handle die selection.
Does the S70FL01GSAGBHAC13 support VIO voltage separation?
No. VIO is marked RFU (Reserved for Future Use) in this device. All I/O signaling operates at VCC levels (2.7–3.6 V). The VIO/RFU pin (BGA pin A3) must be left unconnected or tied to VSS per datasheet guidance - it has no functional role in this part.
How is security implemented across the two dies?
Each die maintains independent security registers: OTP array, ASP lock bits, password registers, and PPB access controls. Security settings must be programmed separately per die. To ensure consistent behavior, Infineon recommends mirroring OTP content and ASP configurations across both dies - especially for boot-critical sectors protected by TBPROT and FREEZE bits.
S70FL01GSAGBHAC13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 24-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR (SLC)
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 6.5 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (8x6)
S70FL01GSAGBHAC13 FAQ
1.How can I place an order for S70FL01GSAGBHAC13 through Aetrix?
Please submit a Request for Quotation (RFQ) for S70FL01GSAGBHAC13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S70FL01GSAGBHAC13 reliable?
The price and inventory of S70FL01GSAGBHAC13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70FL01GSAGBHAC13 is usually 5 days.
3.What payment methods are accepted for S70FL01GSAGBHAC13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70FL01GSAGBHAC13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S70FL01GSAGBHAC13?
S70FL01GSAGBHAC13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S70FL01GSAGBHAC13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S70FL01GSAGBHAC13?
For technical support, including S70FL01GSAGBHAC13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70FL01GSAGBHAC13 requirements.
6.How does Aetrix verify that S70FL01GSAGBHAC13 is sourced from the original manufacturer or authorized distributors?
All S70FL01GSAGBHAC13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70FL01GSAGBHAC13 meets industry standards.
7.What is the process for return or replacement of S70FL01GSAGBHAC13?
All S70FL01GSAGBHAC13 units undergo pre-shipment inspection (PSI). If there is an issue with S70FL01GSAGBHAC13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S70FL01GSAGBHAC13 part is unused and in its original packaging.
Return procedure for S70FL01GSAGBHAC13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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